Technical data

MCIMX31C/MCIMX31LC Technical Data, Rev. 4.3
100 Freescale Semiconductor
Package Information and Pinout
5.1 MAPBGA Production Package 473 19 x 19 mm, 0.8 mm Pitch
This section contains the outline drawing, signal assignment map, and MAPBGA ground/power ID by ball
grid location for the 473 19 x 19 mm, 0.8 mm pitch package.
5.1.1 Production Package Outline Drawing–19 x 19 mm 0.8 mm
Figure 85. Production Package: Case 1931—0.8 mm Pitch