GSM TELEPHONE SGH-C210 CONTENTS GSM TELEPHONE 1. Specification 2. Circuit Description 3. Exploded Views and Parts List 4. Electrical Parts List 5. Block Diagrams 6. PCB Diagrams 7.
1. Specification 1-1. GSM General Specification EG SM 9 0 0 Pha s e 2 D CS 1 8 0 0 Pha s e 1 PC S 1 9 0 0 Ph a s e 1 F r eq . B a n d [M Hz ] Up l in k / Do w n li n k 8 8 0 ~9 1 5 9 2 5 ~9 6 0 1 7 1 0 ~1 7 8 5 1 8 0 5 ~1 8 8 0 1850~1910 1930~1960 A RF C N r a n g e 0 ~1 2 4 & 9 7 5 ~ 1 0 2 3 5 1 2 ~8 8 5 512~810 T x /R x s p ac in g 4 5 MH z 9 5 MH z 8 0 M Hz Mo d . B i t r at e/ Bi t Pe r i o d 2 7 0 .8 3 3 k b p s 3 .6 9 2 u s 2 7 0 .8 3 3 k b p s 3 .6 9 2 u s 2 7 0 .8 3 3 k b p s 3 .
2. Circuit Description 2-1. SGH-C210 RF Circuit Description 2-1-1. RX PART — ASM(F101) → Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling. — ASM Control Logic Truth Table VC1 VC2 VC3 EGSM TX H L L DCS/PCS TX L H L PCS_RX L L H — Saw FILTER To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band. - GSM FILTER (F100) → For filtering the frequency band between 925 and 960 MHz.
Circuit Description 2-1-2. TX PART Baseband IQ signal fed into offset PLL, this function is included inside of U801 chip. The transmit section of U801 consist of an I/Q baseband upconverter, an offset phase-locked loop (OPLL) and two 50 ohm output buffers that can drive an external Power Amplifier(PA). Si4210 chip generates modulator signal which power level is about 1.5dBm and fed into Power Amplifier(U900). The PA output power and power ramping are well controlled by Auto Power Control circuit.
Circuit Description — Backlight LED Driver The backlight LED driver is a low-side, programmable current source designed to control the brightness of the keyboard illumination. LED1_DRV is controlled via LED1_[0:2] and can be programmed to sink from 15mA to 60mA in 7.5mA steps. LED2_DRV is controlled via LED2_[0:2] and can be programmed to sink from 5mA to 40mA in 5mA steps. Both LED drivers are capable of sinking their maximum output current at a worst-case maximum output voltage of 0.6V.
Circuit Description 2-2-3. IF connetor It is 24-pin connector, and separated into two parts. One is a power supply part for main system. And the other is designed to use SDS, DEBUG, DLC-DETECT, JIG_ON, VEXT, VTEST, VF, and GND. They connected to power supply IC, microprocessor and signal processor IC. 2-2-4. Audio AOUTAP, AOUTAN from CSP2200 is connected to the speaker via analog switch. AOUTBP and AOUTBN are connected to the ear-mic speaker via ear-jack. MICIN and MICOUT are connected to the main MIC.
Circuit Description 2-2-5. Memory This system uses SHARP's memory, LRS18B0. It is consisted of 256M bits flash memory and 64M bits SCRAM. It has 16 bit data line, D[0~15] which is connected to trident, LCD or CSP2200. It has 23 bit address lines, A[1~23]. They are also connected. CP_CSROMEN signal, chip select signal in the trident, enable flash memories. They use supply voltages, VCCD and VCC_1.8A. During wrting process, CP_WEN is low and it enables writing process to flash memory and SCRAM.
Circuit Description 2-2-7. CSP2200 CSP2200 is integrated the timing and control functions for GSM 2+ mobile application with the ADC and DAC functions, and power management block. The CSP2200 interfaces to the trident, via a 16-bit parallel interface. It serves as the interface that connects a DSP to the RF circuitry in a GSM 2+ mobile telephone.
3. Exploded View and Parts List 3-1.
Exploded view and Part List 3-2. Parts List Location Description NO.
Exploded view and Part List Description SEC CODE BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-000634 ADAPTOR-TAD;TAD137ESE,SGH-P100,-,110 GH44-00482A LABEL(P)-WATER SOAK;SCH-X110,NORGE,1 GH68-02026A MANUAL-SFC;SGH-S200,SAMSUNG,RUSSIAN, GH68-04336A LABEL(R)-MAIN( SER);SGH-C210,SER,POL GH68-06983B MANUAL-USE;SGH-C210,SER,RUSSIAN,ROMA GH68-07137A CUSHION-CASE(1-2);SGH-C210,PULP,T0.
Exploded view and Part List 3-3. Test Jig (GH80-00865A) 3-3-1. RF Test Cable (GH39-00283A) 3-3-2. Test Cable (GH39-00127A) 3-3-3. Serial Cable 3-3-4. Power Supply Cable 3-3-5. DATA CABLE (GH39-00143B) 3-3-6.
4.
