Data Sheet
Table Of Contents
- FEATURES
- SOFTWARE FEATURES
- APPLICATIONS
- CC2541 WITH TPS62730
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- ELECTRICAL CHARACTERISTICS
- GENERAL CHARACTERISTICS
- RF RECEIVE SECTION
- RF TRANSMIT SECTION
- CURRENT CONSUMPTION WITH TPS62730
- 32-MHz CRYSTAL OSCILLATOR
- 32.768-kHz CRYSTAL OSCILLATOR
- 32-kHz RC OSCILLATOR
- 16-MHz RC OSCILLATOR
- RSSI CHARACTERISTICS
- FREQUENCY SYNTHESIZER CHARACTERISTICS
- ANALOG TEMPERATURE SENSOR
- COMPARATOR CHARACTERISTICS
- ADC CHARACTERISTICS
- CONTROL INPUT AC CHARACTERISTICS
- SPI AC CHARACTERISTICS
- DEBUG INTERFACE AC CHARACTERISTICS
- TIMER INPUTS AC CHARACTERISTICS
- DC CHARACTERISTICS
- DEVICE INFORMATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- References
- Additional Information
- Revision History
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EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
40X (0.25)
40X (0.6)
( 0.2) TYP
VIA
36X (0.5)
(5.8)
(5.8)
( 4.5)
(R0.05)
TYP
4X
(1.46)
4X
(1.27)
(0.73) TYP
4X (1.27)
(0.73)
TYP
4X (1.46)
VQFN - 1 mm max heightRHA0040H
PLASTIC QUAD FLATPACK - NO LEAD
4219055/B 08/22/2019
SYMM
1
10
11
20
21
30
31
40
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
41
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL