PLASMA DISPLAY TV Chassis : Model: PLASMA DIAPLAY TV D53A(P) PS42P2SDX/XEC CONTENTS 1. Precautions 2. Reference Information 3. Specifications 4. Alignment and Adjustments 5. Circuit Operation Description 6. Troubleshooting 7. Exploded View and Parts List 8. Electric Parts List 9. Handling Description 10. Glossary 11. Wiring Diagram 12.
Precautions 1. Precautions Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays. 1-1 Safety Precautions 1. Be sure that all of the built-in protective devices are replaced. Restore any missing protective shields. 2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including: nonmetallic control knobs and compartment covers. 3.
Precautions 1-2 Safety Precautions (Continued) 8. High voltage is maintained within specified limits by close-tolerance, safety-related components and adjustments. If the high voltage exceeds the specified limits, check each of the special components. 9. Design Alteration Warning: Never alter or add to the mechanical or electrical design of this unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Precautions 1-3 Servicing Precautions Warning 1 : First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the servicing and safety precautions, always follow the safety precautions. Warning 2 : An electrolytic capacitor installed with the wrong polarity might explode. 1. Servicing precautions are printed on the cabinet. Follow them. 2.
Precautions 1-4 Precautions for Electrostatically Sensitive Devices (ESDs) 1. Some semiconductor (“solid state”) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs); examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity. 2.
Reference Information 2.
Reference Information Table 2-2 Table of Acronyms ABL AC ACC AF AFC AFT AGC AM ANSI APC APC A/V AVC BAL BPF B-Y CATV CB CCD CCTV Ch CRT CW DC DVM EIA ESD ESD FBP FBT FF FM FS GND G-Y H HF HI-FI IC IC IF 2-2 Automatic Brightness Limiter Alternating Current Automatic Chroma Control Audio Frequency Automatic Frequency Control Automatic Fine Tuning Automatic Gain Control Amplitude Modulation American National Standards Institute Automatic Phase Control Automatic Picture Control Audio-Video Automatic Volume C
Specifications 3. Specifications 3-1 Display(PDP Monitor) MODEL SCREEN SIZE Dimensions (mm/inch) PS-42P2S 16:9 Display 1039(W) x 89(D) x 635(H)/40.9(W) x 3.5(D) x 25(H) Remote Control 54(W) x 31.5(D) x 220(H)/2.13(W) x 1.24(D) x 8.66(H) Display 32Kg/70.54\bs Remote Control 150g/0.
MENO 3-2 Samsung Electronics
Alignment and Adjustments 4. Alignment and Adjustments 4-1 Service Mode 4-1-1 SERVICE MODE ENTRY METHOD (General Transmitter) 1. Turn off the power to make the SET STAND-BY mode. 2. In order to enter the Service Mode, select MUTE-1-8-2-POWER. ✳ In case entry into SERVICE MODE is unsuccessful, repeat the procedures above. 4-1-2 Initial DISPLAY State in times of SERVICE MODE Switch overs 4-1-2(A) OSD DISPLAY 1. PWS364A 2. VPC3230 3. SDA9400 4. SDA9280 5. AD9884-Video 6. AD9884-DTV/PC 7. CXA2101Q-1 8.
Alignment and Adjustments 4-1-3 Details of Control 4-1-3(A) PW364A No OSD Item Range Default Description 1 H Position H Position 0 ~ 127 30 H-Position(The Picture moves left when the value increase) 2 V Position V Position 0 ~ 84 34 V-Position(The Picture moves up when the value increase) 3 Red Gain Red Gain 0 ~ 255 116 High Light Adjustment(Variable) 4 Green Gain Green Gain 0 ~ 255 116 High Light Adjustment(Variable) 5 Blue Gain Blue Gain 0 ~ 255 116 High Light Adjustmen
