Datasheet

PSoC
®
4: PSoC 4000 Family
Datasheet
Document Number: 001-89638 Rev. *G Page 27 of 34
The center pad on the QFN package should be connected to ground (VSS) for best mechanical, thermal, and electrical performance.
If not connected to ground, it should be electrically floating and not connected to any other signal.
Figure 13. 16-pin QFN Package EPAD (Sawn)
Figure 14. 16-pin (150-mil) SOIC Package Outline
001-87187 *A
Note
16. Dimensions of the QFN package drawings are in inches [millimeters].
51-85068 *E