GSM TELEPHONE SGH-E250 GSM TELEPHONE CONTENTS 1. Safety Precautions 2. Specification 3. Product Function 4. Array course control 5. Exploded View/Disassembly and Assembly Instructions 6. MAIN Electrical Parts List 7. Block Diagrams 8. PCB Diagrams 9. Flow Chart of Troubleshooting 10.
CONTENTS 1. Safety Precautions 1-1. Repair Precaution......................................................................................................1-1 1-2. ESD(Electrostatically Sensitive Devices) Precaution...............................................1-2 2. Specification 2-1. GSM General Specification.......................................................................................2-1 2-2. GSM Tx Power Class....................................................................................
CONTENTS 9. Flow Chart of Troubleshooting 9-1. Pown on.....................................................................................................................9-1 9-2. Initial...........................................................................................................................9-3 9-3. Charging Part.............................................................................................................9-5 9-4. SIM Part.....................................................
1. Safety Precautions 1-1. Repair Precaution ● Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because specificity of cellular phone is sensitive for surrounding interference(RF noise). ● Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of magnetic force. ● Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away.
Safety Precautions 1-2. ESD(Electrostatically Sensitive Devices) Precaution Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD (Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below. You can prevent from ESD damage by static electricity. ● Remove static electricity remained your body before you touch semiconductor or parts with semiconductor.
2. Specification 2-1. GSM General Specification GSM900 Phase 1 E GS M 9 0 0 Phase 2 DCS1800 Phase 1 PCS1900 Fr eq. Band[MHz] Uplin k/Down link 890~915 935~960 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1990 ARF CN ra nge 1~124 0~124 & 975~1023 512~885 512~810 T x/Rx spacing 45MHz 45MHz 95MHz 80MHz Mo d. Bit r ate/ Bit Period 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us Ti me Slo t Pe rio d/Fr am e Per iod 576.9us 4.615ms 576.9us 4.
Speclflcation 2-2.
3. Product Function Main Function -SlimSlide Design Intenna -VGA Camera -Bluetooth V.2.0 -Stereo Bluetooth Headset -Mobile Tracker & SOS Messaging -Large 2.0" 65K Color TFT Display -SMS/MMS/E-Mail -WAP 2.0 / Java MIDP 2.
Product Function 3-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
4. Array course control 4-1.
Array course control 4-2. Software Downloading 4-2-1. Pre-requsite for Downloading • Downloader Program(OneNAND Downloder V1.2 Lite For PNX5230.exe) • E250 Mobile Phone • Data Cable • Binary file, TFS file 4-2-2. S/W Downloader Program ■ Load the binary download program by executing the “OneNAND Downloder V1.2 Lite For PNX5230.exe” 1. Select the connected serial port and the rate of speed 2. Select the check box, the mode you want to download.
Array course control 3.
Array course control 4-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
5. Exploded View/Disassembly&Assembly Instructions 5-1.
Exploded View/Disassembly&Assembly Instructions 5-2.
Exploded View/Disassembly&Assembly Instructions Description Sec Code BAG PE 6902-000634 ADAPTOR-SGHE690,SIL,EU,A_TYPE GH44-01361B UNIT-20P,EARPHONE,SIL,B-TYPE GH59-03848B LABEL(P)-WATER SOAK GH68-02026A LABEL(P)-WATER SOAK GH68-02026A MANUAL USERS-XEG GERMAN GH68-12415A LABEL(R)-MAIN(EU) GH68-12733A BOX-UNIT(EU) GH69-04558A CUSHION-CASE(EU) GH69-04565A RMO-RUBBER SIM GH73-08686A MPR-BOHO VINYL MAIN WIN GH74-16880A MPR-INSU TAPE GH74-27455A MPR-INSU TAPE GH74-27456A MPR-ELEC TAPE
Exploded View/Disassembly&Assembly Instructions 5-3.
