GSM TELEPHONE SGH-U700 GSM TELEPHONE CONTENTS 1. Specification 2. Exploded View and Parts list 3. Chart of Troubleshooting 4. Array course control 5. Block Diagrams 6. PCB Diagrams 7. MAIN Electrical Parts List 8. Reference data 9. Safety Precautions 10.
Contents 1. Specification 1-1. GSM/CDMA General Specification ...........................................................................1-1 1-2. GSM TX power class ...............................................................................................1-2 2. Exploded View and Parts list 2-1. Cellular phone Exploded View ..................................................................................2-1 2-2. Cellular phone Parts list .................................................................
Contents 4. Array course control 4-1. Downloading Binary Files ......................................................................................4-2 4-2. Pre-requsite for Downloading ................................................................................4-2 4-3. S/W Downloader Program .....................................................................................4-3 5. Block Diagrams 6. PCB Diagrams 7. MAIN Electrical Parts List 8. Reference data 8-1. Reference Abbreviate ................
1. Specification 1-1. GSM/WCDMA General Specification EG SM 900 Phase 2 DCS18 00 Ph ase 1 PCS1900 WCDM A Fr eq. Band[ MHz] Uplink/Downlink 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1990 1920~1980 2110~2170 ARFCN r ange 0~124 & 975~1023 512~885 512~810 10562~10838 Tx/ Rx sp acing 45 MHz 95 MHz 80 MHz 190 MHz Mod. Bit rat e/ Bit Per iod 270.833 kbps 3.692 us 270.833 kbps 3.692 us 270.833 kbps 3.692 us 3.84 Mcps/s T im e S lot Per iod/ Fra me Period 576.9 us 4.615 ms 576.
Specification 1-2.
2. Exploded View and Parts List 2-1.
Exploded View and Parts List 2-2.
Exploded View and Parts List Discription SEC CODE BAG PE 6902-000634 CBF INTERFACE-DATA LINK CABLE GH39-00444B ADAPTOR-SGHE690,SIL,EU,A_TYPE GH44-01361B S/W CD-SGHU700 PC STUDIO 3.
Exploded View and Parts List 2-3. Disassembly 2 1 Use the disjointing hole 1) Detach a RF sheet and unscrew the 6 points. 2) Separate the REAR from the FRONT ass'y using ※ Caution 1) Disjoin the connectors from the PBA. ※ Caution 1) Be care of scratch and molding damage. 1) Be care of scratch and molding damage. 2) Be care of damage to the FPCBs. assembly stick. 3 4 Disjoint the MIC 1) Disjoin the tape in the red box. 2) Disjoin the MIC. 3) ※ 1) 2) Disjoin the shield can and key pad.
Exploded View and Parts List 5 6 1) Disassemble the slide lower into the slide upper. (follow an arrow). Disassemble the slide FPCB into hole of slide 2) 1) Disassemble the UPPER by using a assembly stick. ※ Caution 1) Be care of scratch and molding damage. lower. ※ Caution 1) Be care of scratch and molding damage. 7 8 Separate a camera module from the UPPER using a tweezer. 1) Separate a camera module from the UPPER. 2) Separate a camera FPCB from LCD module.
Exploded View and Parts List 9 1)Take the LCD out. ※ Caution 1) Be care of scratch and molding damage. 1) Be care of damage to camera FPCB..
Exploded View and Parts List 2-4. Assembly 1 2 1)Solder speaker/motor module to the pad of camera module. 1) Assemble the power key and LED into the speaker module. ※ Caution 1) Be care of damage to the F-PCB of speaker module 2) Keep the orders. ※ Caution 1) Be care of damage to the F-PCBs. 3 4 1)Attach the tapes to the designated 2 points. ※ Caution 1) Be care of scratch and molding damage. 2) White holder should not be attatched on the 1)Check the external damage of LCD module.
Exploded View and Parts List 5 6 1) Assemble the slide FPCB into the LCD module. 2) Solder the side pads of slide FPCB. ※ Caution 1) Be care of damage to F-PCB of slide. 2) Be care of solder longer than 3 seconds. 1)Attach the tape to the designated point. ※ Caution 1) Be care of scratch and molding damage. 7 8 1) Place the LCD module like the picture. 2) Attach the touch FPCB to the designated point. 1)Check the external damage of slide upper.
