Specifications
PR 5220 Operating Manual Contents
Sartorius 5
7 Fieldbus Interface ..........................................................................................................................................................78
7.1 Fieldbus Interface Protocol...........................................................................................................................................78
7.1.1 Write Window (Input Area) 79
7.1.2 Read Window (Output Area) 79
7.1.3 Reading and Writing Data 79
7.2 Description of the I/O Area (Read / Write Window)...................................................................................................80
7.2.1 Input Area 80
7.2.2 Output Area 81
7.2.3 Reading and Writing Register via Fieldbus 82
7.2.4 Example: Reading the Gross Weight 84
7.3 Feldbus Register.............................................................................................................................................................85
7.3.1 Register 0: I/O Status Bits for Reading 85
7.3.2 Register 1: Scale Status 85
7.3.3 Register 2: State of State-Controlled Action Bits 86
7.3.4 Register 3: State of Edge-Controlled Action Bits 86
7.3.5 Register 4: Calibration Information, Error Byte 86
7.3.6 Register 5: Device Type and Software Release 87
7.3.7 Register 6: Board Number 87
7.3.8 Register 7: (Reserved) 87
7.3.9 Register 8 ...15: Weight Data 87
7.3.10 Register 22 ... 27: Limit Values (Read/Write) 87
7.3.11 Register 30, 31: Fixed Values (Read/Write) 88
7.3.12 Register 80 ... 89: State-Controlled Action Bits (Write) 88
8 Global SPM Variables ....................................................................................................................................................89
9 Configuration Print-Out ...............................................................................................................................................91
10 Repairs and Maintenance ...................................................................................................................................92
10.1 Solder Work....................................................................................................................................................................92
10.2 Cleaning..........................................................................................................................................................................92
11 Disposal................................................................................................................................................................92
12 Specifications ......................................................................................................................................................93
12.1 Instructions for Use of 'Free Software'........................................................................................................................93
12.2 General Data...................................................................................................................................................................94
12.2.1 Power Supply 94
12.3 Effect of Ambient Conditions.......................................................................................................................................94
12.3.1 Environmental Conditions 94
12.3.2 Electromagnetic Compatibility (EMC) 94
12.3.3 RF Interference Suppression 94
12.4 Weighing Electronics.....................................................................................................................................................95
12.4.1 Load Cells 95
12.4.2 Principle 95
12.4.3 Accuracy and Stability 95
12.4.4 Sensitivity 95
12.5 Mechanical Data ............................................................................................................................................................96
12.5.1 Construction 96
12.5.2 Dimensions 96
12.5.3 Weight 96
12.6 Use in Legal-for-Trade Mode .......................................................................................................................................96
12.6.1 Documentation for Verification on the Enclosed CD 96
12.6.2 Additional Instructions 96
13 Index ....................................................................................................................................................................97