Datasheet

4
Thermofuses
RTS
https://www.schurter.com /PG22
Circuit Protection
Derating Curves
Derating Curve without Shunt
Operating current [A]
-40 0 40 80 120 160 200 240
160
120
0
40
80
Allowable Ambient Temperature
1.) 70 µm Single-Layer
2.) 140 µm Single-Layer
3.) 210 µm Single-Layer
Tripping Temperature >210°C
1.)
2.)
3.)
Ambient Temperature [°C]
Derating Curve with Shunt
Operating current [A]
-40 0 40 80 120 160 200 240
160
120
0
40
80
1.)
2.)
3.)
Allowable Ambient Temperature
1.) 70 µm Single-Layer
2.) 140 µm Single-Layer
3.) 210 µm Single-Layer
Tripping Temperature >210°C
Ambient Temperature [°C]
Temperature Uniformity of Resistance
Deviation of resistance [%]
70
50
30
10
-10
-30
-40 -10 20 50 80 110 150
Shunt
Without Shunt
Ambient Temperature [°C]
Design-In Principles
> The RTS should be placed as close as possible to the heat
source (power semiconductor).
> Max. nominal current depends on ambient temperature and on
the PCB track implementation (see Derating Curves).
> The derating curves were generated using a PCB acc. to
IEC 60127-4 with a layer width of 20 mm.
> If operating current is higher than allowed, consider using two
RTS in parallel. This doubles the max. current value in the
derating curve.
All Variants
Variant Code Shunt Cold Resistance [µ] Packaging unit [PCS] Order Number
RTS-AC100 90 - 110 100 3-104-513
RTS-AC100 90 - 110 750 3-104-514
RTS-AS500
l
500 - 580 100 3-119-589
RTS-AS500
l
500 - 580 750 3-119-590
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Breaking Capacity: 400 A @ 24 VDC (> 18 μH) / 200 A @ 50 VDC (> 27 μH) / 170 A @ 60 VDC (> 32 μH)
Packaging Unit
Blister Tape 33 cm Reel in ESD Plastic Bag
The specifications, descriptions and illustrations indicated in this document are based on current
information. All content is subject to modifications and amendments. Information furnished is believed
to be accurate and reliable. However, users should independently evaluate the suitability and test each
product selected for their own applications.
20.03.2019