GSM TELEPHONE SGH-E840 GSM TELEPHONE CONTENTS 1. Specification 2. Exploded View and Parts list 3. Chart of Troubleshooting 4. Array course control 5. Block Diagrams 6. PCB Diagrams 7. MAIN Electrical Parts List 8. Reference data 9. Safety Precautions 10.
Contents 1. Specification 1-1. GSM/CDMA General Specification ...........................................................................1-1 1-2. GSM TX power class ...............................................................................................1-2 2. Exploded View and Parts list 2-1. Cellular phone Exploded View ..................................................................................2-1 2-2. Cellular phone Parts list .................................................................
Contents 4. Array course control 4-1. Downloading Binary Files ......................................................................................4-2 4-2. Pre-requsite for Downloading ................................................................................4-2 4-3. S/W Downloader Program .....................................................................................4-3 5. Block Diagrams 6. PCB Diagrams 7. MAIN Electrical Parts List 8. Reference data 8-1. Reference Abbreviate ................
1. Specification 1-1. GSM/WCDMA General Specification EG SM 900 Phase 2 EGSM 900 Ph ase 2 DCS1800 Ph ase 1 PCS1 900 Fr eq. Band[ MHz] Uplink/Downlink 824~849 869~894 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1990 ARFCN r ange 128~251 0~124 & 975~1023 512~885 512~810 Tx/ Rx sp acing 45 MHz 45 MHz 95 MHz 80 MHz Mod. Bit rat e/ Bit Per iod 270.833 kbps 3.692 us 270.833 kbps 3.692 us 270.833 kbps 3.692 us 270.833 kbps 3.692 us T im e S lot Per iod/ Fra me Period 576.9 us 4.
Specification 1-2.
2. Exploded View and Parts List 2-1.
Exploded View and Parts List 2-2.
Exploded View and Parts List QRF03 PMO-COVER EAR/IF GH72-37442A QSD01 PMO-COVER MICRO SD GH72-37443A QMI03 RMO-RUBBER MIC HOLDER GH73-09017A 2-3 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Exploded View and Parts List Discription SEC CODE BAG PE 6902-000634 CBF INTERFACE-DLC,X830,SIL,PCB GH39-00720B ADAPTOR-SGHE690,SIL,EU,A_TYPE GH44-01361B S/W CD-SGHE840,PC STUDIO 3.
Exploded View and Parts List 2-3. Disassembly 1 Rear Deco 2 Scre w( 1.6*5) < Figure 1 > Screw A:1.4*3 Screw B:1.4*4 Screw(1.4*3) < Figure 1 > < Figure 2 > 1) Detach from rear deco the back of a set with tweezer.[Figure 1] 2) Unscrew 5points rear bolts the back of a < Figure 2 > set.[Figure 2] 1) Open the Micro SD Card Cover and Rear Cover with round tweezer.
Exploded View and Parts List 5 6 Screw(1.4*4) Screw Cap Screw(1.4*1.6) Screw(1.4*1.1) < Figure 1 > < Figure 1 > < Figure 2 > 1) Unscrew 4points Front Cover.[Figure 1] 2) Remove the Front Cover.[Figure 2] < Figure 2 > 1) Remove the Screw cap 2points[Figure 1] 2) Unscrew 6points Slide Lower.[Figure 2] 7 8 Green insulated Tape Camera Speaker Module < Figure 1 > < Figure 1 > < Figure 2 > < Figure 2 > 1) Remove the Slide Lower.
Exploded View and Parts List 9 Touch Key Connector 1) Pull out the Touch key connecter.[Figure 1] 2) Lift the LCD F-PCB and detach the LCD with Window.[Figure 2] ※ caution 1) Be careful with the damage of LCD.
Exploded View and Parts List 2-4. Assembly 1 2 LCD Touch Key Connector Camera Speaker Module < Figure 2 > < Figure 1 > < Figure 1 > < Figure 2 > 1) Combine LCD Module.[Figure 1] 2) Insert the Touch Key F-PCB [Figure 2] ※ caution 1) Combine Camera module.[Figure 1] 2) Combine Speaker module.[Figure 2] 1) Be careful of the possible damage on FPCB 3 4 Screw(1.4*4) Torque:1.2±0.1Kgf ㆍ Cm Screw Cap Screw(1.4*1.6) Torque:1.0±0.