Alignment and Adjustments 4-1-3(C) SDP9400 No OSD Item Range Default Description 1 SNR On SNR On 0, 1 1 Spatial Noise Reduction 2 VCSNR On VCSNR On 0, 1 1 Vertical Spatial Noise Reduction 3 HCSNR On HCSNR On 0, 1 0 Horiz, Spatial Noise Reduction 4 DTNR On DTNR On 0, 1 1 Frame/Field Selection 5 TNRCLY TNRCLY 0 ~ 15 5 6 TNRCNC TNRCNC 0 ~ 15 5 4-1-3(D) SDA9280 No OSD Item Range Default 1 CTI Thresh CTI Thresh 0 ~ 15 0 2 CTI Trawid CTI Trawid 0 ~ 15 0 3 Y-
Alignment and Adjustments 4-1-3(F) AD9884 DTV/PC No OSD Item Range Default Description 1 Red Gain Red Gain 0 ~ 255 125 PC Mode W/B (Fixed) 2 Green Gain Green Gain 0 ~ 255 128 PC Mode W/B (Fixed) 3 Blue Gain Blue Gain 0 ~ 255 127 PC Mode W/B (Fixed) 4 Red Offset Red Offset 0 ~ 63 40 PC Mode W/B (Fixed) 5 Green Offset Green Offset 0 ~ 63 32 PC Mode W/B (Fixed) 6 Blue Offset 0 ~ 63 39 PC Mode W/B (Fixed) Range Default Blue Offset 4-1-3(G) CXA2101Q-1 No 4-4 OSD Ite
Alignment and Adjustments 4-1-3(H) CXA2101QQ-2 No OSD Item Range Default 0, 1 1 Description 1 HS Mask HS Mask 2 Sub Cont Sub Contrast 0 ~ 15 7 3 Sub Color Sub Color 0 ~ 15 5 4 Sub Hue Sub Hue 0 ~ 15 8 5 Sub SHP Sub SHP 0 ~ 4 2 6 R-Y/R R-Y/R 0 ~ 15 13 7 R-Y/B R-Y/B 0 ~ 15 15 8 G-Y/R G-Y/R 0 ~ 15 8 9 G-Y/B G-Y/B 0 ~ 15 4 4 (PAL), 8 (NT) 10 PABL Level PABL Level 0 ~ 15 8 Peak ABL 11 SHP FO SHP FO 0 ~ 4 2 Sharpness FO Selection 12 Pre/over Pre
Alignment and Adjustments 4-1-3(J) OSD POSITION No OSD Item Range Default Description 1 Horiz Horiz(Left, Right) 8 ~ 104 104 Move 8 by 8 (Total : 12 Step), Fixed 2 Vert Vert(Up, Down) 8 ~ 40 40 Move 8 by 8 (Total : 4 Step), Fixed 4-1-3(K) TEST PATTERN No OSD Range Default 1 Pseudo Color Bar 0 ~ 15 - 2 Luma Ramp 0 ~ 15 - 3 White 16 0 ~ 15 - 4 White 90 0 ~ 7 - 5 White 240 0 ~ 15 - 6 Red 0 ~ 15 - 7 Green 0 ~ - 8 Blue 3 0, 1 Description - 4-1-3(L) OPTION T
Alignment and Adjustments 4-1-4 White Balance Adjust Method 1. Press MUTE-1-8-2-POWER to enter the factory mode. 2. Enter PW364A. 3. Adjust LOW coordinates as R, G, OFFSET and HIGH coordinates as R, G, GAIN.(Blue is fixed) 4. Adjust LOW light as Center Offset. 5. Adjust HIGH light as Gain Max. 6. Adjust fine as B-Offset and B-Gain. - W/B Adjustment SPEC(Suwon Factory Toshiba PATTERN) ➣ VIDEO MODE Adjustment Coordinates Coordinates Value Adjustment Deviation H-LIGHT x : 282 y : 296 Y : 24.
4-8 18.631 21.333 20.800 26.400 28.444 14.561 16.660 600 600 600 600 600 800 800 800 800 800 1024 768 1024 768 7 8 9 10 11 12 13 20.677 31.777 480 640 6 1024 768 26.413 480 640 5 15 26.667 480 640 4 17.707 23.111 480 640 3 1024 768 31.777 350 640 2 14 31.777 400 720 806 806 800 808 625 628 666 625 631 525 520 500 509 449 449 0 0 1 1 1 1 1 1 0 0 0 0 1 0 0 0 1 1 1 1 1 1 0 0 0 0 0 1 HS1Period 65.000 75.000 78.
Alignment and Adjustments 4-3 Discharge Voltage Adjustment Method (Monitor) in Times of ASS’Y Repair and Replacement -All VR (Variable Resistor), except for VR for Vs, voltage goes down when turned counterclockwise.
Alignment and Adjustments ● Vw Adjustment Method ■ Vw is the voltage of the right terminal for R4414 ■ Voltage adjustment is made for Vw by using VR4400 ■ Standard voltage for Vw is 175V±5V 4-10 Samsung Electronics
Alignment and Adjustments 4-4 Fault Finding Using MULTI METER Parts defects can be found for DIODE TRANSISTOR IC, using MULTI TEST including Forward/Reverse direction Multi Test. Of course, in case resistance of several ohms and COIL are connected in parallel circuit, the lock out circuit parallel connected to part must be severed. 1.DIODE + - Between Anode and Cathode + - Forward Direction Reverse Direction Hundreds of ohms Infinity 2.
Alignment and Adjustments 3. IC (INTEGRATED CIRCUIT) IC has built in DIODE against overvoltage in PIN. Generally, except for internal circuit defects, IC defects can be found, by measuring the DIODE. Forward Direction Reverse Direction Hundreds of ohms Varying depending on IC but generally normal Infinity in DIODE TEST MODE ✴ Defects have SHORT(0 ohm) for both forward and reverse direction.
Circuit Operation Description 5. Circuit Description 5-1 Power supply 5-1-1 Outline(PDP SMPS) Considering various related conditions, the switching regulator with good efficiency and allowing for its small size and lightweight was used as the power supply for PDP. Most of the power supply components used forward converter, and Vsamp and Vsb used simple flyback converter.
Circuit Operation Description Table 2. Specifications to Protect PDP SMPS Division OCP Current OVP Voltage Short Circuit Vs 5A 195V O.K Va 2A 90V O.K +5V 10A 6.2V O.K 5-1-2(C) FUNCTION OF BOARD (1) Remote control Using 250V/ 10A relay, the board makes remote control available. (2) Free voltage The board designed so that input voltage can be used within 90 VAC to 264VAC.
Circuit Operation Description 5-1-2(D) PDP-PS-42 BLOCK DIAGRAM Samsung Electronics 5-3
Circuit Operation Description (1) AC-DC Converter PDP-42PS outputs +400V DC from the common AC power supply using the active PFC booster converter. This converter is designed for improving the power factor and preventing the noise with high frequency and finally becomes the input power system for the switching regulator on the output side. (2) Auxiliary Power Supply The auxiliary power supply is a block generating power of •Ï-com for remote controlling.
Circuit Operation Description 5-1-3(B) THE RELATION BETWEEN POWER CONSUMPTION AND POWER CONVERSION Efficiency The power consumption and the power conversion efficiency of SMPS affect protection against heat and system operation much. [ If the power conversion efficiency of 100W SMPS is 70%, is the power loss of internal circuit 30W? ] Output power consumption Po is determined by the multiplication of DC output voltage Vo and output current Io.
Circuit Operation Description 5-1-3(C) PFC (Power Factor Correction) Circuit Descriptions The current electric devices use DC power supply and require a rectifier circuit converting AC into DC. As most rectifier circuits apply a capacitor input type, the rectifier circuit becomes the core of the occurrence of harmonics with lower reverse rate.
Circuit Operation Description The architecture and the pulse of active boost PFC 5-1-3(D) CONCLUSION Although SMPS (Switching Mode Power Supply) enables small lightweight high-power consumption power design, it is hard to be used when stability and precise control are required. Power stage for PDP can be designed using the lightweight SMPS feature. It is important to design SMPS considering system load, stability, and related international standards.
Circuit Operation Description 5-2 Driver Circuit 5-2-1 Driver Circuit Overview 5-2-1(A) WHAT IS THE DEFINITION OF DRIVE CIRCUIT? It is a circuit generating an appropriate pulse (High voltage pulse) and then driving the panel to implement images in the external terminals (X electrode group, Y electrode group and address electrode), and this high voltage switching pulse is generated by a combination of MOSFET’s.
Circuit Operation Description 5-2-1(C) TYPES AND DETAILED EXPLANATION OF DRIVE DISCHARGES (1 ) Sustaining discharge Sustaining discharge means a self-sustaining discharge generated by the total of the sustaining pulse voltage (usually, 160~170V) alternately given to X and Y electrodes during the sustaining period and the wall voltage that varies depending upon pixels' previous discharge status.
Circuit Operation Description 5-2-2 SPECIFICATION OF DRIVE PULSES 5-2-2(A) DRIVE PULSES 5-10 Samsung Electronics
Circuit Operation Description 5-2-2(B) FUNCTIONS OF PULSES (1) X rising ramp pulse Just before X rising ramp pulse is impressed, the last Y electrode sustain pulse of previous sub field is impressed. The pulse causes sustain discharge. Consequently, positive wall charge is accumulated in X electrode, and negative wall charge is accumulated in Y electrode. X rising ramp erases wall charge produced by the last sustain discharge pulse using weak-discharge.
