Product data

18
Architectures
Modicon
™
Quantum
™
Ethernet I/O
automation platform
ConneXium
™
managed switches
Example topologies
ConneXium
™
managed switches (continued)
Predened conguration les (continued)
Example topology with predened conguration le C1 (1)
One of the main advantages of Quantum
™
Ethernet I/O is the ability to connect the Ethernet RIO remote drops in
a secondary ring. These I/O are controlled by the PLC in the same way as those connected on the primary ring.
This type of architecture makes it possible to increase the distance between remote I/O drops while isolating the
devices located on a secondary ring from those on the primary ring.
C1
3
1
2
2
2
1
5
5
4
6 6 6
7
7
7
9
8
Ethernet link,
copper medium
(2)
Primary ring, copper medium1
Ethernet RIO secondary ring, copper medium 2
Ethernet head adaptor 140CRP31200 installed in the Quantum rack3
ConneXium switch TCSESM083F23F1 with predened conguration le C14
Ethernet drop adaptor 140CRA31200 installed in each Ethernet RIO drop 5 (3).
Connection to Ethernet DIO device cloud, copper medium6
Ethernet DIO device cloud 7 (4)
Ethernet communication module 140NOE7718 pp (2)
Ethernet Interlink cable TCSECN3M3M1S4/1S4U (1 m) 9 (2)
Example topology with predened conguration le C2 (1)
With Quantum Ethernet I/O, the Ethernet DIO can be installed to make use of daisy chain loop architecture. The
use of dedicated ConneXium managed switches specic to the predened congurations means that Ethernet
DIO device clouds can be connected to a secondary ring that will restore communication in under 50 ms in the
event of a cable break or a module becomes inoperative.
Note: ConneXium switches apply a low priority to exchanges with Ethernet DIO devices, thus allowing deterministic data
exchanges between the PLC and the Ethernet RIO.
Ethernet link,
copper medium
C2
3
1
2
2
2
1
4
5 5
6 6 6
7
7
7
9
8
Primary ring, copper medium1
Ethernet DIO secondary ring, copper medium 2
Ethernet head adaptor 140CRP31200 installed in the Quantum rack3
ConneXium switch TCSESM083F23F1 with predened conguration le C24
Modicon STB Ethernet DIO 5 (4) (5)
Connection to Ethernet DIO device cloud, copper medium6
Ethernet DIO device cloud 7 (4)
Ethernet communication module 140NOE7718 pp
Ethernet Interlink cable TCSECN3M3M1S4/1S4U (1 m)9
(1) Non-exhaustive example. For additional specications, see our website www.schneider-electric.com.
(2) The Ethernet communication module 8 and Ethernet Interlink cable 9 are only required if there are Ethernet DIO devices in the
architecture.
(3) Each Ethernet RIO drop can comprise a primary and a secondary rack.
(4) Requires the Ethernet communication module 8 and Ethernet Interlink cable 9.
(5) Please refer to the “Modicon
™
STB IP 20 distributed I/O” catalog.