Exploded View and Parts List 9 10 1) Assemble the camera module into the LCD module. 1)Attach the copper tape to the designated point. ※ Caution 1) Be care of damage to the LCD module. ※ Caution 11 12 1) Be care of scratch and molding damage. 1) Assemble the slide FPCB into hole of slide 1)Attach tapes to the designated point. ※ Caution lower. 2) Assemble the slide lower into the slide 1) Be care of scratch and molding damage. 2) Green tape should not be attatched in the red box. upper.
Exploded View and Parts List 13 < 1 > < 3 > < 4 > < 2 > 14 1)Attach the key-PCB on shield can. ※ Caution 1) ※ 1) 2) Screw down 4 points in the red circle. Caution Be care of scratch and molding damage. Screw down 4 points according to priority. 15 1) Be care of damage to the F-PCBs. 2) Please keep the three guide holes attaching key F-PCB. 16 1)Assemble the shield can on the keypad. 1)Assemble the keypad on the front. ※ Caution ※ Caution 1) Be care of scratch and molding damage.
Exploded View and Parts List 18 17 1) Assemble the PBA to the assembly. 2) Assemble the key connector. 1)Attach the tapes to the designated point. ※ Caution ※ Caution 1) Be care of scratch and molding damage of the 2) Be care of scratch and molding damage of the 1) Be care of scratch and molding damage. connector. connectors.. 19 20 3 1 6 5 2 4 1) Check the camera key and volume key. 1) Screw down 6 points in the red circle. 2) Assemble the rear on slide assembly.
3. Flow Chart of Troubleshooting 3-1.Baseband 3-1-1. Power ON 'Power On' does not work Check the current consumption Yes Current consumption >= 100mA No Download again Yes Check the Vbat Voltage Voltage >=3.3V No Charge the Battery Yes The pin 3 of D502 is high? No Check D502 Yes check the PMIC output voltage (R505, R506, R512, R513, R524) No check the PMIC Yes check the TCX101 19.
Flow Chart of Troubleshooting MIC_BIAS_2.85V VREG_USIM_3.0V VREG_MSMC_1.2V VREG_MSME_1.8V R508 VREG_MSMP_2.6V R509 R505 VSW_5V VREG_5V VSW_PA VREG_PA VSW_MSMC VREG_MSMC VSW_MSME VREG_MSME VREG_USB VREG_MMC VREG_RUIM VREG_MSMP VREG_MSMA VREG_WLAN VREG_RFRX2 VREG_RFRX1 VREG_RFTX VREG_SYNT VREG_TCXO REF_ISET REF_BYP REF_GND 14 12 27 28 31 32 37 36 10 39 42 50 56 64 67 69 73 81 84 61 63 62 R506 VREG_MSMA_2.
Flow Chart of Troubleshooting 3-3 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 3-1-2. Initial Initial Failure Yes The pin #9 of PMIC "LOW --> High"? No Check the PMIC (use D302 pin) Yes check the sleep x-tal at C514, No C513 Check the OSC501 (if it has some problem, it is to be replaced.) Yes check the clock signal at No R515 check the clock generation circuit related to PMIC and OSC501 Yes LCD display is O.K No Check the LCD part Yes Sound is O.
Flow Chart of Troubleshooting OSC501 2 C511 C514 SLEEP_XTAL_IN TCXO TCXO_EN TCXO_OUT VF 1 C513 C562 R516 AMUX_OUT REF_OUT USB_OE_N USB_DAT USB_SE0 1 44 46 45 58 55 53 70 72 82 80 13 USB_OE_N 17 USB_DAT 19 USB_SE0 3-5 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization ADC_BYP XTAL_IN XTAL_OUT SLEEP_CLK TCXO_IN TCXO_EN TCXO_OUT AMUX_IN1 AMUX_IN2 AMUX_OUT REF_OUT PMIC500
Flow Chart of Troubleshooting 3-1-3. Sim Part "Insert SIM is displayed on the LCD Yes Check the SIM connector's (SIM501) connection to SIM card No Resolder or change SIM501 Yes Check the voltage at pin#1 of SIM501 >= 3.