Circuit Operation Description 5-2-3 Configuration and Operation Principles of Driver Circuit 5-2-3(A) FUNCTIONS OF EACH BOARD Y-Buffer (Upper) Y Drive board X Drive board - Sustain pulse (Energy recovery) - Rising ramp pulse - Falling ramp pulse - Vscan pulse - Sustain pulse (Energy recovery) - Rising ramp pulse - Ve bias Y-Buffer (Lower) Y-electrode blocks (6 blocks) COF X-electrode blocks (3 blocks) (1) X board X board is connected to the panel’s X-electrode blocks, 1) generates sustain voltage
Circuit Operation Description 5-2-3(B) DRIVING BOARD'S BLOCK DIAGRAM (1) Y POWER 220V 75V 17V 170V (2) X POWER 220V 17V 170V Samsung Electronics 5-13
Circuit Operation Description ➣ Components of driving board's operations 1. Power supply 1) Supplied from the power supply board - For sustaining discharge: 180V; - For logic signaling buffer: 5V; and - For gate driver IC: 15V. 2) Generated by the internal DC/DC part - For generating Vw pulse: 180V. 2. Logic signal 1) Supplied from the logic board - Gate signals for FETs.
Circuit Operation Description 5-2-3(C) PRINCIPLES OF FET’S OPERATION AND HIGH VOLTAGE SWITCHIng ❏ FET’s operation principles (1) With signal impressed on the gate (Positive voltage), FET gets short-circuited (a conducting wire of zero (0) resistance); and (2) With no signal impressed on the gate (GND), FET gets open-circuited (a non-conducting wire of ∞ resistance).
Circuit Operation Description 5-2-3 (D) DRIVER CIRCUIT DIAGRAM 5-16 Samsung Electronics
Circuit Operation Description 5-2-3(E) DRIVER BOARD CONNECTOR LAYOUT Samsung Electronics 5-17
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Circuit Operation Description 5-3 Logic part 5-3-1 Logic Board Block diagram Samsung Electronics 5-31
Circuit Operation Description 5-3-1(A) TDESCRIPTION OF LOGIC BOARD The logic board consists of the logic main board and the buffer board. The logic main board processes video signal, generates, and output address driver output signal as well as XY drive signal. The buffer board stores address driver output signal, and sends the signal to the address driver IC (COF module).
Circuit Operation Description No Name 1 LVDS Connector 2 Operation LED 3 Key-Scan Connector 4 256k 5 Y Connector Connector to output Y drive board control signal 6 X Connector Connector to output X drive board control signal Function Input connector to receive encoded RGB, H, V, DATAEN, and DCLK signal. It shows Sync and clock are properly received by the logic board. Connector to connect key scan board to check and adjust 256K data.
Circuit Operation Description (1) First, perform eye-inspection and short circuit inspection for the power stage of the logic board to examine. Then, perform the following examinations on the board in order if no problem was found. (2) Replace IC2017(256K EEPROM) of the logic board with Test EERPOM. Change the clock setting of the logic board to internal referring to the configuration procedures described below.
Circuit Operation Description 160mm LA03 31 1 CN01 LD1 LD2000 IC1 IC2 F1 256k D1 F2 320mm D2 M1 E1 IC3 M2 TP31 GND7 L Y 1 LX1 LE01 LE02 Figure 2. Layout of 42" Signal Logic Main Board.
Circuit Operation Description (1) Checking Y S /W Figure 3. Connecting The Logic Main Board and The Test JIG Board Figure 4.
Circuit Operation Description ! Connect Probe 2 to LY1 30 of The JIG Board (8 (LE-Y) of The Logic Main Board F2016). @ Connect Probe 2 to LY1 28 of The JIG Board (7 (STB_Y) of The Logic Main Board F2016). # Connect Probe 2 to LY1 25 of The JIG Board (6 (TCS_Y) of The Logic Main Board F2016).
Circuit Operation Description $ Connect Probe 2 to LY1 24 of The JIG Board (5 (CLK_Y) of The Logic Main Board F2016). % Connect Probe 2 to LY1 21 of The JIG Board (8 (SIB) of The Logic Main Board F2016). ^ Connect Probe 2 to LY1 20 of The JIG Board (7 (SIA) of The Logic Main Board F2016).
Circuit Operation Description & Connect Probe 2 to LY1 14 of The JIG Board (5 (YSP) of The Logic Main Board F2016). * Connect Probe 2 to LY1 13 of The JIG Board (6 (YSC) of The Logic Main Board F2016). ( Connect Probe 2 to LY1 10 of The JIG Board (7 (YER) of The Logic Main Board F2016).
Circuit Operation Description ) Connect Probe 2 to LY1 9 of The JIG Board (8 (YP) of The Logic Main Board F2016). 1 Connect Probe 2 to LY1 8 of The JIG Board (6 (YRR) of The Logic Main Board F2016). 2 Connect Probe 2 to LY1 5 of The JIG Board (5 (YG) of The Logic Main Board F2016).
