User Manual

ManualsBrandsSanDisk ManualsCompactFlash Cards256 MB Secure Digital Card (Retail Package)

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Table of Contents

1. Introduction to the TriFlash with SD Interface .................................................................................................. 1-1

1.1. Scope................................................................................................................................................. 1-2

1.2. Product Models ................................................................................................................................. 1-2

1.3. System Features................................................................................................................................. 1-2

1.4. SD Memory Card Standard ............................................................................................................... 1-3

1.5. Functional Description ...................................................................................................................... 1-3

1.5.1. Flash Technology Independence............................................................................................. 1-4

1.5.2. Defect and Error Management................................................................................................ 1-4

1.5.3. Endurance ............................................................................................................................... 1-4

1.5.4. Wear Leveling......................................................................................................................... 1-4

1.5.5. Using the Erase Command...................................................................................................... 1-5

1.5.6. Automatic Sleep Mode............................................................................................................ 1-5

1.5.7. TriFlash—SD Bus Mode ........................................................................................................ 1-5

1.5.7.1. TriFlash Standard Compliance .............................................................................. 1-5

1.5.7.2. Negotiating Operation Conditions ......................................................................... 1-5

1.5.7.3. Device Acquisition and Identification ................................................................... 1-5

1.5.7.4. Device Status ......................................................................................................... 1-6

1.5.7.5. Memory Array Partitioning.................................................................................... 1-6

1.5.7.6. Read and Write Operations.................................................................................... 1-8

1.5.7.7. Data Transfer Rate................................................................................................. 1-9

1.5.7.8. Data Protection ...................................................................................................... 1-9

1.5.7.9. Erase ...................................................................................................................... 1-9

1.5.7.10. Write Protection................................................................................................... 1-9

1.5.7.11. Optional Copyright Protection............................................................................. 1-9

1.5.7.12. Copy Bit............................................................................................................... 1-10

1.5.7.13. The CSD Register ................................................................................................ 1-10

1.5.8. TriFlash—SPI Mode ............................................................................................................... 1-10

1.5.8.1. Negotiating Operating Conditions ......................................................................... 1-10

1.5.8.2. Card Acquisition and Identification....................................................................... 1-10

1.5.8.3. Card Status............................................................................................................. 1-10

1.5.8.4. Memory Array Partitioning.................................................................................... 1-10

1.5.8.5. Read and Write Operations.................................................................................... 1-11

1.5.8.6. Data Transfer Rate................................................................................................. 1-11

1.5.8.7. Data Protection in the TriFlash.............................................................................. 1-11

1.5.8.8. Erase ...................................................................................................................... 1-11

1.5.8.9. Write Protection..................................................................................................... 1-11

2. Product Specifications ........................................................................................................................................ 2-1

2.1. System Environmental Specifications............................................................................................... 2-1

2.2. Typical Power Requirements ............................................................................................................ 2-1

2.3. System Performance.......................................................................................................................... 2-2

2.4. System Reliability and Maintenance................................................................................................. 2-2

2.5. Physical Specifications...................................................................................................................... 2-3

3. TriFlash Interface Description............................................................................................................................ 3-1

3.1. General Description of Pins and Registers........................................................................................ 3-1

3.1.1. Pin Assignments in SD Bus Mode.......................................................................................... 3-1

3.1.2. Pin Assignments in SPI Mode................................................................................................. 3-2

3.1.3. Registers.................................................................................................................................. 3-2

3.2. SD Bus Topology.............................................................................................................................. 3-3

3.3. SPI Bus Topology ............................................................................................................................. 3-5

3.4. Electrical Interface ............................................................................................................................ 3-6

3.4.1. Power-up ................................................................................................................................. 3-6