Electrical Parts List SEC Code Design LOC Description 2007-000146 R502 R-CHIP 2007-000148 R112,R402 R-CHIP 2007-000153 R722 R-CHIP 2007-000157 R201,R204,R223,R309 R-CHIP 2007-000162 R208,R211,R501,R725 R-CHIP 2007-000167 R306 R-CHIP 2007-000171 C131,R101,R104,R105 R-CHIP 2007-000171 R107,R213,R214,R216 R-CHIP 2007-000171 R217,R219,R220,R301 R-CHIP 2007-000171 R305,R408,R409,R414 R-CHIP 2007-000171 R418,R419,R500,R612 R-CHIP 2007-000171 R700,R701,R702,R703 R-CHIP 2007-
Electrical Parts List SEC Code Design LOC Description 2203-000233 C118,C310,C325,C411 C-CERAMIC,CHIP 2203-000233 C601,C603,C701 C-CERAMIC,CHIP 2203-000254 C134,C201,C202,C203 C-CERAMIC,CHIP 2203-000254 C204,C208,C210,C211 C-CERAMIC,CHIP 2203-000254 C212,C213,C215,C301 C-CERAMIC,CHIP 2203-000254 C319,C605 C-CERAMIC,CHIP 2203-000278 C119,C120 C-CERAMIC,CHIP 2203-000330 C220,C221 C-CERAMIC,CHIP 2203-000386 C127 C-CERAMIC,CHIP 2203-000425 C406 C-CERAMIC,CHIP 2203-000438 C104,C
Electrical Parts List SEC Code Design LOC Description 2203-005496 C413,C507 C-CERAMIC,CHIP 2203-006053 C312,C313,C314,C315 C-CERAMIC,CHIP 2203-006053 C316 C-CERAMIC,CHIP 2203-006090 C110 C-CERAMIC,CHIP 2203-006093 C304,C503 C-CERAMIC,CHIP 2203-006190 C513 C-CERAMIC,CHIP 2203-006208 C512 C-CERAMIC,CHIP 2203-006257 C327 C-CERAMIC,CHIP 2203-006348 C703 C-CERAMIC,CHIP 2203-006438 C218 C-CERAMIC,CHIP 2203-006562 C704 C-CERAMIC,CHIP 2404-001105 C412,C414,C502 C-TA,CHIP 2404
Electrical Parts List SEC Code Design LOC Description 3722-002067 CN401 JACK-PHONE 4302-001130 U303 BATTERY NEW-IC001 F101 COMP-SMD 4-5 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
5. Block Diagrams 5-1.
Block Diagrams 5-2.
6. PCB Diagrams 6-1.
PCB Diagrams 6-2.
7. Flow Chart of Troubleshooting 7-1. Power On The set is not ' Power On ' Check the current consumption No Current consumption >=100mA Download again Yes Check the +VBATT Voltage No Voltage >= 3.3V Charge the Battery Yes Check the pin of U300 No Check U300 and C315 pin#J12 of U300 >= 2.8V Yes pin#A13 of U300 = 2.8V No No Yes pin#G11 = 1.
Flow Chart of Troubleshooting 7-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 7-2. Initial Initialization Failure Yes No The pin#G11 of U300 = 1.8V and the pin#J12 of U300 ≒ 2.825V ? Check the U300 (If it has some problem, adjust it.) Yes No Is the pin#K9 of U300 "Low -> High"? Check the U300 (If it has some problem, adjust it.) Yes No 32.768kHz wave forms at the C220 and C221 Check the U200 Yes No The Voltage is "High" at the C114 Check the U300 Yes No Check the LCD Part LCD display is O.K Yes No Sound is O.
Flow Chart of Troubleshooting 7-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting 7-3.
Flow Chart of Troubleshooting 7-4. Charging Part Abnormal charging operation No The pin#17, #18 of CN701 is TA_VEXT ≒ 5V ? Replace TA or Check CN701 Yes No Check the U301 The pin#8 of U101 is 3.2~4.2V ? Yes The ICHRG = 1.
VCCA VRF VCCD R301 VBAT C301 C303 C302 C304 DSP_IO DSP_RWN FLASH_RESET DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 AB8 AB7 AB6 AB5 AB4 AB3 AB2 AB1 AB0 I|O RWN RESETN_CSP E6 C5 F5 E5 A4 G6 B3 A3 OCTL0 OCTL1 OCTL2 OCTL3 OCTL4 OCTL5 OCTL6 OCTL7 B1 A2 C1 C2 SERLE1 SERLE2 SERDA SERCK VDD5 VDD67 GNDQ GND_PSC1 GND_PSC2 GND_HCUR VDD1 VDD2 VDD3 VDD_IO1 VDD_IO2 VSS1 VSS2 VSS3 VSS4 VDDD GNDD VDDB GNDB VDDV GNDV VDD_OCTL GND_OCTL DSP_AB(0:8) D2 D3 E3 E2 F3 F2 F1 F4 G4 G3 H5 J6 J
Flow Chart of Troubleshooting 7-5. Microphone Part Microphone does not work Yes No Is the assembled status of microphone O.K? Reassemble the microphone Yes Check the reference voltage on Mic path No Solder the microphone again or C401 > 2.5V Replace around Mic Circuit (C403, C407, R407, R411.....
