GSM TELEPHONE SGH-E370 GSM TELEPHONE CONTENTS 1. Safety Precautions 2. Specification 3. Product Function 4. Array course control 5. Exploded View and Parts List 6. MAIN Electrical Parts List 7. Block Diagrams 8. PCB Diagrams 9. Flow Chart of Troubleshooting 10. Reference data 11.
CONTENTS 1. Safety Precautions 1-1. Repair Precaution ...........................................................................1-1 1-2. ESD(Electrostatically Sensitive Devices) Precaution ...........................1-2 2. Specification 2-1. GSM General Specification ..............................................................2-1 2-2. GSM Tx Power Class ......................................................................2-2 3. Product Function 4. Array course control 4-1. Software Adjustments..........
CONTENTS 9. Flow Chart of Troubleshooting 9-1. Power On....................................................................................9-1 9-2. Initial .........................................................................................9-3 9-3. Charging Part............................................................................ ..9-5 9-4. Sim Part.....................................................................................9-7 9-5. Microphone Part........................................
1. Safety Precautions 1-1. Repair Precaution ● Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because specipicty of cellular phone is sensitive for surrounding interference(RF noise). ● Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of magnetic force. ● Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away. ● Use a thicken twisted wire when you measure level.
Safety Precautions 1-2. ESD(Electrostatically Sensitive Devices) Precaution Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD (Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity. ● Remove static electricity remained your body before you touch semiconductor or parts with semiconductor.
2. Specification 2-1. GSM General Specification GSM900 Phase 1 E GS M 9 0 0 Phase 2 DCS1800 Phase 1 PCS1900 Fr eq. Band[MHz] Uplin k/Down link 890~915 935~960 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1990 ARF CN ra nge 1~124 0~124 & 975~1023 512~885 512~810 T x/Rx spacing 45MHz 45MHz 95MHz 80MHz Mo d. Bit r ate/ Bit Period 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us Ti me Slo t Pe rio d/Fr am e Per iod 576.9us 4.615ms 576.9us 4.
Speclflcation 2-2.
3. Product Function Main Function -1.3 Megapixel Camera with Flash -65536 Color TFT Screen (128×160) -Video Recording & Messaging -Music Player(MP3/AAC/AAC+) -Bluetooth Woreless Technology -Multimedia Message Service (MMS) -E-mail -Voice recorder -Java / WAP2.
Product Function 3-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
4. Array course control 4-1.
Array course control 4-2. Software Downloading 4-2-1. Pre-requsite for Downloading • Downloader Program(OneNAND_Downloder_1.8.exe) • E370 Mobile Phone • Data Cable • Binary file, TFS file 4-2-2. S/W Downloader Program ■ Load the binary download program by executing the “OneNAND_Downloder_1.8.exe” 1. Select the connected serial port and the rate of speed 2. Select the check box, the mode you want to download.
Array course control 3.
Array course control 4-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
5. Exploded View and Parts List 5-1.
Exploded view and Part List 5-2.
Exploded view and Part List Discription SEC Code BAG PE ADAPTOR-SGHD500 BLK UNIT-EARPHONE SPRING ETC-BATT LOCKER LABEL(P)-WATER SOAK LABEL(P)-IMEI DI LABEL(R)-MAIN(EU) MANUAL USERS-EU TMOENGLISH MANUAL USERS-EU TMOGERMAN CUSHION-CASE(T-MOBILE) BOX(P)-UNIT(DTM) MPR-VINYL BOHO LCD WIN MPR-VINYL BOHO M/WIN INSIDE MPR-VINYL BOHO MAIN WINDOW LIS MPR-TAPE MAIN FPCB MPR-TAPE MAIN DOME EMI MPR-TAPE MAIN FPCB SHORT MPR-TAPE MAIN FPCB EMI 2 MPR-TAPE SUB FPCB MPR-TAPE LCD FPCB MPR-TAPE SUB FPCB SHORT MPR-TAPE LCD P
Exploded view and Part List 5-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
6.