Exploded View/Disassembly&Assembly Instructions 5 1) Remove the EMI tape 6 1) Detach the Volumn Key Fpcb 2) Disassemble key-can from the point of the picture 1) Be careful of damaging FPCB detaching Volumn Key Fpcb 2) Be careful of body damage and scretch 7 1) Disassemble the key-pad 8 1) Unscrew 2 screws 1) Be careful of body damage and scretch 5-5 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Exploded View/Disassembly&Assembly Instructions 9 1) Unscrew 4 screws 10 2) Disassemble the upper with a couple of 1) Match the hole of LOWER and FRONT holding up the slide 2) Draw out the FPCB from the hole thumbs pressing the point of picture 1) Be careful of body damage and scretch 11 1) Be careful of cutting wire 2) Be careful of body damage and scretch 1) Remove the tape covering FPCB Connector 12 2) Disassemble FPCB after lifting Connector 1) Disassemble Speaker, Motor 2) Remove the tape
Exploded View/Disassembly&Assembly Instructions 13 15 1) Disassemble from upper after lifting 1) Disassemble Sub Key Pad lightly the upside of the Sub PBA 2) Disassemble SPK, MOT, CAMERA 1) Be careful of body damage and scretch 2) Be careful of sticking between two sides tape and LCD 5-7 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Exploded View/Disassembly&Assembly Instructions ― Assembly 1 1) Joint the Sub Key Pad 2 1) Assemble Sub PBA inserting the bottom of the board 2) Assemble CAMERA, SPK, MOT after inserting camera FPCB 1) Be careful of damaging CAMERA FPCB 3 1) Insert FPCB(CON TO CON) 4 2) Attach conserving TAPE 1) Be careful of body damage and scretch 2) Be careful of damaging F-PCB 1) Match the hole pulling down lightly the SLIDE ASSY like picture 2) Insert FPCB 1) Be careful of damaging F-PCB 5-8 SAMSUNG Prop
Exploded View/Disassembly&Assembly Instructions 7 1) Assemble SLIDE ASSY part 8 1) Screw down 4 screws 2) Assemble from the bottom side 1) Be careful of body damage and scretch 7 1) Be careful of body damage and scretch 1) Insert both screw caps in each 8 1) Assemble the key pad in FRONT direction 1) Be careful of body damage and scretch 1) Check up the fitting between key pad and REAR 5-9 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's
Exploded View/Disassembly&Assembly Instructions 9 1) Assemble the key can 10 1) Attach the EMI tape 2) Check up the attaching FPCB in Volumn Key side 1) Be careful of damaging F-PCB 11 1) Check up whether tape color is same with SET color or not 1) Assemble the FPCB with main board 12 1) Open the T-Flash, Power Cover 2) Assemble the main board 1) Be careful of damaging BGA components 1) Be careful of body damage and scretch 5-10 SAMSUNG Proprietary-Contents may change without notice This Docu
Exploded View/Disassembly&Assembly Instructions 13 1) Insert the Volumn Key 14 2) Assemble the Key Connector 1) Be careful of damaging BGA components 1) Screw down 5screws 2) Attach RF Sheet,SCREW Cover of rear 1) Be careful of body damage and scretch 5-11 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Exploded View/Disassembly&Assembly Instructions 5-12 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
6.
Main Electrical Parts List Design LOC Description SEC Code STATUS C317 C318 C319 C320 C321 C322 C323 C324 C325 C326 C327 C400 C401 C403 C404 C405 C407 C409 C410 C411 C412 C413 C414 C415 C416 C417 C420 C421 C422 C423 C424 C425 C426 C427 C428 C429 C430 C431 C432 C501 C502 C503 C504 C505 C506 C511 C512 C513 C514 C515 C516 C517 C518 C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP
Main Electrical Parts List Design LOC Description SEC Code STATUS C519 C520 C521 C522 C531 C532 C533 C534 C535 C536 C537 C538 C539 C540 C541 C542 C543 C544 C545 C546 C547 C548 C549 C550 C551 C601 C602 C603 C604 C605 C606 C607 C609 C610 C611 C612 C613 C614 CD600 CN205 F100 F400 F500 F602 F603 F604 HDC600 HEA300 IFC500 L101 L102 L103 L104 C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP C-
