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Rev.1.0, May. 2011

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MMBTFxxGUBCA-xMExx

Samsung SD & MicroSD Card product family

SDA 3.0 specification compliant-Up to High Speed mode

datasheet

Summary of content (31 pages)

PAGE 1
Rev.1.0, May. 2011 MMBTFxxGUBCA-xMExx Samsung SD & MicroSD Card product family SDA 3.0 specification compliant-Up to High Speed mode datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.
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MMBTFxxGWBCA-xMExx Rev. 1.0 datasheet SD Card Revision History Revision No. 1.0 History 1. Customer sample acquired -2- Draft Date Remark Editor Jun, 02. 2011 Final S.M.
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MMBTFxxGWBCA-xMExx datasheet Rev. 1.0 SD Card Table Of Contents 1.0 INFORMATION ........................................................................................................................................................... 4 2.0 PRODUCT LINE-UP ................................................................................................................................................... 4 3.0 INTRODUCTION ...................................................................................
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 1.0 INFORMATION M X X X X X X X X X X X - X X X X X 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Module: M 12. PCB Revision and Production site. A : None (SEC) B : 1st Rev. (SEC) C : 2nd Rev. (SEC) D : 3rd Rev. (SEC) P : None (STS) Q : 1st Rev. (STS) R : 2nd Rev. (STS) U : None(ATP) V : 1st Rev.(ATP) W : 2nd Rev.(ATP) Y : None(SPIL) 2. Module Configuration C : Flash Card (SLC) E : Flash Card (OneNAND) M : Flash Card (MLC) 3~4.
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MMBTFxxGWBCA-xMExx Rev. 1.0 datasheet SD Card 3.0 INTRODUCTION 3.1 General Description The SD/microSD is a memory card that is specifically designed to meet the security, capacity, performance and enviroment requirements inherent in newly emerging audio and video consumer electronic devices. The SD/microSD will include a copyright protection mechanism that complies with the security of the SDMI standard and will be faster and capable for higher Memory capacity.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 4.0 PRODUCT SPECIFICATION 4.1 Current Consumption This information table below provides current consumption of Samsung SD/microSD Card. Current consumption is measured by averaging over 1 second. [Table 4-1] : Current Consumption Table Mode Max. Interface Frequency Default Mode 25Mhz High Speed Mode 50Mhz Operations Max. Read 100mA Write Read 200mA Write NOTE: Current consumption on each device can be varied by NAND Flash, .
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MMBTFxxGWBCA-xMExx datasheet Rev. 1.0 SD Card 4.3 SD Mode Card Registers Six registers are defined within the card interface: OCR, CID, CSD, RCA, DSR and SCR. These can be accessed only by corresponding commands. The OCR, CID, CSD and SCR registers carry the card/content specific information, while the RCA and DSR registers are configuration registers storing actual configuration parameters. 4.3.1 OCR Register • The 32-bit operation conditions register stores the VDD voltage profile of the card.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 4.3.2 CID Register The Card IDentification (CID) register is 128 bits wide. It contains the card identification information used during the card identification phase. Every individual Read/Write (RW) card shall have an unique identification number. It is programmed during manufacturing and cannot be changed by card hosts.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 4.3.3 CSD Register (CSD Version 1.0) The Card-Specific Data register provides information on how to access the card contents. The CSD defines the data format, error correction type, maximum data access time, data transfer speed, whether the DSR register can be used etc. The programmable part of the register (entries marked by W or E, see below) can be changed by CMD27.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 4.3.4 CSD Register (CSD Version 2.0) The following Table shows Definition of the CSD Version 2.0 for the High Capacity SD Memory Card and Extended Capacity SD Memory Card. The following sections describe the CSD fields and the relevant data types for the High Capacity SD Memory Card. CSD Version 2.0 is applied to only the High Capacity SD Memory Card.