Electrical Parts List Design LOC Description SEC CODE STATUS C206 C-CER,CHIP 2203-005482 SA C207 C-CER,CHIP 2203-000254 SA C208 C-CER,CHIP 2203-005482 SA C209 C-CER,CHIP 2203-006208 SA C210 C-CER,CHIP 2203-000812 SA C211 C-CER,CHIP 2203-005482 SA C212 C-CER,CHIP 2203-006562 SA C213 C-CER,CHIP 2203-006562 SA C214 C-CER,CHIP 2203-006562 SA C216 C-CER,CHIP 2203-005482 SA C300 C-CER,CHIP 2203-000254 SA C301 C-CER,CHIP 2203-006260 SA C303 C-CER,CHIP 2203-000
Electrical Parts List Design LOC Description SEC CODE STATUS C417 C-CER,CHIP 2203-006257 SA C418 C-CER,CHIP 2203-000585 SA C419 C-CER,CHIP 2203-006208 SA C420 C-CER,CHIP 2203-005482 SA C423 C-CER,CHIP 2203-006208 SA C424 C-CER,CHIP 2203-006257 SA C426 C-CER,CHIP 2203-006208 SA C500 C-CER,CHIP 2203-000311 SA C501 C-CER,CHIP 2203-005482 SA C503 C-CER,CHIP 2203-005482 SA C504 C-CER,CHIP 2203-000812 SA C505 C-CER,CHIP 2203-006348 SA C602 C-CER,CHIP 2203-000
Electrical Parts List Design LOC Description SEC CODE STATUS C712 C-CER,CHIP 2203-000254 SA C714 C-CER,CHIP 2203-005482 SA C715 C-CER,CHIP 2203-005482 SA C716 C-CER,CHIP 2203-006257 SA C717 C-CER,CHIP 2203-005482 SA C718 C-CER,CHIP 2203-006562 SA CPL300 BLUETOOTH MODULE 4709-001413 SA EAR600 JACK-EAR PHONE 3722-002379 SA F100 DUPLEXER-FEM 2911-000019 SNA F101 FILTER-EMI SMD 2901-001254 SA F102 FILTER-SAW 2904-001553 SA F500 FILTER-EMI/ESD 2901-001322 SA F
Electrical Parts List Design LOC Description SEC CODE STATUS L701 BEAD-SMD 3301-001729 SA LED700 LED 0601-002055 SA LED701 LED 0601-002055 SA LED702 LED 0601-002055 SA LED703 LED 0601-002055 SA LED704 LED 0601-002055 SA LED705 LED 0601-002055 SA LED706 LED 0601-002055 SA LED707 LED 0601-002055 SA LED800 LED 0601-002055 SA LED801 LED 0601-002055 SA LED802 LED 0601-002055 SA LED803 LED 0601-002055 SA LED804 LED 0601-002015 SA OSC400 CRYSTAL-SMD 28
Electrical Parts List Design LOC Description SEC CODE STATUS R200 R-CHIP 2007-000148 SA R201 R-CHIP 2007-000171 SA R202 R-CHIP 2007-007001 SA R203 R-CHIP 2007-000242 SA R204 R-CHIP 2007-000242 SA R205 R-CHIP 2007-000162 SA R206 R-CHIP 2007-000162 SA R207 R-CHIP 2007-000162 SA R208 R-CHIP 2007-000162 SA R209 R-CHIP 2007-000143 SA R211 R-CHIP 2007-000148 SA R300 R-CHIP 2007-000171 SA R301 R-CHIP 2007-000171 SA R302 R-CHIP 2007-001325 SA R303 R-CHIP
Electrical Parts List Design LOC Description SEC CODE STATUS R516 R-CHIP 2007-000156 SA R602 R-CHIP 2007-000137 SA R604 R-CHIP 2007-000137 SA R605 R-CHIP 2007-001316 SA R606 R-CHIP 2007-000831 SA R607 R-CHIP 2007-000162 SA R608 R-CHIP 2007-000162 SA R609 R-CHIP 2007-000162 SA R610 R-CHIP 2007-007573 SA R611 R-CHIP 2007-007480 SA R612 R-CHIP 2007-000138 SA R700 R-CHIP 2007-000162 SA R701 R-CHIP 2007-007009 SA R702 R-CHIP 2007-007009 SA R703 R-CHIP
Electrical Parts List Design LOC Description SEC CODE STATUS U301 IC-MELODY 1204-002161 SA U302 IC-CMOS LOGIC 0801-003022 SA U303 IC ASIC GH13-00032A SA U304 IC-CMOS LOGIC 0801-002958 SA U305 IC-CMOS LOGIC 0801-003031 SA U400 IC-POSI.FIXED REG.
7. Block Diagrams 7-1.
Block Diagrams 7-2. Base Band Solution Block Diagram MIC BB INTERFACE Serial Data Interface RECEIVER MFA (SPK+VIB) Camera(1.
8. PCB Diagrams 8-1.
PCB Diagrams Bottom 8-2
PCB Diagrams 8-2.
