Specifications

PIC16F8X

 1998 Microchip Technology Inc. DS30430C-page 109

13.0 PACKAGING INFORMATION

13.1 Package Marking Information

Legend: XX...X Microchip part number & customer speciﬁc information*

AA Year code (last two digits of calendar year)

BB Week code (week of January 1 is week ‘01’)

C Facility code of the plant at which wafer is manufactured

C = Chandler, Arizona, U.S.A.,

S = Tempe, Arizona, U.S.A.

D Mask revision number

E Assembly code of the plant or country of origin in which

part was assembled

Note: In the event the full Microchip part number cannot be marked on one line,

it will be carried over to the next line, thus limiting the number of available

characters for customer speciﬁc information.

* Standard OTP marking consists of Microchip part number, year code, week

code, facility code, mask rev# and assembly code. For OTP marking beyond

this, certain price adders apply. Please check with your Microchip Sales Ofﬁce.

For QTP devices, any special marking adders are included in QTP price.

18L PDIP

XXXXXXXXXXXXXXXXX

AABBCDE

XXXXXXXXXXXX

18L SOIC

Example

PIC16F84-04I/P

9632SAW

XXXXXXXXXXXX

9648SAN

/SO

PIC16F84-04

Example