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MMBTFxxGWBCA-xMExx Rev. 1.0 datasheet SD Card 4.3.6 SCR Register In addition to the CSD register, there is another configuration register named SD CARD Configuration Register (SCR). SCR provides information on the SD Card’s special features that were configured into the given card. The size of SCR register is 64bits. The register shall be set in the factory by the SD Card manufacturer. The following table describes the SCR register content.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 4.3.7 SD Status Register The SD Status contains status bits that are related to the SD Memory Card proprietary features and may be used for future application specific usage. The size of the SD Status is one data block of 512bit. The content of this register is transmitted to the Host over the DAT bus along with 16bit CRC. The SD Status is sent to the host over the DAT bus if ACMD13 is sent (CMD55 followed with CMD13).
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 5.0 INTERFACE DESCRIPTION 5.1 SD/microSD SD mode Bus Topology / SD/microSD SPI Bus Topology Host CLK VDD VSS D0~3(A) CMD(A) Host CLK VDD VSS CS CS(A) VDD VSS VDD VSS SD Memory Card(A) D0~D3, CMD D0~D3, CMD CLK VDD VSS D0~3(B) CMD(B) VDD VSS CLK, DataIN, DataOut D0~D3, CMD SD Memory Card System Bus Topology The SD/microSD Memory Card system defines two alternative communication protocols: SD and SPI.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 5.2 Bus Protocol 5.2.1 SD Bus For more details, refer to Section 3.6.1 of the SDA Physical Layer Specification, Version 3.00 5.2.2 SPI Bus For more details, refer to Chapter 7 of the SDA Physical Layer Specification, Version 3.00 5.3 SD/microSD Card Pin Assignment 5.3.1 SD Card Pin Assignment 1 2 3 4 5 6 7 8 9 wp SD Memory Card Figure 5-1. SD Memory Card shape and interface (top view) The SD Memory Card has the form factor 24 mm x 32 mm x 2.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card Pin 8 Pin 7 Pin 6 Pin 5 Pin 4 Pin 3 Pin 2 Pin 1 5.3.2 microSD Card Assignment Figure 5-2. Contact Area [Table 5-2] : microSD Contact Pad Assignment SD Mode Pin # Name Type 1 DAT22.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 5.4 Mechanical Specification This section describes the mechanical and electrical features, as well as SEC SD/microSD Card environmental reliability and durability specifications. For more details you can refer to Chapter 8 of SDA Physical Layer Specification, Version 2.00 and SDA ,microSD Card Addendum, Section 3.0 Mechanical Specification for microSD Memory Card. 5.4.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card A3 A2 7- A4 8- A5 B7 B8 B5 B6 B10 R18 B11 A9 R17 B9 45° A8 CL A7 A6 Figure 5-4. : Mechanical Description: Bottom View D1 D2 KEEP OUT AREA D3 Figure 5-5.
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MMBTFxxGWBCA-xMExx datasheet Rev. 1.0 SD Card 0.75mm Minimum Nonconductive Area in front of all 8 contact pads Figure 5-6. Nonconductive Area in Front of Contact Pad Nonconductive Area, on both sides of microSD card Figure 5-7.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card [Table 5-3] : microSD Package: Dimensions SYMBOL A A1 A2 A3 A4 A5 A6 A7 A8 A9 B B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 C C1 C2 C3 D1 D2 D3 R1 R2 R3 R4 R5 R6 R7 R10 R11 R17 R18 R19 R20 MIN 10.90 9.60 7.60 0.75 0.90 0.60 0.80 14.90 6.30 1.64 1.30 0.42 2.80 5.50 0.20 1.00 7.80 1.10 0.90 0.60 0.20 0.00 1.00 1.00 1.00 0.20 0.20 0.70 0.70 0.70 0.70 29.50 0.10 0.20 0.05 0.02 COMMON DIMENSIONS NOM 11.00 9.70 3.85 7.70 1.10 0.80 0.70 15.00 6.40 1.84 1.50 0.52 2.90 0.