Exploded View and Parts List 5 6 Electric conduction F-PCB Connector Sponge Screw(1.4*1.1) Torque:0.9±0.1Kgf ㆍ Cm < Figure 1 > < Figure 2 > 1) Insert "F-PCB" to the connector in PBA. 1) After combine Front Cover, the 4 Bolts. ※ caution [Figure 1] 2) Attach "electric conduction sponge" on connector. 1) Connector should be certainly clicked along the marked line. [Figure 2] 7 8 Intenna Connector Screw (1.4*4) Torque:1.0±0.1Kgf ㆍ Cm Flatten Soldering by finger.
Exploded View and Parts List 9 10 Volume Screw (1.4*3) Torque:1.3±0.1Kgf ㆍ Cm Key Camera Pow er Key Camera Key Key < Figure 1 > < Figure 2 > 1) After combine Front Cover, the 4 Bolts. [Figure 1] 2) Attach "electric conduction sponge" on connector. 1) Push the parts, as seen Figure 1. [Figure 2] 2) Screw the 2 Bolts, as seen above.[Figure 2] 11 Screw (1.6*5) Torque:1.0±0.1Kgf ㆍ Cm Rear Deco Screw (1.4*3) Torque:1.0±0.1Kgf ㆍ Cm 1) Screw the 3 Bolts, as seen above.
3. Flow Chart of Troubleshooting 3-1 BASEBAND 3-1-1. Power ON 'Power On' does not work Yes Check the current consumption more than 100mA No Download again Yes No Check the VBAT more than 3.3V Charge the Battery Yes ① Check the VLDO7_1.8V of UCP300 is more than 1.8V No Check UCP300 and C315 Yes ② Check U301 pin 1 = 1.8V pin 4 = 1.6V pin 7,9 = 1.5V No Check U301 Yes ③ Check UCP300 No Check VRF of UCP300=2.9V and C316 Yes ④ Check C130 Freq = 13MHz Vp-p > 0.
Flow Chart of Troubleshooting 3-2
SERLE SERDAT SERCLK BAND_SEL MOD_SEL TX_EN XOENA SX_EN PAC_EN RX_EN DSP_IO DSP_RWN FLASH_RESET DSP_AB(0:8) DSP_DB(15) DSP_DB(14) DSP_DB(13) DSP_DB(12) DSP_DB(11) DSP_DB(10) DSP_DB(9) DSP_DB(8) DSP_DB(7) DSP_DB(6) DSP_DB(5) DSP_DB(4) DSP_DB(3) DSP_DB(2) DSP_DB(1) DSP_DB(0) DSP_AB(8) DSP_AB(7) DSP_AB(6) DSP_AB(5) DSP_AB(4) DSP_AB(3) DSP_AB(2) DSP_AB(1) DSP_AB(0) DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 AB8 AB7 AB6 AB5 AB4 AB3 AB2 AB1 AB0 I|O RWN RESETN_CSP OCTL0 OCTL1 OCTL2 OC
Flow Chart of Troubleshooting VRF_2.9V U101 C130 13M_BUF 1 NC VCC 6 2A NC 5 3 GND R115 Y4 C131 CLK13M_TR R117 C133 R116 R120 C132 C137 CLK13M_MC CLK13M_YMU HP_CORE_1.575V VBAT D300 VCCD_1.8V L300 GND2 VLDO1_1.
Flow Chart of Troubleshooting 3-1-2. Initial Initial Failure Yes ① Check VCCD, VCCD_1.8V of UCP300 "High" when the phone is boot on` No Check UCP300 Yes ② Check the HP_CORE_1.575V of U201 is "High" No Check U301 Yes LCD display is O.K? ③ No Check HDC602 and LCD part Yes Sound is O.
Flow Chart of Troubleshooting VMOT_3.3V VCAM_2.8AV VCCD_2.9V VCAM_2.8DV VCAM_1.5V VTOUCH_3.
Flow Chart of Troubleshooting 3-1-3.
Flow Chart of Troubleshooting SIM300 VSIM SIM_RST R313 R314 SIM_CLK C300 C301 C302 3-8 C303 6 6 5 5 4 4 1 2 3 1 2 3 7 8 9 12 12 7 11 11 8 10 10 9 G G G G 16 15 14 13 SIM_IO C304
Flow Chart of Troubleshooting 3-1-4.
