User Manual
Product Specifications
TriFlash with SD Interface Product Manual (Preliminary), Rev. 1.2 © 2002/2003 SANDISK CORPORATION
2-3
2.5. Physical Specifications
The SanDisk TriFlash is a 44- and 56-pin Thin Fine-Pitched Ball Grid Array (TFBGA). See Figure 2-1 (56-pin) and
Figure 2-2 (44-pin) for the physical specifications and dimensions. See Figure 2-3 for a top view of the pin
definitions.
Dimension in mm Dimension in inch
Symbol MIN NOM MAX Min NOM MAX
A --- --- 1.10 --- --- 0.043
A1 0.32 0.35 0.38 0.013 0.014 0.015
A2 0.62 0.67 0.72 0.024 0.026 0.028
D 17.90 18.00 18.10 0.705 0.709 0.713
E 11.90 12.00 12.10 0.469 0.472 0.476
D1 --- 7.00 --- --- 0.276 ---
D2 --- 11.00 --- --- 0.433 ---
D3 --- 13.00 --- --- 0.512 ---
E1 --- 7.00 --- --- 0.276 ---
e --- 1.00 --- --- 0.039 ---
b 0.40 0.45 0.50 0.016 0.018 0.020
aaa 0.10 0.004
bbb 0.10 0.004
ddd 0.15 0.006
eee 0.25 0.010
fff 0.10 0.004
MD/ME 12/11 12/11
O fff M
NOTE:
1. Controlling Dimension: Millimeter.
2. Primary Datum C and seating plane are defined by the
spherical crowns of the solder balls.
3. Dimensions b is measured at the maximum solder ball
diameter, parallel to Primary Datum C.
4. There shall be a minimum clearance of 0.25mm between
the edge of the solder ball and the body edge.
5. Reference document: JEDEC MO-205.
6. The pattern of Pin 1 Fiducial is for reference only.
7. All numbers are in mm.
8. All numbers are typical unless otherwise stated.
1
2
3
A B
(NOTE 3)
(NOTE 6)
A1
DETAIL: B
DETAIL: A
1
2
3
4
5
6
7
8
ABCDEFGH
E1
D1
D3
D2
Cavity
Seating Plane
Solder Ball
(NOTE 2)
"A"
"B"
E
D
e
B
A
A2
A1
A
C
bbb C
ddd C
C A B
C
Oeee M
b
aaa
aaa
Non-functional
balls (12 places)
Figure 2-1. TriFlash Physical Specifications—18 X 12mm Package