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datasheet MMBTFxxGWBCA-xMExx Rev. 1.0 SD Card 5.4.2 Mechanical Form Factor of SD Card Min 1.5 Min 1.5 Min 3.4 Figure 5-8.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card +0 22.5 -0.1 0.6 0.7 2.1+0.15 0.7 1.4+0.15 -0.1 1.4+0.2 0.2 Contoct Pad Surface 8.125 Cord Body Corner -0.1 1.4+0.2 6 x 2.5 = 15 4 (4-R0.3) 3 4 5 6 7 7.8 8 VDD CLK Vss DAT0 DAT1 DAT2 0.3 2-R 9 2 6.7 LOCK Position 0.75 32 ±0.1 7.5Min 11.5 10 7.65Mn 1 CD/ CMD Vss DAT3 5.95Min 5.65Min Contoct Pad Surface 4 2-R0.5 ±0.1 3-R1±0.1 3-R1±0.1 24 ±0.1 2-R0.5 General Tolerance ±0.15 Figure 5-9.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 9.75 8.05 6 X 2.5 = 15 4 Min 6-1 1.1 Min 5.625 0.9 Min 1.4 Min 3 4 5 6 5Min 7 8 VDD CLK VssDAT0 DAT1 Lock Position 14.5 9 DAT2 2 10.85 1 CD/ CMD Vss DAR 7.8 11.45 0.2Min 1.6Max 2.3 ±0.1 7 Min 4 Max 0.25 Min 0.75 write protet write enable General Tolerance ±0.15 Figure 5-10. Mechanical Description: Bottom View 5.4.
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MMBTFxxGWBCA-xMExx Rev. 1.0 datasheet SD Card 5.5 Electrical Interface The following sections provide valuable information about the electrical interface. See Chapter 6 of the SDA Physical Layer Specification, Version 3.00 for more detail information. 5.5.
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MMBTFxxGWBCA-xMExx Rev. 1.0 datasheet SD Card 5.5.2 Reset Level Power Up Host needs to keep power line level less than 0.5V and more than 1ms before power ramp up. VDD Supply Voltage 3.6V VDD max Stable Supply voltage Operating Supply Range 2.7V VDD min 0.5V Power On/Cycle level/duration 1msec Time(not to scale) CMD0 Power ramp up Initialization delay The maximum of 1msec, 74 clock cycles and supply up time Figure 5-12.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 5.5.4 Bus Operating Conditions for 3.3V Signaling SPI Mode bus operating conditions are identical to SD Card mode bus operating conditions. 5.5.4.1 Threshold Level for High Voltage Range [Table 5-4] : Threshold Level for High Voltage Parameter Symbol Min Max. Unit Supply Voltage VDD 2.7 3.6 V Output High Voltage VOH 0.75*VDD Output Low Voltage VOL Input High Voltage VIH Input Low Voltage VIL V IOH = -2mA VDD min 0.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 5.5.5 Bus Signal Levels As the bus can be supplied with a variable supply voltage, all signal levels are related to the supply voltage. Supply Voltage VDD Input High Level Output High Level VOH VIH Undefined VIL Input Low Level VOL VSS Output Low Level Time Figure 5-13.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 5.5.6 Bus Timing (Default Mode) fPP tWL tWH VIH Clock VIL tTLH tTHL tISU tIH VIH VIL VOH Output VOL tODLY (min) tODLY(max) Shaded areas are not valid Figure 5-14. Timing diagram data input/output referenced to clock (Default) [Table 5-6] : Bus Timing - Parameter Values (Default) Parameter Symbol Min Max. Unit Remark Clock CLK ( All values are referred to min. (VIH) and max.
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Rev. 1.0 datasheet MMBTFxxGWBCA-xMExx SD Card 5.5.7 Bus Timing (High-speed Mode) fPP tWH tWL 50%VDD VIH Clock VIL tTHL tISU tTLH tIH VIH Input VIL VOH Output VOL tOH tODLY Shaded areas are not valid Figure 5-15. Timing Diagram data Input/Output Refrenced to Clock (High-Speed) [Table 5-7] : Bus Timing - Parameter Values (High-Speed) Parameter Symbol Min Max. Unit Remark Clock CLK ( All values are referred to min. (VIH) and max.
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MMBTFxxGWBCA-xMExx datasheet Rev. 1.0 SD Card 6.0 SD/MICROSD CARD FUNCTIONAL DESCRIPTION 6.1 General SEC SD/microSD Card Functional Description contained in this chapter; Section 6.2~6.14; basically, comfort to SDA Physical Layer Specification, Version 3.00. See Chapter 4 of the SDA Physical Layer Specification, Version 3.00 for detail information and guide. 6.
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datasheet MMBTFxxGWBCA-xMExx Rev. 1.0 SD Card 6.6 Memory Array Partitioning The basic unit of data transfer to/from the SD Card is one byte. All data transfer operations which require a block size always define block lengths as integer multiples of bytes. Some special functions need other partition granularity.
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MMBTFxxGWBCA-xMExx datasheet 6.7 Timings Refer to Section 4.12 of the SDA Physical Layer Specification, Version 3.00 for detail information and guide1) NOTE : 1) The products on this specification does not support UHS-1 mode. 6.8 Speed Class Specification Refer to Section 4.13 of the SDA Physical Layer Specification, Version 3.00 for detail information and guide1) NOTE : 1)The products on this specification does not support UHS-1 mode. 6.9 Erase Timeout Calculation Refer to Section 4.