Flow Chart of Troubleshooting VCCD_1.8V ZD500 VBAT JIG_ON_IF_B R546 R547 R536 R501 SDS_RXD_B IFC500 R_ANT EAR_MIC+ EAR_MICEAR_R EAR_L EAR_SWITCH JACK_IN EAR_CHECK T_OPT SDS_RXD L505 TA_VEXT R503 R504 R505 R506 R507 JIG_ON_IF USB_D+ USB_DUSB_5.0V ZD501 C546 L504 TA501 ZD502 C543 C513 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NC NC NC NC 25 NC 26 NC 27 NC 28 NC TA502 C514 HP_CORE_1.575V VBAT D300 VCCD_1.
Flow Chart of Troubleshooting 3-1-5. Microphone Part Microphone does not work Check the assembled status of microphone. NO Reassemblage microphone YES Check the reference voltage on mic path R402=2.
Flow Chart of Troubleshooting TI_1.8V C401 VAUDIO_3.
Flow Chart of Troubleshooting MIC+ R425 DAC_MIC+ MIC C446 C450 C400 DAC_MIC- C405 ZD401 ZD400 VCCA_2.
Flow Chart of Troubleshooting 3-1-6. Speaker Part Speaker does not work Is the terminal of Speaker OK? O.K.
Flow Chart of Troubleshooting VR400 VBAT SPK_N_CON SPK_N_OUT U402 NO1 3 R423 IN2 COM2 NC 7 R419 AOUTAN GND 6 NC1 SPK_P_OUT 8 IN1 2 VCC COM1 1 9 NO2 10 4 5 R421 AMP_EN SPK_P_CON C440 VR401 C441 C442 C439 3-15 AOUTAP
Flow Chart of Troubleshooting 3-1-7.
Flow Chart of Troubleshooting VCCD_1.8V USB_3.3CV CORE_1.2V USB_3.3TV CORE_1.2V_O USB_1.2V CORE_1.2V_PLL C503 C502 C509 C520 10PF 50V C519 VCAM_2.8DV R515 R516 C_SDA C_SCL D1 D2 D3 D4 D5 E1 E2 E3 B4 CAM_HSYNC CAM_VSYNC CAM_RST P_CLK M_CLK C1 B3 C5 C2 C3 C4 F1 N11 TI_MSCK TI_BCK TI_LRCK SCL SDA P11 M11 M10 N10 VCCD_1.
Flow Chart of Troubleshooting 3-1-8. Camera Camera does not work Yes ① Check the connection of CN4 and HDC602 No connect the CN4 and HDC602 Yes ② Check the camera module. No Change the camera module Yes ③ Check the pin # 4 of U605 is High No Check the U502 Yes ④ Check the pin #7,#8 of U605 (pin #7 : 1.5V pin #8 : 2.
Flow Chart of Troubleshooting VCAM_2.8AV VBAT VCAM_2.8DV VCAM_1.
Flow Chart of Troubleshooting 3-2. RF 3-2-1.
Flow Chart of Troubleshooting 3-2-2.
Flow Chart of Troubleshooting 3-2-3.
Flow Chart of Troubleshooting 3-2-4.
Flow Chart of Troubleshooting 3-24
3-25 GSM_OUT DPCS_OUT DCS_TX_EN GSM_TX_EN C124 C123 F100 18 19 EGSM_RX 16 EGSM_RX 17 DCS_RX 14 DCS_RX 15 PCS_RX 12 PCS_RX 13 L100 850_RX 850_RX 1 2 3 4 7 9 10 11 20 23 24 25 26 27 28 G G G G G G G G G G G G G G G 5 EGSM_TX 22 DCS|PCS_TX 21 VC2 6 VC1 8 ANT C100 2 A G 4 3 C RFS100 C114 C109 L101 L110 L109 L108 L107 L106 L105 L104 L103 L102 C101 ANT ANT+ MOD_SEL R113 SAT_DET TX_FB VPC DCS74138_OUT GSM74138_OUT 3 2 43 42 41 39 14 35 36 12 33 31 32 9 8 7
Flow Chart of Troubleshooting 3-2-5. GSM850 Transmitter F100 pin 8 about NO 2~5dBm? 2 UCP300 check & NO F100 pin 6 : 2.8V CONTINUS TX ON CONDITION change MS TX level 19 YES YES 1 F100, C100 check & change CH : 190 RBW : 100KHz PAM100 pin7 3~6dBm? NO VBW : 100KHz YES NO PAM100 pin 4 : 3.7V SPAN : 10MHz 3 PAM100/R105 check & change REF LEV. : 10dBm BATTERY, BATTERY CONNECTOR check & change ATT.
