Datasheet

Bosch Sensortec
| BMI088 Data sheet
5 |
48
Modifications reserved | Data subject to change without notice
Document number: BST-BMI088-DS001-1
3
Revision_1.3_05201
8
5.5.9 Register 0x16: INT3_INT4_IO_CONF .................................................................... 30
5.5.10 Register 0x18: INT3_INT4_IO_MAP ...................................................................... 30
5.5.11 Register 0x3C: GYRO_SELF_TEST ...................................................................... 31
6. Digital Interface............................................................................................................................... 32
6.1 Serial Peripheral Interface (SPI) .............................................................................................. 33
6.1.1 SPI interface of gyroscope part .............................................................................. 34
6.1.2 SPI interface of accelerometer part ........................................................................ 34
6.2 Inter-Integrated Circuit (I²C) ..................................................................................................... 35
7. Pin-out and Connection Diagram ................................................................................................. 40
7.1 Pin-out ..................................................................................................................................... 40
7.2 Connection diagram SPI .......................................................................................................... 41
7.3 Connection diagram I
2
C........................................................................................................... 41
8. Package ........................................................................................................................................... 42
8.1 Outline Dimensions ................................................................................................................. 42
8.2 Sensing axes orientation ......................................................................................................... 43
8.3 Marking .................................................................................................................................... 44
8.3.1 Mass production samples ....................................................................................... 44
8.3.2 Engineering samples .............................................................................................. 44
8.4 PCB layout and soldering guidelines ....................................................................................... 44
8.5 Handling instructions ............................................................................................................... 45
8.6 Environmental safety ............................................................................................................... 45
8.6.1 Halogen content ...................................................................................................... 45
9. Legal Disclaimer ............................................................................................................................. 46
9.1 Engineering samples ............................................................................................................... 46
9.2 Product use.............................................................................................................................. 46
9.3 Application examples and hints ............................................................................................... 46
10. Document History and Modification ............................................................................................. 47