Flow Chart of Troubleshooting VREG_USIM_3.
Flow Chart of Troubleshooting 3-1-4. Microphone Part Microphone does not work Yes Is the assembled status of Key FPCB O.K? No Reassemble the Key FPCB Yes Is the DC bias voltage on Mic path at R601 2.
Flow Chart of Troubleshooting HDC703 1 3 5 7 9 11 VR705 VR704 13 15 VR710 VR709 VR708 VR707 VREG_MSMP_2.6V KEY_LED_3.3V KEY_3 KEY_2 KEY_1 KEY_0 R703 VR703 1 3 5 7 9 11 13 15 VR701 2 4 6 8 10 12 14 14 16 16 VR702 SCAN_6 SCAN_5 SCAN_4 SCAN_3 HALL_SW MIC1P_F MIC1N_F 18 NC NC 17 2 4 6 8 10 12 MIC_BIAS_2.
Flow Chart of Troubleshooting 3-1-5.
Flow Chart of Troubleshooting VBAT R619 C629 U602 10 VOICE_OUT_P R620 1B0 2 SPK+ VOICE_OUT_N VCC 1 2B0 4 SPK- 9 SPK_P_CON 1S 8 1B1 3 R622 1A 2B1 2S 7 AUD_SW_EN 6 SPK_N_CON 2A GND C632 5 VBAT C633 C634 A2 B1 VDD A1 C1 MSM_EAR_L C639 VIP VIM R625 VSS U601 C2 EN B 2 PVDD NC R628 L603 VOM A3 PVSS B3 VOP C3 SPK+ NC R626 C645 SPK- L604 1 2 C644 C640 R629 AMP_EN R631 EAR_AMP_L R627 R630 R632 C637 3-11 SAMSUNG Proprietary-Contents may change without notic
Flow Chart of Troubleshooting 3-12 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 3-2.RF 3-2-1.
Flow Chart of Troubleshooting 3-2-2.
Flow Chart of Troubleshooting 3-2-3.
Flow Chart of Troubleshooting ⑤ ③ ④ ⑦ ② ① 3-15 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization ⑥
Flow Chart of Troubleshooting 3-2-4. GSM Tx Tx On Tx Level : 5 No Nomal Condition Catch The Channel Check soldered status of ANT, R127, C101, C104 1 Yes Check and change RFS101 2 Yes Check soldered status of Yes RFS101 Pin #3 ≥ 30dBm ? No PAM101 pin #8 ≥ 30dBm ? C100, L100 3 Check and change U301 4 Check and change PAM101 5 Check PAM101, VBAT 6 No No PAM101 pin #1,28 : Low pin # 27 : High Yes Yes PAM101 pin #25 : 1.2V ? No PAM101 pin #26 ≥ 3.
Flow Chart of Troubleshooting 3-2-5. DCS Tx Tx On Tx Level : 0 No Nomal Condition Catch The Channel Check soldered status of ANT, R127, C101, C104 1 Yes Check and change RFS101 2 Yes Check soldered status of Yes RFS101 Pin #3 ≥ 30dBm ? No PAM101 pin #8 ≥ 30dBm ? C100, L100 3 Check and change U301 4 Check and change PAM101 5 Check PAM101, VBAT 6 No No PAM101 pin #1 : Low pin # 27,28 : High Yes Yes PAM101 pin #25 : 1.2V ? No PAM101 pin #26 ≥ 3.
Flow Chart of Troubleshooting 3-2-6. PCS Tx Tx On Tx Level : 0 No Nomal Condition Catch The Channel Check soldered status of ANT, R127, C101, C104 1 Yes Check and change RFS101 2 Yes Check soldered status of Yes RFS101 Pin #3 ≥ 30dBm ? No PAM101 pin #8 ≥ 30dBm ? C100, L100 3 Check and change U301 4 Check and change PAM101 5 Check PAM101, VBAT 6 No No PAM101 pin #1 : Low pin # 27,28 : High Yes Yes PAM101 pin #25 : 1.2V ? No PAM101 pin #26 ≥ 3.
Flow Chart of Troubleshooting 5 7 6 3 2 1 4 3-19 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 3-2-7.