Circuit Operation Description 3 Connect Probe 2 to LY1 4 of The JIG Board (8 (YF) of The Logic Main Board F2016). 4 Connect Probe 2 to LY1 2 of The JIG Board (6 (YR) of The Logic Main Board F2016). 5 Connect Probe 2 to LY1 1 of The JIG Board (5 (YS) of The Logic Main Board F2016).
Circuit Operation Description 6 Connect Probe 2 to 1 and 72 of IC2005, and Check The Following Waveform Shows at Oscilloscope. 7 Connect Probe 2 to 1 and 72 of IC2006, and Check The Following Waveform Shows at Oscilloscope. 8 Connect Probe 2 to 1 and 81 of IC2007, and Check The Following Waveform Shows at Oscilloscope.
Circuit Operation Description 9 Connect Probe 2 to 1 and 81 of IC2008, and Check The Following Waveform Shows at Oscilloscope.
Circuit Operation Description (1) Checking X S /W ! Connect Probe 2 to LX1 2 of The JIG Board (6 (XRR) of The Logic Main Board F2016). @ Connect Probe 2 to LX1 4 of The JIG Board (7 (XR) of The Logic Main Board F2016). # Connect Probe 2 to LX1 6 of The JIG Board (8 (XS) of The Logic Main Board F2016).
Circuit Operation Description $ Connect Probe 2 to LX1 8 of The JIG Board (5 (XF) of The Logic Main Board F2016). % Connect Probe 2 to LX1 10 of The JIG Board (6 (XG) of The Logic Main Board F2016).
Circuit Operation Description ■ 42°”SD logic buffer board T/S Required test equipment : -.Oscilloscope (digital 400 MHz 2 channel or more) Other equipment : -.DC power supply (5V : 1EA ) -.Multi meter -.Logic board : 1EA -.Sub-PCB ASS'Y for JIG: 1 EA (1) First, perform eye-inspection and short circuit inspection for the power stage of the logic board to examine. Then, perform the following examinations on the board in order if no problem was found.
Circuit Operation Description Figure 5.
Circuit Operation Description (3) Checking buffer data ! TP 13 ~ 18, 49 ~ 54 of The Test JIG Board @ 21, 57 of The Test JIG Board # 24, 31, 60, 67 of The Test JIG Board 5-48 Samsung Electronics
Circuit Operation Description $ TP 25, 32, 61, 68 of The Test JIG Board % TP 19, 26, 55, 62 of The Test JIG Board ^ TP 20, 27, 56, 63 of The Test JIG Board Samsung Electronics 5-49
5-50 MA IN_C MA IN_Y CVBS 3( L / R) Audi o I n RS- 232 RS232C ( 9pi n,MAL E) PC_R, PC_G, PC_B, PC_H, PC_V ( 15pi n D- SUB) ADC ( Audio Pr oc es s or TDA7429S I 2C ) FI FO VPC3230 Dec oder Video PI P VPC3230 Dec oder Video PC_H, PC_V Y DTV YPr Pb(DVD) CVBS, Y MAI N Sub PCB for Audio Y DVD CVBS R, G, B, F B PCF 8591 I 2C S1_DET PC I nput #8 I D Sc art DVD VPC3230 ( 480i ) DTV Com ponent Input RCA ( Y/ C) S-Vi deo ( CVBS) Vi deo I 2C ( YPr Pb( DTV) I VVS I VHS SDA
Circuit Operation Description 5-5 Major In/Out Signal Waveforms and Voltages of the Unit 5-5-1 In/Out Waveforms ❏ Y output waveform - It is the waveform when it is not connected to the panel.
Circuit Operation Description ❏ X output waveform - It is the waveform when it is not connected to the panel.
Circuit Operation Description 5-6 Main I/O signal pules and voltages 5-6-1 Signal Pulses of Image Board(Input Signal Conditions : 7 Color bar) Samsung Electronics 5-53
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MEMO 5-56 Samsung Electronics
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Troubleshooting 6.
Alignment and Adjustments 6-2 Partly no screen Power on Upper part no screen Yes Replace Upper Scan Buffer B d No Lower part no scree Yes Replace Lower Scan Buffer B d No 1//14 Screen part Abnormal Yes Replace Corresponding Address Buffer B d No 1/28 no screen Yes Replace Panel No 1/7 no screen 6-2 Yes Replace Panel Samsung Electronics
Troubleshooting 6-3 Checking the Board (Unit) 6-3-1 Y buffer - To check the main board, you have to check the Y buffer first. - After separating Y Main and Y buffer board, - Check the Diode between OUTL and OUTH, and make sure that the forward voltage drop is between 0.4 and 0.5V. - Check that the resistance between the two terminals is more than several kW.
