Specifications
42 Intel
®
Atom™ processor CE4100 Ref# 420826
Platform Design Guide
Intel Confidential
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The Intel
®
Atom™ processor CE4100 supports two DDR2/DDR3 SDRAM channels supporting
up to 1GB memory per channel. The design will support 512-Mb, 1-Gb or 2-Gb devices in a
single rank configuration. In support of the design guide, one channel may support one
device density and the other channel may support another configuration. The Intel
®
Atom™
processor CE4100 does not provide support for ECC memory and does not provide support
for DIMM, which means all memory devices are soldered down on the main board. The
Intel
®
Atom™ processor CE4100also does not provide support for registered memory
configurations. Both DDR2/DDR3 channels abide by the JEDEC standard.
This design guide is based upon the 1080 stack-up specification in Section 3.1. Only trace
w
idth, trace length and isolation is emphasized. Timing is not guaranteed if the
recommended stack-up requirements are not met. Customers should perform a detailed
timing analysis when deviating from the recommended stack-up. Spacing given throughout
the recommendations is edge to edge from any other signal.
5.1 Supported Configurations
The memory controller supports a total memory capacity up to 2 GB (across 2 channels).
For DDR2, the controller can support from 128 MB to 1 GB per channel.
Table 5-1. DDR2 DRAMComponent Organization
DRAM Capacity in 1
Channel
DRAM Component
Density
Component Width Numbers of
components (per
channel)
256 Mb x8 4
128 MB
512 Mb x16 2
512 Mb x8 4
256 MB
1 Gb x16 2
1 Gb x8 4
512 MB
2 Gb x16 2
1 GB 2 Gb x8 4
For DDR3, the controller can support from 128MB to 1 GB per channel
Table 5-2. DDR3 DRAMComponent Organization
DRAM Capacity in 1
Channel
DRAM Component
Density
Component Width Numbers of
components (per
channel)
128MB 512Mb x16 2
512Mb x8 4
256 MB
1 Gb x16 2
1 Gb x8 4
512 MB
2 Gb x16 2
1 GB 2 Gb x8 4










