User Manual

Constellation.2 Serial ATA Product Manual, Rev. G 31
3.5 Cooling
Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding the
drive will not exceed temperature conditions specified in Section 2.9.1, "Temperature."
The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and head and
disc assembly (HDA). You should confirm that adequate heat removal is provided using the temperature measure-
ment guidelines described in Section 2.9.1.
Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 2.9.1 in which
case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is created while
providing air flow to the electronics and HDA. Also, the shortest possible path between the air inlet and exit should be
chosen to minimize the travel length of air heated by the drive and other heat sources within the rack, cabinet, or
drawer environment.
If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 7, page 31. The air-flow pat-
terns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction, convec-
tion, or other forced air-flow patterns are acceptable as long as the temperature measurement guidelines of Section
2.9.1 are met.
Figure 7. Air flow
Above unit
Under unit
Note. Air flows in the direction shown (back to front)
or in reverse direction (front to back)
Above unit
Under unit
Note. Air flows in the direction shown or
in reverse direction (side to side)