Main Electrical Parts List Design LOC Description SEC Code STATUS L105 L106 L107 L108 L300 L303 L400 L500 L501 L504 L505 L506 L507 L508 L509 OSC100 OSC1001 OSC400 Q600 R101 R103 R201 R202 R204 R205 R206 R209 R212 R213 R214 R215 R217 R218 R221 R223 R225 R227 R301 R302 R303 R304 R306 R307 R308 R309 R311 R312 R313 R317 R318 R321 R322 R400 INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD C-CER,CHIP BEAD-SMD INDUCTOR-SMD BEAD-SMD BEAD-SMD INDUCTOR-SMD INDUCTOR-SMD INDUCTOR-SMD BEAD-SMD BEAD-SMD BEAD-SMD
Main Electrical Parts List Design LOC Description SEC Code STATUS R401 R402 R403 R405 R407 R408 R409 R410 R411 R412 R413 R414 R415 R416 R418 R419 R501 R502 R503 R504 R505 R506 R507 R508 R509 R510 R516 R518 R519 R523 R524 R525 R526 R529 R601 R602 R603 R604 R605 R606 R607 R608 R610 R611 R612 R613 R614 R615 R617 R619 SIM400 TA100 TA400 R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-CHIP R-C
Main Electrical Parts List Design LOC Description SEC Code STATUS TA500 TA501 TA502 TA503 TA504 U102 U103 U1109 U1111 U1112 U1125 U1126 U1127 U1130 U1131 U1132 U1133 U202 U300 U301 U302 U402 U403 U404 U500 U501 U503 U504 U601 U905 U906 UCP200 UME301 VR600 ZD301 ZD302 ZD401 ZD500 ZD501 ZD502 ZD505 ZD506 ZD600 ZD601 C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP C-TA,CHIP IC-TRANSCEIVER IC-POWER AMP IC-TRANSCEIVER C-CER,CHIP C-CER,CHIP R-CHIP R-CHIP R-CHIP R-CHIP C-CER,CHIP C-CER,CHIP C-CER,CHIP FILTER-EMI SMD
7. Block Diagrams 7-1.
Block Diagrams 7-2.
8.
PCB Diagrams Bottom 8-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
9. Flow Chart of Troubleshooting 9-1. Power On ' Power On ' does not work Yes Check the Battery Voltage No Change the Battery is more than 3.4V Yes No Check the PMU related to VINT C420(VISA) = 2.7V? Yes Check the Clock at No Resolder OSC400 R410=32KHZ Yes C400(+VDD_IO_LOW) & C405(+VDD_IO_HIGH) = "H"? No Check the related circuit Yes C205(+VDD_GSM_CORE) No Check the +VDD_GSM_CORE circuit = 1.
Flow Chart of Troubleshooting 9-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-2.
Flow Chart of Troubleshooting 9-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-3. Charging Part Abnormal charging part Yes No Check the U403 pin 38 > 4.9V Check the circuit related to V_EXT_CHARGE Yes No U403 pin 34(AUX_ON) = "L"? Check the circuit related to AUX_ON signal Yes No Check the U403 pin 46 Resolder or replace U403 ≒ 1.
Flow Chart of Troubleshooting 9-6 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-4.
Flow Chart of Troubleshooting 9-8 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-5.
Flow Chart of Troubleshooting 9-10 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-6. Speaker Part(Melody) Speaker does not work Yes No U500 pin 7 = 2.9V? Resolder or replace U500 Yes No U500 pin 15,17 ≒ 1.8V? Resolder U500 (When U500 operate) Yes No HDC600 pin 2,3 ≒ 1.
Flow Chart of Troubleshooting 9-12 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-7.
Flow Chart of Troubleshooting 9-8.
Flow Chart of Troubleshooting 9-9.
Flow Chart of Troubleshooting 9-16 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-10. Key Back Light Main Key LED does not work Yes No Check the U906 related to "VDD_KEY" U906 pin6 = "H"? Yes U906 pin3 = 3.
Flow Chart of Troubleshooting 9-18 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-11.
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Flow Chart of Troubleshooting 9-12. GSM Receiver RX ON RF input : CH center freq : +67.7kHz Cell Power : -60dBm Yes No F100 Pin13 ≥ -65dBm Resolder CN205,C103,L102 Yes No F100 1,2 ≥ -68dBm No Check F100 pin9,pin11 = L Check ANT Switch control circuit Yes Resolder F100 Yes No U101 pin 24 ≥ -70dBm pin 25 ≥ -70dBm Resolder C108, C109, L105 Yes U101 pin 4,5,6,7 ≥ 0.2Vp_p No U101pin 16,17,29 32,36 ≥2.8V pin10≥1.