Flow Chart of Troubleshooting ⑤ ③ ④ ⑦ ⑥ ② ① 3-21 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 3-2-8. UMTS Tx Tx On RF Input : 9750CH Tx Power : 24dBm No Nomal Condition Catch The Channel Check soldered status of 1 Yes Check and change RFS101 2 Yes Check soldered status of ANT, R127, C101, C104 Yes RFS101 Pin #3 ≥ 20dBm ? No PAM101 pin #8 ≥ 20dBm ? C100, L100 3 Check and change U301 4 Check PAM101, VBAT 5 Check PAM101, C143 6 No No PAM101 pin #1,27 : Low pin # 28 : High Yes PAM101 pin #26 ≥ 3.
Flow Chart of Troubleshooting 7 8 5 6 3 2 1 4 3-23 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
GSM_TX DCS1800_PCS1900_TX R105 R104 R101 R100 PA_ON PA_RANGE0 PA_RANGE1 UMTS_TX R106 R102 OUT 5 C132 1 IN C130 2 35 G GG OUT F103 VC 7 GG GG G 2 3 4 68 1 IN F107 4 C131 C117 C111 This Document can not be used without Samsung's authorization GND 11 5 VENA 4 VMODE1 GND 7 6 GND 3 VMODE2 RFOUT 8 GND VCC PAM102 C110 1 VBATT 2 RFIN GSM_PA_PWR_CTL GSM_ANT_SEL1_N GSM_ANT_SEL0_N UMTS_ANT 9 10 VBAT R107 C108 BS1 BS2 GSM_IN DCS|PCS_IN WCDMA1 VBATT 29 GND 28 27 23
4.
Array course control Software Downloading 4-1. Downloading Binary Files • BOOTFILES folder and four binary files for downloading U700. – BOOTFILES : Directory of boot files. – amss_compressed.bin : Main source code binary. – Rsrc_U700_xxx.rc1 : Resource 1. – Rsrc2_U700xxx(Low).rc2 : Resource 2. – FactoryFs_U700_xxx.ffs 4-2. Pre-requsite for Downloading • Downloader Program(MultiLoader xxx.exe) • U700 Mobile Phone • Data Cable • Binary files 4-3.
Array course control 1. Load the binary download program by executing the “MultiLoader xxx.exe” 2. Click the "MSM6245/MSM6260" 3. Click the “Full Download” -> “Boot” Set the directory path and choose latest BOOTFILES folder for the downloader binary setting. 4. Press the “Modem” -> “amss_compressed.bin” Set the directory path and choose latest amss_compressed.bin file for the 5-3 downloader binary setting.
Array course control 5. Press the “Rsrc1” -> “Rsrc_U700_xxx.rc1” Set the directory path and choose latest Rsrc_U700_xxx.rc1 file for the downloader binary setting. 6. Press the “Rsrc2” -> “Rsrc2_U700xxx(Low).rc2” Set the directory path and choose latest Rsrc2_U700xxx(Low).rc2 file for the downloader binary setting. 7. Press the “Factory FS” -> “FactoryFs_U700_xxx.ffs” Set the directory path and choose latest FactoryFs_U700_xxx.ffs file for the downloader binary setting. 8.
Array course control 11. Confirm the downloaded version name and etc.
5. Block Diagrams 5-1.
6. PCB Diagrams JTAG700 VR704 Q502 MSMP_2.
PCB Diagrams SOC301 CE F403F402F401 BTC500 I2C_SDA U703 D301 D302 U604 UME201 U301 U704 ZD605 ZD604 BT101 VR712 H D C 701 OSC301 Q302 VR711 U 603 U505 ZD603 IFC601 VR713 U601 V_DN G2 CAM VSYHCHSYNC I2C_SCL V501 F404F405 U303 VR401 U701 VR402 BAT500 MODE1 U5 06 V_UP U404 WE GND_J VR403 G4 D_J D+J U 602 JIG_J TXD_J RXD_J USB_5V_J HDC401 VBAT_J U302 6-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's autho
7.
