User Manual

SECTION B
A. Wireless Charging Smartphones (with Case)
,Phone 11 / Pixel 4 and Newer (Case required*)
*Manufacturing mater i al s do not allow adhe s ives to bond
directly to the device .
B. Wireless Charging Smartphones (without Case**)
** It 1s recommended to use the Protective Film. If the MagicP late needs
to be removed, the film simplifies the process To remove the MagicPlate
use a credit card and slide in between the film and MagicPlate. Do NOT use
anything sharp/hard as this can damage the dev ic e.
A. T~iet1no1:es mtellinents co11r,at
1
o!es a•:ec 1a recharue sa'ls 111 (avec t>tu:)
J • .,
~~on"
11
r Pixel 4 et ve
1
s1ors u :er-eures (stu, 'eq1 s•)
*Les materiaux de fabrication ne permettent pas a l'adhesif d'adherer
directement sur l'appareil
B. Telephones 1me:ngents con·patib1ps avec la recha"Je sans f: (sars etui "" )
~ • · • ti~1 ·ecorr,mande d .it,liSi.:r a ;ie,l!cule proti:ctute Si la Mag cPlt~ dort ~tr~ re'ir;,e, la
De!h,,le s1rnphiiera le pr"cessu~ Pc,t.r en!~erla Mag!~Plati:, ut,:s.:r u ne carte de credit
et la gll55t'r entre la pe!licule et la \-lag1crlate NE FAS util/er q~o oue er: s::JJt Cu sera·:
'rardHntlrJv. car (r.!a pcm endorrm,1,Je' ~pparl'!ii.
A. Telefonos iritehqentes de c;irqa inalar;brica (con estuche)
iPhorP 11
1
P,xel ,1 y posterior (rt•quier-"r estu(~ ... )
*Los materiales de fabricaci6n no permiten que los adhesivos se adhieran
directamente al dispositivo.
B. le•efo1os 1r:e11gentes de carga ,:,a,.imLrica (sin eshJCheh)
0
le recornt'Jll.iamos u:/ rn i;, ;iel:c'Jla protectord. Si es recesaro rem,;l'e: el
Mag1c?l~te, I~ peltcu!a s,rnp
1
tca el :l'oces:, PJra 'e.,.,cver e• M~gicP';,tf. use u"a
tarjCia de uedito y desllcela entr~ la pel1cula ! e Mdg:cP ati> NO uSt> ra1Ja fii~ldum
y:j que pod11a dniiar el d:spVi1fr1.1
5
/
rs
Case r f tw I f sruche
8
Mag 1cPlate
/2
Device
Protei:t,ve Film·"
Petk:ul r Aeltr,rf
Oe"~1J'a nrc•r,:t.1ra
Mag icPlate