Flow Chart of Troubleshooting 9-13. GSM Transmitter TX ON (5Level) Yes Yes F100 Pin13 ≥ 30dBm Resolder CN205,C103,L102 No Yes F100 pin10 ≥ 30dBm Check F100 pin11 = H (2.6V), Pin9 = L No Check ANT Switch control circuit Yes No Change or Resolder F100 Yes U103 pin12 ≥ 30dBm Resolder or Change L101, No Yes U103 pin7 ≥ -4dBm Check U103pin 2,3, 5,6,8+Vbatt pin4, OK? Yes Resolder or Change U103 No Check VBAT or PAM control signal No Yes U102 pin 4,5,6,7 ≥ 0.2Vp_p U101pin 16,17,29 32,36 ≥2.
Flow Chart of Troubleshooting 9-14. DCS Receiver RX ON RF input : CH center freq : +67.7kHz Cell Power : -60dBm Yes No F100 Pin13 ≥ -65dBm Resolder CN205,C103,L102 Yes No F100 3,4 ≥ -68dBm Check F100 pin9,pin11 = L No Check ANT Switch control circuit Yes Yes Resolder F100 No U102 pin 22 ≥ -70dBm pin 23 ≥ -70dBm Resolder C104, C105, L104 Yes U101 pin 4,5,6,7 ≥ 0.2Vp_p No U101 pin16,17,29, 32,36 ≥2.8V pin 10≥1.
Flow Chart of Troubleshooting 9-15. DCS Transmitter TX ON (0Level) Yes Yes F100 Pin13 ≥ 25dBm Resolder CN205,C103,L102 No Yes F100 pin8 ≥ 25dBm Check F100 pin9 = H (2.6V), pin11 = L No Check ANT Switch control circuit Yes No Change or Resolder F100 Yes U103 pin18 ≥ 25dBm Resolder or Change C112, L108 No No U103 pin1 ≤ -4dBm Check U103pin 2,3, 5,6,8+Vbatt pin4, OK? Yes Resolder or Change U103 No Check +VBAT or PAM control signal Yes No U101 pin 4,5,6,7 ≥ 0.
Flow Chart of Troubleshooting 9-16. PCS Receiver RX ON RF input : CH center freq : +67.7kHz Cell Power : -60dBm Yes No F100 Pin13 ≥ -65dBm Resolder CN205,C103,L102 Yes No F100 5,6 ≥ -68dBm Check F100 pin9,pin11 = L Yes No Check ANT Switch control circuit Yes Resolder F100 No U101 pin 20 ≥ -70dBm pin 21 ≥ -70dBm Resolder C101, C102, L103 Yes U101 pin 4,5,6,7 ≥ 0.2Vp_p No U101pin16,17,29, 32,36 ≥2.8V pin 10≥1.
Flow Chart of Troubleshooting 9-17. PCS Transmitter TX ON (0Level) Yes F100 Pin13 ≥ 25dBm Yes Resolder CN205,C103,L102 No F100 pin8 ≥ 25dBm Yes Check F100 pin9 = H (2.6V), pin11 = L Check ANT Switch control circuit Yes No U103 pin18 ≥ 25dBm No Change or Resolder F100 Yes Resolder or Change C112, L108 No U103 pin1 ≤ -4dBm No Check U103pin 2,3, 5,6,8+Vbatt pin4, OK? Yes Resolder or Change U103 No Check +VBAT or PAM control signal Yes No U101 pin 4,5,6,7 ≥ 0.
Flow Chart of Troubleshooting 9-27 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-18. Bluetooth part Bluetooth does not work Yes No Resolder or replace F404 pin 2 ≥ -4dB L301,L301, ANT900 Yes No C319, C318 (+position), is ≥ 1.8V Resolder C318,C319 and check the PMU part Yes No OSC1001 Pin 3 is 26MHz (1.4Vp_p) Resolder OSC1001, C325,C326,R312 Yes No C321,C316,C317 is ≥ 1.5V Resolder C316, C317,L303,C321 check or Replace U1109 Yes No R304, U1126, U1125 ≥ 1.8V C323 ≥ 1.
Flow Chart of Troubleshooting 9-29 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-19. Radio part Radio does not work Yes No Resolder R524, R529,C533 R524, R529, C533 ≥ 2.8V and Check PMU part Yes No R523, R525,C531, C532 ≥ 2.
Flow Chart of Troubleshooting 9-31 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 9-32 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
10. Reference data Reference Abbreviate ― AAC: Advanced Audio Coding. ― AVC : Advanced Video Coding.
Reference data 10-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law. ⓒ Samsung Electronics Co.,Ltd. 2006. 12. Rev.1.