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 1405-001133 VR704 VARISTOR SA 1405-001133 VR705 VARISTOR SA 1405-001133 VR707 VARISTOR SA 1405-001133 VR708 VARISTOR SA 1405-001133 VR709 VARISTOR SA 1405-001133 VR710 VARISTOR SA 1405-001133 VR713 VARISTOR SA 1405-001177 VR403 VARISTOR SA 1405-001177 VR711 VARISTOR SA 1405-001177 VR712 VARISTOR SA 2007-000141 R617 R-CHIP SA 2007-000148 R629 R-CHIP SA 2007-000148 R630 R-CHIP SA 2007-000
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2007-001305 R101 R-CHIP SA 2007-001305 R102 R-CHIP SA 2007-001305 R105 R-CHIP SA 2007-001305 R106 R-CHIP SA 2007-007009 R108 R-CHIP SA 2007-007014 R523 R-CHIP SA 2007-007014 R526 R-CHIP SA 2007-007135 R327 R-CHIP SA 2007-007137 R568 R-CHIP SA 2007-007139 R114 R-CHIP SA 2007-007142 R103 R-CHIP SA 2007-007306 R110 R-CHIP SA 2007-007309 R625 R-CHIP SA 2007-007309 R626 R-CHIP SA 2007-00
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2007-008055 R713 R-CHIP SA 2007-008419 R533 R-CHIP SA 2007-008419 R611 R-CHIP SA 2007-008419 R612 R-CHIP SA 2007-008419 R614 R-CHIP SA 2007-008419 R615 R-CHIP SA 2007-008478 R602 R-CHIP SA 2007-008478 R603 R-CHIP SA 2007-008483 R511 R-CHIP SA 2007-008483 R701 R-CHIP SA 2007-008483 R705 R-CHIP SA 2007-008483 R706 R-CHIP SA 2007-008483 R707 R-CHIP SA 2007-008483 R709 R-CHIP SA 2007-00
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2007-008542 R525 R-CHIP SA 2007-008542 R562 R-CHIP SA 2007-008542 R563 R-CHIP SA 2007-008542 R619 R-CHIP SA 2007-008542 R722 R-CHIP SA 2007-008542 R723 R-CHIP SA 2007-008542 R725 R-CHIP SA 2007-008542 R726 R-CHIP SA 2007-008544 R216 R-CHIP SA 2007-008544 R601 R-CHIP SA 2007-008548 R613 R-CHIP SA 2007-008647 R211 R-CHIP SA 2007-008647 R537 R-CHIP SA 2007-008672 R636 R-CHIP SA 2007-00
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-000233 C132 C-CER,CHIP SA 2203-000233 C133 C-CER,CHIP SA 2203-000233 C137 C-CER,CHIP SA 2203-000233 C138 C-CER,CHIP SA 2203-000233 C139 C-CER,CHIP SA 2203-000233 C509 C-CER,CHIP SA 2203-000254 C122 C-CER,CHIP SA 2203-000330 C117 C-CER,CHIP SA 2203-000386 C254 C-CER,CHIP SA 2203-000386 C427 C-CER,CHIP SA 2203-000425 C513 C-CER,CHIP SA 2203-000425 C514 C-CER,CHIP SA 2203-000438 C121 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-000995 C107 C-CER,CHIP SA 2203-000995 C547 C-CER,CHIP SA 2203-000995 C621 C-CER,CHIP SA 2203-000995 C622 C-CER,CHIP SA 2203-001405 C618 C-CER,CHIP SA 2203-001405 C620 C-CER,CHIP SA 2203-001437 C255 C-CER,CHIP SA 2203-002668 C112 C-CER,CHIP SA 2203-002668 C140 C-CER,CHIP SA 2203-002677 C109 C-CER,CHIP SA 2203-005050 C104 C-CER,CHIP SA 2203-005057 C142 C-CER,CHIP SA 2203-005138 C640 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-005725 C232 C-CER,CHIP SA 2203-005725 C239 C-CER,CHIP SA 2203-005725 C249 C-CER,CHIP SA 2203-005725 C250 C-CER,CHIP SA 2203-005725 C252 C-CER,CHIP SA 2203-005726 C225 C-CER,CHIP SA 2203-005727 C209 C-CER,CHIP SA 2203-005736 C231 C-CER,CHIP SA 2203-005736 C238 C-CER,CHIP SA 2203-005736 C336 C-CER,CHIP SA 2203-005736 C562 C-CER,CHIP SA 2203-005736 C629 C-CER,CHIP SA 2203-005740 C215 