Troubleshooting 6-3-2 Y Main - After connecting Y main and Y buffer board, check that one of the output waveforms from OUT 1, 2, 3 or 4 is the same as that of the appendix 1 when power is supplied.
Troubleshooting 6-3-3 X Board - Check that one of the output waveforms from X-OUT 1 or 2 is the same as that of the appendix 2 when power is supplied.
Troubleshooting 6-3-4 SMPS - Check output voltage.
Troubleshooting 6-3-5 Scaler Borad 1. PW364 Input Clock (1) MCKEXT Check IC406(IC502) pin 5. Power on : MCKEXT = 97.5MHz Standby : MCKEXT = 48.75MHz (2) MCKEXT, DCKEXT Check IC407(ICS502) pin 25. DCKEXT = 65MHz (3) VCLK Check IC203(SDA9400) pin 26. VCLK = 27MHz (4) GCLK Check IC401(AD9884) pin 115(TP404). GCLK is differently seen according to PC input signal format(VGA, SVGA, XGA) GCLK = 15MHz ~ 50MHz(This value is apparently half of the clock frequency of the relevant PC input signal format. 2.
Troubleshooting 5. AD9884(IC801) - Check power is supplied(3.3V). - Check I2C-bus(pins 29, 30) - Check Video signal is input. - Check the input signal 2HS (pin 40 or TP406) - Check the output signal VHS (pin 117 or TP409) - Check the output signal VCLK (pin 115 or TP408) - Check digital data input. 6. PW364 Reset - When the Reset switch is pressed. if OTP01(29LV160T) pin 28(TP151) undergoes ransition. PW364 operates and OTP01 also does. Unless transition happens, it means PW364 is not operating. 7.
Exploded View & Parts List 7.
Electrical Parts List 8. Electrical Parts List 8-1 PS42P2SDX/XEC Level Loc. No Code No. Description ; Specification Remark ASSY CHASSIS 1 ! ! ! ! ! ! ..2 ...3 ...3 ...3 ...3 ...3 ..2 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ....4 ...3 ...3 ...3 ..2 ...3 ...3 ...3 ...3 ...3 ...
Electrical Parts List Level Loc. No .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....
Electrical Parts List Level Loc. No. .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 ....
Electrical Parts List Level Loc. No .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....
Electrical Parts List Level Loc. No. Code No. .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 ! .....5 ! .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 ! .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 ..
Electrical Parts List Level Loc. No .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....
Electrical Parts List Level Loc. No. .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 ....
Electrical Parts List Level Loc. No .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 .....5 ...3 ...3 ..2 ..2 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ..2 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ...3 ....4 ....4 ....4 ....4 ...3 ..2 ..2 ..2 ..2 ..
Electrical Parts List Level Loc. No. ...3 ..2 ...3 ...3 ...3 ...3 ...3 ..2 ...3 ...3 ...3 ...3 ...3 ..2 ...3 ...3 Code No. Description ; Specification AA61-01044ABRACKET-FINGER;PDP,BE-CO,T0.15,NTR AA61-01061ABRACKET-FILTER SIDE L,ASSY;AL 6063 EXT,4 AA72-00018ASPONGE-EMI,FILTER;42P2,SHIELD-FORM,T1.2, AA63-00406B GROMMET-PANEL;PDP,PBT,T0.2 AA61-01064ABRACKET-EMI,FILTER;PDP,SPTE,T0.3,L62.6, AA61-01051ABRACKET-FILTER,SIDE L;42P2,AL 5051,T1.5 AA61-01044ABRACKET-FINGER;PDP,BE-CO,T0.
MEMO 8-10 Samsung Electronics
Samsung Electronics CN5001 (13P) CN5006 (12P) CN5406 CN5405 CN5003 (13P) CN5004 (12P) CN5506 CN5505 EC1 (40P) CN5005 (12P) CN5504 Y CN5007 (12P) CN5404 EC2 (40P) CN5002 CN5008 (13P) LD1 (4P) EC3 (40P) LY1 (30P) LX1 EL1 LE01 LOGIC LA03 (31P) EL2 Speaker S Y SX X EC7 (40P) CN4005 (13P) CN4004 (12P) FE3 (3P) FE1 (40P) EC5 (40P) EC6 (40P) SMPS CN1 (3P) EF2 EF1 EC4 (40P) LE02 SA SL BUFFER (5P) LP1 CN609 (12P) SOUND CN602 (9P) CN603(4P) Terminal CN812 (3P) CN606 (5P) R
Wiring Diagram MENO 11-2 Samsung Electronics
Schematic Diagrams 12.
Schematic Diagrams 12-2 SCALER2 VIDEO DECODER MAIN, PROGRESSIVE CON.
