Datasheet

PSoC
®
4: PSoC 4000 Family
Datasheet
Document Number: 001-89638 Rev. *G Page 25 of 34
Packaging
Table 27. Package List
Spec ID# Package Description
BID#47A 28-Pin SSOP 28-pin 5 × 10 × 1.65mm SSOP with 0.65-mm pitch
BID#26 24-Pin QFN 24-pin 4 × 4 × 0.6 mm QFN with 0.5-mm pitch
BID#33 16-Pin QFN 16-pin 3 × 3 × 0.6 mm QFN with 0.5-mm pitch
BID#40 16-Pin SOIC 16-pin (150 Mil) SOIC
BID#47 8-Pin SOIC 8-pin (150 Mil) SOIC
BID#147A 16-Ball WLCSP 16-Ball 1.47 × 1.58 × 0.4 mm
Table 28. Package Characteristics
Parameter Description Conditions Min Typ Max Units
T
A
Operating ambient temperature –40 25 85 °C
T
J
Operating junction temperature –40 – 100 °C
T
JA
Package θ
JA
(28-pin SSOP) – 66.6 – °C/Watt
T
JC
Package θ
JC
(28-pin SSOP) – 34 – °C/Watt
T
JA
Package θ
JA
(24-pin QFN) – 38 – °C/Watt
T
JC
Package θ
JC
(24-pin QFN) – 5.6 – °C/Watt
T
JA
Package θ
JA
(16-pin QFN) – 49.6 – °C/Watt
T
JC
Package θ
JC
(16-pin QFN) – 5.9 – °C/Watt
T
JA
Package θ
JA
(16-pin SOIC) – 142 – °C/Watt
T
JC
Package θ
JC
(16-pin SOIC) – 49.8 – °C/Watt
T
JA
Package θ
JA
(16-ball WLCSP) – 90 – °C/Watt
T
JC
Package θ
JC
(16-ball WLCSP) – 0.9 – °C/Watt
T
JA
Package θ
JA
(8-pin SOIC) – 198 – °C/Watt
T
JC
Package θ
JC
(8-pin SOIC) – 56.9 – °C/Watt
Table 29. Solder Reflow Peak Temperature
Package
Maximum Peak
Temperature
Maximum Time at Peak Temperature
All 260 °C 30 seconds
Table 30. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-020
Package MSL
All except WLCSP MSL 3
16-ball WLCSP MSL1