PCB Diagrams Bottom 8-4
9. Flow Chart of Troubleshooting 9-1. Power On ' Power On ' does not work Yes No Check the Battery Voltage Change the Battery is more than 3.4V Yes No C408(VINT) = 2.7V? Check the PMU related to VINT Yes No Check the Clock at Resolder OSC400 R401=32KHZ Yes No TA425(+VDD_IO_LOW) & C424(+VDD_IO_HIGH) = "H"? Check the related circuit Yes No C401(+VDD_GSM_CORE) Check the +VDD_GSM_CORE circuit = 1.
Flow Chart of Troubleshooting 9-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-2.
Flow Chart of Troubleshooting 9-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-3. Charging Part Abnormal charging part Yes No Check the U500 pin 1 > 4.9V Check the circuit related to V_EXT_CHARGE Yes No U500 pin 5 = "L"? Resolder or replace U503 Yes No Check the circuit related to U500 pin 3 = "L"? AUX_ON signal Yes Check the U500 pin 10 No Resolder or replace U503 ≒ 4.
Flow Chart of Troubleshooting 9-6 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-4.
Flow Chart of Troubleshooting 9-8 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-5.
Flow Chart of Troubleshooting 9-10 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-6. Speaker Part(Melody) Speaker does not work Yes No U304 pin 6 = 2.9V? Resolder or replace U304 Yes No Check the Clock signal at Pin 4 of U304 (26MHz) Check the clock generation circuit (related to U301 and U303) Yes No U301 pin 17,18 ≒ 1.
Flow Chart of Troubleshooting 9-12 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-7.
Flow Chart of Troubleshooting 9-8.
Flow Chart of Troubleshooting 9-9.
Flow Chart of Troubleshooting 9-16 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-10.
Flow Chart of Troubleshooting 9-11.
Flow Chart of Troubleshooting 9-19 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-12. GSM Receiver RX ON RF input : CH center freq : +67.7kHz Amp : -50dBm Yes No F100 Pin8 >= -65dBm Resolder RFS100,C101 Yes No F100 5,6 >= -68dBm No Check F100 pin10,pin12 = L Check ANT Switch control circuit Yes Resolder F100 Yes No U101 pin 29 >= -70dBm pin 30 >= -70dBm Resolder C104, C108, L103 Yes U101 pin 7,8,9,10 >= 1V No No U101 pin 23,26,31 >=2.
Flow Chart of Troubleshooting 9-13. GSM Transmitter TX ON (5Level) Yes No F100 Pin8 >= 20dBm Resolder RFS100,C101 Yes No F100 pin11 >= 18dBm Check F100 pin10 = H (2.
Flow Chart of Troubleshooting 9-14. DCS Receiver RX ON RF input : CH center freq : +67.7kHz Amp : -50dBm Yes No F100 Pin8 >= -65dBm Resolder RFS100,C101 Yes No F100 1,2 >= -68dBm Check F100 pin10,pin12 = L No Check ANT Switch control circuit Yes Yes Resolder F100 No U101 pin 35 >= -70dBm pin 36 >= -70dBm Resolder C117, C118, L106 Yes U101 pin 7,8,9,10 >= 1V No No U101 pin 23,26,31 >=2.
Flow Chart of Troubleshooting 9-15. DCS Transmitter TX ON (5Level) Yes No F100 Pin8 >= 20dBm Resolder RFS100,C101 Yes No F100 pin13 >= 18dBm Check F100 pin12 = H (2.
Flow Chart of Troubleshooting 9-16. PCS Receiver RX ON RF input : CH center freq : +67.7kHz Amp : -50dBm Yes No F100 Pin8 >= -65dBm Resolder RFS100,C101 Yes No F100 3,4 >= -68dBm Check F100 pin10,pin12 = L Yes No Check ANT Switch control circuit Yes Resolder F100 No U101 pin 32 >= -70dBm pin 33 >= -70dBm Resolder C112, C116, L105 Yes 101 pin 7,8,9,10 >= 1V No No U101 pin 23,26,31 >=2.
Flow Chart of Troubleshooting 9-17. PCS Transmitter TX ON (5Level) Yes No F100 Pin8 >= 20dBm Resolder RFS100,C101 Yes No F100 pin13 >= 18dBm Check F100 pin12 = H (2.
Flow Chart of Troubleshooting 9-26 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
10. Reference data 10-1. Reference Abbreviate AAC: Advanced Audio Coding. AVC : Advanced Video Coding.
Reference data 10-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
11. Disassembly and Assembly Instructions 11-1. Disassembly 1 2 Unscrew 4 screws in rear cover Separate the rear cover Unscrew marked 4 points 3 2 1 From the bottom part separte the rear cover 1) Be careful of the damage of cover and scratch. 3 1) Be careful of the damage of cover and scratch.