Schematic Diagrams 12-3 SCALER3 VIDEO DECODER PIP, FIRST IN/OUTPUT Samsung Electronics 12-3
Schematic Diagrams 12-4 SCALER4 VIDEO DA CON.
Schematic Diagrams 12-5 SCALER5 VIDEO PROCESSOR, SAND CASTLE PULSE GEN.
Schematic Diagrams 12-6 SCALER6 ADC(VIDEO) TP18 HS-OUT TP19 VHS TP19 TP20 TP20 VCLK TP18 12-6 Samsung Electronics
Schematic Diagrams 12-7 SCALER7 ADC(PC) TP21 MHSYNC TP22 TP23 TP22 MHS TP23 PCLK TP21 Samsung Electronics 12-7
Schematic Diagrams 12-8 SCALER8 PW364 TP20 VCLK TP23 PCLK TP23 TP24 MCKEXT TP25 DCKEXT TP24 TP25 TP20 12-8 Samsung Electronics
Schematic Diagrams 12-9 SCALER9 POWER, DEGUGER, MEMORY, REMOCON, RS232, RTC Samsung Electronics 12-9
Schematic Diagrams 12-10 SCALER10 MEGA TTX, CAPTION 12-10 Samsung Electronics
Schematic Diagrams 12-11 SOUND Samsung Electronics 12-11
Schematic Diagrams 12-12 LINE-FILTER, POWER SW, SPEAKER TERMINAL LINE-FILTER 12-12 POWER SW SPEAKER TERMINAL Samsung Electronics
Schematic Diagrams 12-13 CONTROL, REMOCON CONTROL REMOCON Samsung Electronics 12-13
Handling Description 9. Handling Description 9-1 Basic Description 9-1-1 The Name of Each Part 9-1-1(A) PDP(Plasma Disply Panel) Front Panel SPEAKER SPEAKER POWER Remote Control Signal Receiver Press to turn the PDP on and off. Aim the remote control towards this spot on the PDP. SOURCE External input selection. MENU Menu display. - VOLUME + Volume adjustment. SELECT Control the cursor in the Menu. MUTE Temporary sound switch-off.
Handling Description Real Panel a) External Speaker Outputs (8‰) Connect external speakers. b) S-VIDEO Input Connect a S-Video signal from an S-VHS VCRs or DVD players. c) VIDEO Input Connect a video signal from external sources like VCRs or DVD players. 9-2 d) PC Input Connect a PC signal from an PC. e) SCART Audio/Video Input Connect a audio/video signal from external sources like VCRs. f) Audio Inputs (Video/PC) Connect a audio signal from external sources like VCRs or PC.
Handling Description 9-1-1(B) REMOTE CONTROL Filp the cover open in the arrow direction.
Handling Description 9-2 Wall Mount 9-2-1 Notice for installing 1. Do not install the PDP on any place other than veritical walls. 2. To protect the performance of the PDP and prevent problems, avoid the following place : ● ● ● ● Next to spring coloer detectors. Places subject to vibration or shock. Near high voltage cables. Around heating apparatus. 3. Install the PDP considering the construction of the wall. 4. Use only recommended parts and components for installation.
Handling Description 9-2-3 Installing the Display on the Wall Attachment Panel : 1. Check for the stability of the wall where the PDP is to be installed. If the wall is not enough strong to support the PDP, strengthen the wall before installation. 2. Fix the wall attachment panel on the wall using bolts as shown in the figure: Fixing bolts must protrude from the wall appox. 0.6 inches. 3. Using the wall attachment panel, you may adjust the angle of the display from 0 to 20 degrees.
Handling Description 4. Remove four large screws from the rear side of the display. Insert the bolts, dish-type washers, and insulation rubber into the four screw-holes as shown in the figure: Bolt Insulation rubber 5. Put the insulation rubber point protruding from the rear top of the display in the groove on the top of the wall attachment panel.
Handling Description 9-2-4 Separating the Display from the Wall Attachment Panel : Remove the fixing bolts from both sides(left and right) of the wall attachment panel. Lift and pull thebottom of the display a small amount, to separate the insulation rubber point from the bottom of the wall attachment panel. Lift the display and separate the insulation rubber point from the groove on top of the wall attachment panel.
MEMO 9-8 Samsung Electronics
Glossary 10. Glossary AC PDP : Plasma display driven by alternating current plasma electric discharge. Address discharge(Reference : scan and data) : Term with two meanings that can be used for both scan and data (write or erase) discharge. Address Electrode(Reference : scan and data electrode) : Term with two meanings that can be used for both scan and data electrodes.