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-006120 C206 C-CER,CHIP SA 2203-006120 C207 C-CER,CHIP SA 2203-006120 C208 C-CER,CHIP SA 2203-006137 C626 C-CER,CHIP SA 2203-006194 C129 C-CER,CHIP SA 2203-006194 C212 C-CER,CHIP SA 2203-006194 C337 C-CER,CHIP SA 2203-006194 C546 C-CER,CHIP SA 2203-006324 C120 C-CER,CHIP SA 2203-006324 C307 C-CER,CHIP SA 2203-006324 C503 C-CER,CHIP SA 2203-006324 C553 C-CER,CHIP SA 2203-006348 C507 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-006423 C317 C-CER,CHIP SA 2203-006423 C318 C-CER,CHIP SA 2203-006423 C319 C-CER,CHIP SA 2203-006423 C320 C-CER,CHIP SA 2203-006423 C326 C-CER,CHIP SA 2203-006423 C334 C-CER,CHIP SA 2203-006423 C422 C-CER,CHIP SA 2203-006423 C511 C-CER,CHIP SA 2203-006423 C515 C-CER,CHIP SA 2203-006423 C521 C-CER,CHIP SA 2203-006423 C525 C-CER,CHIP SA 2203-006423 C716 C-CER,CHIP SA 2203-006439 C143 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-006648 C340 C-CER,CHIP SA 2203-006648 C341 C-CER,CHIP SA 2203-006681 C502 C-CER,CHIP SA 2203-006681 C623 C-CER,CHIP SA 2203-006681 C646 C-CER,CHIP SA 2203-006824 C235 C-CER,CHIP SA 2203-006824 C251 C-CER,CHIP SA 2203-006824 C508 C-CER,CHIP SA 2203-006824 C517 C-CER,CHIP SA 2203-006824 C518 C-CER,CHIP SA 2203-006824 C520 C-CER,CHIP SA 2203-006824 C522 C-CER,CHIP SA 2203-006824 C527 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2404-001448 C617 C-TA,CHIP SA 2404-001492 C601 C-TA,CHIP SA 2703-001751 L111 INDUCTOR-SMD SA 2703-002155 L100 INDUCTOR-SMD SA 2703-002200 L101 INDUCTOR-SMD SA 2703-002200 L104 INDUCTOR-SMD SA 2703-002201 L106 INDUCTOR-SMD SA 2703-002201 L109 INDUCTOR-SMD SA 2703-002267 L105 INDUCTOR-SMD SA 2703-002267 L107 INDUCTOR-SMD SA 2703-002267 L108 INDUCTOR-SMD SA 2703-002267 L110 INDUCTOR-SMD SA 270
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2910-000028 DUP101 DUPLEXER-SAW SA 2911-000085 F107 DUPLEXER-FEM SA 3301-001208 L603 BEAD-SMD SA 3301-001208 L604 BEAD-SMD SA 3301-001534 L504 BEAD-SMD SA 3404-001152 V_DN SWITCH-TACT SA 3404-001152 V_UP SWITCH-TACT SA 3404-001320 CAM SWITCH-TACT SA 3705-001358 RFS101 CONNECTOR-COAXIAL SA 3709-001447 SIM501 CONNECTOR-CARD EDGE SA 3709-001448 HDC701 CONNECTOR-CARD EDGE SA 3710-002465 IFC601 SO
8. Reference data 8-1. Reference Abbreviate AAC: Advanced Audio Coding. AVC : Advanced Video Coding.
9. Safety Precautions 9-1. Repair Precaution ● Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because specipicty of cellular phone is sensitive for surrounding interference(RF noise). ● Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of manetic force. ● Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away. ● Use a thicken twisted wire when you measure level.
Safety Precautions 9-2. ESD(Electrostatically Sensitive Devices) Precaution Several semiconductor may be damaged easilly by static electricity. Such parts are called by ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity. ● Remove static electricity remained your body before you touch semiconductor or parts with semiconductor.
10.
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