Datasheet

Bosch Sensortec
| BMI088 Data sheet
44 |
48
Modifications reserved | Data subject to change without notice
Document number: BST-BMI088-DS001-1
3
Revision_1.3_05201
8
8.3 Marking
8.3.1 Mass production samples
Table 16: Marking of mass production parts
Labeling
Name
Symbol
Remark
Product number
365
3 numeric digits, fixed to identify product
type
Sub-con ID
L
1 alphanumeric digit, variable to identify
sub-con
Date-Code YYWW 4 numeric digits, fixed to identify YY = “year”
WW = “working week
Lot counter
CCCC
4 alphanumeric digits, variable
to generate mass production trace-code
Pin 1 identifier
•
--
8.3.2 Engineering samples
Table 17: Marking of engineering samples
Labeling
Name
Symbol
Remark
Eng. sample ID
N
1 alphanumeric digit, fixed to identify
engineering sample, N = “+” or “e” or “E”
Sample ID
AYYWW
Counter ID
CCCC
4 alphanumeric digits, variable
to generate trace-code
Pin 1 identifier
•
--
8.4 PCB layout and soldering guidelines
The following general layout rules are recommended
• PCB land width = LGA solder pin width
• PCB land length = LGA solder pin length + 0.1 mm on each side
• Solder mask opening width = PCB land width + 0.05 mm on each side
• Solder mask opening length = PCB land length + 0.05 mm on each side
Recommendation about stencil design and solder paste application
• It is recommended to keep the openings of the stencil mask for the signal pads between 70%
and 90% of the PCB pad area.
• An accurate alignment of the stencil and the printed circuit board (within 0.025mm) is
recommended.
• A stencil thickness of 80 – 150 μm is recommended for screen printing
088N
AYYWW
CCCC
365
LYYWW
CCCC