Glossary Barrier rib : barriers that cross all the gaps of wafers dividing the cells in panel. Black stripe : black substance located in between the fluorescent areas to bring about improvement in contrast by reflection ratio decline. Generally, this is striped. Bright defect : defects that occur when the image is rather bright than accurate. Brightness(Reference : luminance) : visible and subjective quality, for example, how bright matters look or how much visible rays are perceived.
Glossary Color coordinates, CIE 1960 : Method for colors, known as (u, v), where image colors are expressed in more even color dimension. colors of matter are expressed as color coordinates pair(u, v). Here, u=4X(X+15Y+32), y=6Y/(X+15Y+32Z). Color coordinates, CIE 1976 Method for colors, known as (u’, v’), where revised image colors are expressed in more even color dimension. v’ is 1.5-fold of recommended v value of 1960. The color of matter is expressed as color coordinates pair (u’, v’).
Glossary ■ Cm - Michelson contrast or contrast modulation: Here, Lw is the luminance of the color white while Lb is the luminance of the color black. ■ CT - Threshold contrast ratio: the minimum contrast ratio that is permissive, in general. Chip on board(COB) : PCB with IC on substrate. Dark defect : Defects in the brighter image realization than normal one.
Glossary Displacement current : Electric current flow through capacitor that includes atomic rearrangement of discharge within electric matter. Display color number (color number possible to be displayed with other words.) : displayable individual color’s number. Display Diagonal : Diagonal size of display contour Display efficiency : The ratio of gloss output divided by the entire display power.
Glossary Erase voltage : Erase pulse voltage required for erasing cells from AC plasma panel.[symbol : Ve] Evacuating (Interchangeable terms : evacuation, exhaust) : Process where unwanted gas is rid from device. Exhaust tubulation (Interchangeable terms: exhaust tube, exhaust pipe) : Tube shaped hole in device connected to external vacuum pump, for controlling the initiation from device during process.
Glossary Image sticking : (Refer to Image retention.) Interconnect pad groups : A group of connection terminals that attach to individual connector. (also referred to as terminal block.) Interconnect pad pitch : Mutual measurements for individual of interconnect pad group. Interconnect pad spacing : The size of non-electric conductive area between individual terminal. Inter-electrode gap : In Three electrodes plasma panel, the measurement of sustained voltage separated from outside discharge space.
Glossary Memory margin : The disparity between the maximum sustained voltage for keeping discharge and the sustained voltage for turning off the cells Memory type PDP : Refer to AC Plasma Panel that has memory. PDP made up of cells that keep turned on or off until switch occurs. MgO layer : In bombardment of electrons and ions, MgO’s high electron release rate, like cathode application, makes it easier to release electrons.
Glossary Phosphor degradation : Gradual decline in fluorescence efficiency according to operating expectancy. Phosphor layer : Thin layer made up of phosphor. FluorescencPle substance must be thick enough to optimize transferring the ultraviolet rays from plasma discharge to visible light Pixel, picture element : The smallest unit that can display the entire range of luminance and chromaticity. Generally, pixel consists of sub pixels (or dots). Pixel arrangement : Expression of sub pixels within a pixel.
Glossary Reset : (Refer to erase.) Reset discharge, Reset pulse : (Refer to erase.) Resolution : Display’s ability to enable to distinguish the matters close to each other. It is confusing with addressibility that generates pattern undistinguishable to the eyes. Row electrodes : Horizontally successive electrodes. In terms of traditional drive concept, these are the sustained electrodes. If the panel is installed toward portrait, these row electrodes can be arranged horizontally.
Glossary Space charge : Mutual repulsion caused by accumulation of electric charge of similar signal. Stripe rib : Stripe shaped partition structure. It follows panel column direction. Sub frame : (Refer to sub field) Sub field : A part of panel Surface charge : It refers to the location of discharge in AS plasma panel where sustained electrodes are on the same surface. Surface charge PDP : AS plasma panel where sustained electrodes are on the same surface.
Glossary Tip pipe : (Refer to exhaust turbulation.) Townsend discharge : Self sustained plasma discharge expressed by Townsend in 1901. This discharge requires 200v voltage. Transparent electrode : Electrode made up of transparent electric conductive matter such as ITO. Two eledtrode type : Original AC plasma panel used two electrodes that provide not only sustained waveform but also write and erase waveform. Ultraviolet ray : Ultraviolet light below 380nm in spectrum.
Glossary Write electrode : (Refer to data electrode)[symbol : Pw] Write electrode : (Refer to data electrode)[symbol : Vw] Samsung Electronics 10-13
MEMO 10-14 Samsung Electronics
ELECTRONICS © Samsung Electronics Co., Ltd. Jan.