Flow Chart of Troubleshooting 3-2-6. GSM900 Transmitter F100 pin 8 about NO 2~5dBm? 2 UCP300 check & NO F100 pin 6 : 2.8V CONTINUS TX ON CONDITION change MS TX level 19 YES YES 1 F100, C100 check & change CH : 62 RBW : 100KHz PAM100 pin7 3~6dBm? NO VBW : 100KHz YES NO PAM100 pin 4 : 3.7V SPAN : 10MHz 3 PAM100/R105 check & change REF LEV. : 10dBm BATTERY, BATTERY CONNECTOR check & change ATT.
Flow Chart of Troubleshooting 3-2-7. DCS Transmitter F100 pin 8 about NO 2~5dBm? 2 UCP300 check & NO F100 pin 21 : 2.8V CONTINUS TX ON CONDITION change MS TX level 12 YES YES 1 F100, C100 check & change CH : 698 RBW : 100KHz PAM100 pin2 3~6dBm? NO VBW : 100KHz YES NO PAM100 pin 4 : 3.7V SPAN : 10MHz 3 PAM100 check & change REF LEV. : 10dBm BATTERY, BATTERY CONNECTOR check & change ATT.
Flow Chart of Troubleshooting 3-2-8. PCS Transmitter F100 pin 8 about NO 2~5dBm? 2 UCP300 check & NO F100 pin 21 : 2.8V CONTINUS TX ON CONDITION change MS TX level 12 YES YES 1 F100, C100 check & change CH : 660 RBW : 100KHz PAM100 pin2 3~6dBm? NO VBW : 100KHz YES NO PAM100 pin 4 : 3.7V SPAN : 10MHz 3 PAM100 check & change REF LEV. : 10dBm BATTERY, BATTERY CONNECTOR check & change ATT.
Flow Chart of Troubleshooting 3-30
Flow Chart of Troubleshooting 3-2-9. Bluetooth Part BT connection disable Check BT function ON NO Enable BT function YES Check the voltage of C147 is around 1.
Flow Chart of Troubleshooting ANT100 VBT_1.8V L112 U103 C146 A NT 16 R123 3 PCM_CLK PCM_IN PCM_OUT PCM_SYNC 28 19 20 7 1 8 BT_TXD BT_RXD 4 26 2 5 PCM_CLK PIO0 PCM_IN PIO1 PCM_OUT PIO2 PCM_SYNC PIO3 PIO4 UART_CTS PIO5 UART_RTS PIO6 UART_RX PIO7 UART_TX PIO8 PIO9 RESETB USB_DN VDD_1.8V USB_DP VDD_PIO VDD_REG 3-32 GND 17 GND 15 10 GND C147 13 21 14 18 25 24 27 VBT_1.
Flow Chart of Troubleshooting VBAT VBT_1.
4.
Array course control Software Downloading 4-1. Downloading Binary Files • Three binary files for downloading E840. – E840XXYY.s3 : Main source code binary. 4-2. Pre-requsite for Downloading • Downloader Program(OptiFlash.
Array course control 4-3. S/W Downloader Program 1. Load the binary download program by executing the “OptiFlash.exe” 2. Select the “Options” -> “Settings” -> “Generic” -> “Specify hardware platform”. Choose hardware platform for the downloader file setting.
Array course control 3. Select the COM port when the download cable is connected Up to twelve ports are supported. Additionally you can select the maximum transfer speed OptiFlash will use to communicate with the phone.
Array course control 4. Select the“Flash&Verify” -> “Browse” Set the directory path and choose the latest s/w binary, for example E840XXYY.s3”, for the downloader binary setting.
5.
6.
PCB Diagrams U204 TP_GND U403 VR611 U603 C401 U401 TA401 TA402 VR200 U201 GND ZD501 VCCD_200 CP_TCK ZD500 CP_TDI RST MIC MIC+ 6-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization HDC600 CP_TDO U207 CP_TMS OSC200 TP _USB _VB US_DR V IFC500 U200 CAM_KEY UCP300 U502 OSC500 ZD502 C402 VR613 VR612 U506 PWR VR616 BTC501 HDC602 U505 F602 U202 F601 U605 F600 TP_SDS_RXD_ B U402 TP_USB_D TA404 TP_T_OPT
7.