Disassembly and Assembly Instructions Unscrew 4 screws in Sub Lower Case 5 Separate the Sub Lower 6 1 2 3 Unscrew marked 4 points 1) Separate the SUB PBA 7 1 2 Separate the Lower cover from SUB upper 8 Separate the SUB PBA 3 11-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Disassembly and Assembly Instructions 11-2. Assembly 1 Inserting the Sub PBA with LCD module 2 Place Sub PBA with Receiver and Camera to the Sub Upper case on the Sub Upper Case 3 Insert Sub Lower to Sub Upper 3 3 2 4 2 Screw to the Sub Lower 1 screwing 4 points . .
Disassembly and Assembly Instructions Screw to the 5 Lower Case 6 Assemble the Main PBA with FPCB Be careful this Point screwing 4 points 1) Insert the FPCB 2) Assemble the Main PBA 7 8 Assemble the Rear Case Screw the rear cover Screw marked 4 points 1 2 3 . .
Disassembly and Assembly Instructions 11-3. FPCB KIT Assembly 2 1 A MAIN FPCB Reference Line 1. Remove the cover from the adhesive tape 1. Insert MAIN FPCB to the white silk line, (SUB PBA) and then press the 'A' portion for safe connection ※ Caution ※ Caution 1.Be care of damaging SUB PBA when using a pair of tweezers 1. Confirm the direction whether it is MAIN or SUB side. 2. Confirm that the FPCB is fully inserted. 4 3 TAPE SUB FPCB SHORT soldering point 1. Solder on the both sides. 1.
Disassembly and Assembly Instructions 6 5 Fold Fold 1. Fold the FPCB downside. 1. Fold the MAIN side of FPCB lightly and unfold ※ Caution ※ Caution 1. FPCB should be folded without tilting. 1. FPCB should be folded without tilting. 8 7 B A 1. Remove the cover from the adhesive tape (MAIN PBA) ※ Caution 1. Insert MAIN FPCB to the white silk line(A) 2. Press the 'B' portion for safe connection ※ Caution 1.Be care of damaging MAIN PBA when using a pair of tweezers 1.
Disassembly and Assembly Instructions 10 9 TAPE MAIN FPCB EMI 2 Soldering point 1. Attatch an EMI adhesive tape starting left GND pad. 1. Solder on the both sides. 2. Remove the cover. ※ Caution 1.Be care of damaging MAIN PBA when using a pair of tweezers 2. Soldering tempreature : 350~380℃ ※ Caution 1. Follow Red reference line when putting on tape 12 11 TAPE MAIN TAPE MAIN FPCB EMI 1 FPCB SHORT 1. Fold the FPCB downside. 1. Attatch an insulating tape to meet with EMI tape 2.
Disassembly and Assembly Instructions 11-4. LCD KIT Assembly 2 1 Reference line TAPE LCD FPCB 1. Make certain that the external apperance of 1.Confirm that the TAPE is attached correctly. TAPE is clear. 2. Attatch a tape up to the reference line. ※ Caution ※ Caution 1. Be care of damaging SUB PBA when using a pair of tweezers. 1. Reattatch the adhesive tape when located wrong. 2. The TAPE should be located accurately. 4 3 1.Insert the LCD FPCB to the connector and fix it. 1.
Disassembly and Assembly Instructions 6 5 1. confirm the clearence of region indicated. 1. Attatch the LCD to SUB PBA by adjusting coner. ※ Caution ※ Caution 1. Confirm that the LCD is located correctly. 1.Remove the cover of tape if there is not clear. 8 7 Reference Line 부착 기준선 TAPE SLIDE MODULE EMI 1. Make certain that the external apperance of 1.Confirm that the TAPE is attached correctly. TAPE is clear. 2. Attatch a tape up to the reference line. ※ Caution ※ Caution 1.
Disassembly and Assembly Instructions 10 9 1.Confirm that the TAPE is attached correctly. 1.Finally, Confirm that the TAPE is attached correctly by front view. ※ Caution ※ Caution 1. Reattatch the insulating tape when located wrong. 11 Reference Line 1. Reattatch the insulating tape when located wrong. 12 TAPE LCD PBA SHORT 1. Make certain that the external apperance of 1.Confirm that the TAPE is attached correctly. TAPE is clear. 2. Attatch a tape up to the reference line.
This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law. ⓒ Samsung Electronics Co.,Ltd. Code No.: GH68-11216A 2006. 04. Rev.1.