Flow Chart of Troubleshooting 7-6. Speaker Part There is no sound from Speaker No Is the terminal of Speaker O.K.
VIBRATOR SPEAKER MOT+ VBAT U505 D501 1 2 3 YMU_VIB_EN VIN VOUT SPEAKER VIB1 5 BYPASS 4 C502 C500 2 C501 2 2 1 1 SPK1N SPK1P 3 GND VEN VIB2 ZD501 ZD502 1 C503 D(2) D(3) D(4) 23 D(5) 24 22 D(6) 25 21 D(7) 20 19 18 17 G G D2 D3 D4 D5 D6 D7 26 27 28 29 30 31 32 D1 MTR AOUTAN 34 YMU_VIB_EN A(0) CP_OEN R505 D0 /WR 36 16 SPVDD EQ3 U501 /CS EQ2 A0 EQ1 /RD HPOUT-R VBAT 15 14 R500 C504 13 12 R502 C505 C507 C506 R504 11 HPOUT-L/MONO 10 IOVDD 35 C
Flow Chart of Troubleshooting 7-7.
Flow Chart of Troubleshooting 7-8. EGSM transmitter F101pin#7 : about 2~3 dBm? NO CONTINUS TX ON CONDITION NO F101 pin#4 : 3 V? U300 check & change YES TX POWER DAC:500 CODE APPLIED CH:62 RBW : 100KHz VBW : 100KHz SPAN : 10MHz REF LEV. : 10dBm ATT. : 20dB YES NO CON100, C105 check&change C107 ≒ 4~5dBm? YES U101 check & change NO BATTERY, U102 check & change C103 : 3.7 V? YES NO NO R102 check & change Between R102 & U101 : 1.
Flow Chart of Troubleshooting 7-9.
Flow Chart of Troubleshooting 7-10. DCS transmitter CONTINUOUS TX ON CONDITION NO NO F101 pin#5 : about 2~3 dBm? U300 check & change F101 pin#10 : 3 V? YES YES CN100, C105 check&change NO CH : 698CH(DCS),660CH(PCS) TX POWER CODE: 350 CODE APPLIED RBW : 100KHz VBW : 100KHz SPAN : 10MHz REF LEV. : 10dBm ATT. : 20dB L101: ≒ 4~5dBm? YES U101 check & change NO BATTERY, U102 check & change C103 : 3.7 V? YES Between R102 & U102 : 1.
Flow Chart of Troubleshooting 7-11.
Flow Chart of Troubleshooting 7-12. PCS transmitter CONTINUOUS TX ON CONDITION NO NO F101 pin#5 : about 2~3 dBm? F101 pin#10 : 3 V? U300 check & change YES YES CN100, C105 check&change CH : 698CH(DCS), 660CH(PCS) TX POWER CODE: 350 CODE APPLIED RBW : 100KHz VBW : 100KHz SPAN : 10MHz REF LEV. : 10dBm ATT. : 20dB L101: ≒ 4~5dBm? NO YES U101 check & change NO BATTERY, U102 check & change C109 : 3.7 V? YES Between R102 & U101 : 1.
Flow Chart of Troubleshooting 7-17 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
TP101 TP102 C102 G G 6 G 5 C 4 A 3 G 2 1 TX_BAND_SEL C104 C132 VBAT 18 17 G VCC2 G 1 DCS/PCS_IN 16 DCS/PCS_OUT 2 15 BS G 3 TX_EN 4 5 C110 C109 6 G VBATT VCC_OUT CEXT G VRAMP G 71 GSM_IN 8 C106 L102 13 9 ANT 12 11 C100 0 PCSRX 3 PCS_RX DCSRX 1 DCS_RX 5 G 9 C111 R102 C112 DCS|PCSTX C115 R103 GSM_PAM_IN C136 C116 C134 GSM_TX_EN VC2 4 DCS_TX_EN VC3 2 PCS_RX_EN 7 EGSM_RX 11 14 1312 86 C114 VC1 10 EGSM_TX G G G G G C113 Flow Chart of Troubleshooting C1
L110 C137 R104 C117 RF_EN GSM_PAM_IN C119 DCS_PAM_IN C138 C118 9 10 11 12 14 13 15 5 16 (MURATA) 17 RFOH RFOL GND BIN VDD 6 RTX_IN _RESET BIP _PDN RTX_IP VDD XOUT 7 19 C121 C120 20 (MURATA) RFIDN L105 21 U102 3 C122 RFIEP SDIO 22 2 RFIEN _SEN RFIAP 1 SERCLK SCLK 23 C124 RFIAN 24 (MURATA) L107 C142 26 EGSMRX L106 10 5 3 2 G G G G 4 9 IN 8 OUT 7 OUT 1 IN 6 OUT OUT GSM C141 DCSRX DCS L108 F100 XMODE 27 XDIV 28 29 AFC 30 VDD XTAL2 31 VDD 32