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 1204-002138 U400 IC-MELODY SA 1204-002746 U607 IC-TUNER SA 1205-002272 U206 IC-TRANSCEIVER SA 1205-002946 U401 IC-CODEC SA 1205-003203 U104 IC-TRANSCEIVER SA 1205-003210 U502 IC-CODEC SA 1404-001165 VR300 THERMISTOR-NTC SA 1405-001082 VR200 VARISTOR SA 1405-001082 VR612 VARISTOR SA 1405-001082 VR613 VARISTOR SA 1405-001133 VR400 VARISTOR SA 1405-001133 VR401 VARISTOR SA 1405-001133 VR600
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2007-000171 R425 R-CHIP SA 2007-000171 R531 R-CHIP SA 2007-000171 R609 R-CHIP SA 2007-000171 R648 R-CHIP SA 2007-000171 R649 R-CHIP SA 2007-000174 R427 R-CHIP SA 2007-000174 R428 R-CHIP SA 2007-001119 R402 R-CHIP SA 2007-007009 R530 R-CHIP SA 2007-007131 R312 R-CHIP SA 2007-007132 R410 R-CHIP SA 2007-007134 R113 R-CHIP SA 2007-007142 R409 R-CHIP SA 2007-007156 R121 R-CHIP SA 2007-00
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2007-008052 R518 R-CHIP SA 2007-008055 R212 R-CHIP SA 2007-008055 R225 R-CHIP SA 2007-008055 R226 R-CHIP SA 2007-008055 R501 R-CHIP SA 2007-008055 R510 R-CHIP SA 2007-008055 R511 R-CHIP SA 2007-008055 R512 R-CHIP SA 2007-008055 R537 R-CHIP SA 2007-008055 R539 R-CHIP SA 2007-008055 R544 R-CHIP SA 2007-008055 R612 R-CHIP SA 2007-008055 R614 R-CHIP SA 2007-008057 R532 R-CHIP SA 2007-00
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2007-008483 R535 R-CHIP SA 2007-008483 R545 R-CHIP SA 2007-008483 R600 R-CHIP SA 2007-008483 R601 R-CHIP SA 2007-008483 R602 R-CHIP SA 2007-008483 R608 R-CHIP SA 2007-008483 R646 R-CHIP SA 2007-008483 R647 R-CHIP SA 2007-008483 R650 R-CHIP SA 2007-008516 R111 R-CHIP SA 2007-008516 R220 R-CHIP SA 2007-008516 R228 R-CHIP SA 2007-008516 R229 R-CHIP SA 2007-008516 R230 R-CHIP SA 2007-00
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2007-008808 R412 R-CHIP SA 2007-008808 R414 R-CHIP SA 2007-008808 R417 R-CHIP SA 2007-008816 R426 R-CHIP SA 2007-008816 R645 R-CHIP SA 2007-009111 R419 R-CHIP SA 2007-009111 R421 R-CHIP SA 2007-009111 R429 R-CHIP SA 2007-009111 R430 R-CHIP SA 2007-009115 R100 R-CHIP SA 2007-009168 R509 R-CHIP SA 2007-009170 R536 R-CHIP SA 2007-009170 R546 R-CHIP SA 2007-009170 R547 R-CHIP SA 2007-00
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-002709 C455 C-CER,CHIP SA 2203-002709 C505 C-CER,CHIP SA 2203-002709 C606 C-CER,CHIP SA 2203-002709 C608 C-CER,CHIP SA 2203-003054 C450 C-CER,CHIP SA 2203-005390 C101 C-CER,CHIP SA 2203-005482 C409 C-CER,CHIP SA 2203-005482 C411 C-CER,CHIP SA 2203-005482 C524 C-CER,CHIP SA 2203-005682 C120 C-CER,CHIP SA 2203-005682 C132 C-CER,CHIP SA 2203-005682 C137 C-CER,CHIP SA 2203-005682 C412 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-005736 C401 C-CER,CHIP SA 2203-005736 C404 C-CER,CHIP SA 2203-005736 C539 C-CER,CHIP SA 2203-005777 C109 C-CER,CHIP SA 2203-005777 C114 C-CER,CHIP SA 2203-005993 C302 C-CER,CHIP SA 2203-006121 C113 C-CER,CHIP SA 2203-006123 C102 C-CER,CHIP SA 2203-006194 C125 C-CER,CHIP SA 2203-006194 C147 C-CER,CHIP SA 2203-006194 C200 C-CER,CHIP SA 2203-006194 C202 C-CER,CHIP SA 2203-006194 C205 