Specifications

Table of Contents
3/96 Application Module
X
Service iii
Honeywell Inc.
SECTION 1—INTRODUCTION .................................................................................... 1
1.1 About this Document
Basics.................................................................................................................................... 1
Product description ............................................................................................................... 1
CE compliant hardware......................................................................................................... 1
1.2 References for More Information
SECTION 2—APPLICATION MODULE
X
OVERVIEW ................................................ 3
2.1 A
X
M Functionality
General introduction.............................................................................................................. 3
Supports existing AM functionality ........................................................................................ 3
Functionality diagram............................................................................................................ 4
2.2 Hardware Organization
A
X
M hardware block diagram ............................................................................................... 5
K2LCN hardware version...................................................................................................... 6
HMPU hardware version....................................................................................................... 6
2.3 Board Slot Definition
Overview of chassis types..................................................................................................... 7
Five-slot board placement..................................................................................................... 7
Ten-slot board placement ..................................................................................................... 8
2.4 Power Supply
Introduction ......................................................................................................................... 10
Node power margin restrictions .......................................................................................... 10
Node power supply diagram ............................................................................................... 11
SECTION 3—HARDWARE DESCRIPTION OF LCN NODE PROCESSORS .......... 13
3.1 K2LCN-X Node Processor
Overview ............................................................................................................................. 13
K2LCN indicators ................................................................................................................ 13
Indicator description............................................................................................................ 14
K2LCN pinning.................................................................................................................... 15
3.2 HMPU Processor and Associated Boards
Overview ............................................................................................................................. 16
HMPU indicators ................................................................................................................. 16
Indicator description............................................................................................................ 16
LLCN board functionality..................................................................................................... 18
LLCN board indicators ........................................................................................................ 18
LLCN indicator description.................................................................................................. 18
QMEM-X board ................................................................................................................... 19
QMEM indicators................................................................................................................. 19
QMEM indicator description................................................................................................ 19
3.3 CLCN A/B I/O (or LCN I/O) Board
Overview ............................................................................................................................. 21
LCN address pinning........................................................................................................... 21
LCN cable connections ....................................................................................................... 22