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-006423 C203 C-CER,CHIP SA 2203-006423 C204 C-CER,CHIP SA 2203-006423 C206 C-CER,CHIP SA 2203-006423 C210 C-CER,CHIP SA 2203-006423 C215 C-CER,CHIP SA 2203-006423 C216 C-CER,CHIP SA 2203-006423 C217 C-CER,CHIP SA 2203-006423 C218 C-CER,CHIP SA 2203-006423 C219 C-CER,CHIP SA 2203-006423 C301 C-CER,CHIP SA 2203-006423 C306 C-CER,CHIP SA 2203-006423 C307 C-CER,CHIP SA 2203-006423 C323 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-006562 C212 C-CER,CHIP SA 2203-006562 C213 C-CER,CHIP SA 2203-006562 C223 C-CER,CHIP SA 2203-006562 C224 C-CER,CHIP SA 2203-006562 C300 C-CER,CHIP SA 2203-006562 C310 C-CER,CHIP SA 2203-006562 C314 C-CER,CHIP SA 2203-006562 C315 C-CER,CHIP SA 2203-006562 C316 C-CER,CHIP SA 2203-006562 C317 C-CER,CHIP SA 2203-006562 C318 C-CER,CHIP SA 2203-006562 C324 C-CER,CHIP SA 2203-006562 C329 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-006626 C425 C-CER,CHIP SA 2203-006626 C434 C-CER,CHIP SA 2203-006626 C437 C-CER,CHIP SA 2203-006626 C451 C-CER,CHIP SA 2203-006626 C452 C-CER,CHIP SA 2203-006648 C321 C-CER,CHIP SA 2203-006648 C543 C-CER,CHIP SA 2203-006668 C430 C-CER,CHIP SA 2203-006668 C431 C-CER,CHIP SA 2203-006681 C546 C-CER,CHIP SA 2203-006824 C503 C-CER,CHIP SA 2203-006825 C325 C-CER,CHIP SA 2203-006825 C326 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 2203-006872 C545 C-CER,CHIP SA 2203-006896 C127 C-CER,CHIP SA 2203-006979 C112 C-CER,CHIP SA 2203-006979 C119 C-CER,CHIP SA 2404-001339 TA403 C-TA,CHIP SA 2404-001352 TA400 C-TA,CHIP SA 2404-001353 TA401 C-TA,CHIP SA 2404-001353 TA402 C-TA,CHIP SA 2404-001381 C309 C-TA,CHIP SA 2404-001381 TA404 C-TA,CHIP SA 2404-001396 TA501 C-TA,CHIP SA 2404-001406 TA500 C-TA,CHIP SA 2404-001406 TA502 C-
Main Electrical Parts List SEC CODE Design LOC Discription STATUS 3301-001158 L401 BEAD-SMD SA 3301-001342 L600 BEAD-SMD SA 3301-001810 L200 BEAD-SMD SA 3301-001810 L201 BEAD-SMD SA 3301-001810 L501 BEAD-SMD SA 3301-001810 L502 BEAD-SMD SA 3301-001810 L503 BEAD-SMD SA 3301-001879 L505 BEAD-SMD SA 3404-001303 CAM_KEY SWITCH-TACT SA 3404-001303 PWR SWITCH-TACT SA 3705-001421 RFS100 CONNECTOR-COAXIAL SA 3709-001447 SIM300 CONNECTOR-CARD EDGE SA 3709-001464
8. Reference data 8-1. Reference Abbreviate AAC: Advanced Audio Coding. AVC : Advanced Video Coding.
9. Safety Precautions 9-1. Repair Precaution ● Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because specipicty of cellular phone is sensitive for surrounding interference(RF noise). ● Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of manetic force. ● Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away. ● Use a thicken twisted wire when you measure level.
Safety Precautions 9-2. ESD(Electrostatically Sensitive Devices) Precaution Several semiconductor may be damaged easilly by static electricity. Such parts are called by ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity. ● Remove static electricity remained your body before you touch semiconductor or parts with semiconductor.
10.
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