Product guide

ManualsBrandsSamsung Manualscomputer components2GB, DDR II SDRAM, 800MHz, CL6

January 2009

General Information DDR2 SDRAM

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DDR2 SDRAM Product Guide

January 2009

Memory Division

Summary of content (17 pages)

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General Information DDR2 SDRAM DDR2 SDRAM Product Guide January 2009 Memory Division 1 of 17 January 2009
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General Information DDR2 SDRAM A. DDR2 SDRAM Component Ordering Information 1 2 3 4 5 6 7 8 9 10 11 K 4 T X X X X X X X - X X X X SAMSUNG Memory Speed DRAM Temp & Power DRAM Type Package Type Revision Density Bit Organization Interface (VDD, VDDQ) # of Internal Banks 8. Revision 1. SAMSUNG Memory : K M A B C D E F G H Q R 2. DRAM : 4 3. DRAM Type T : DDR2 SDRAM 4. Density 56 : 256Mb 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 9. Package Type Z J H M T 5.
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General Information DDR2 SDRAM B. DDR2 SDRAM Component Product Guide Density 512Mb G-die 1Gb Q-die 1Gb E-die 2Gb A-die Banks 4Banks 8Banks 8Banks 8Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org.
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General Information DDR2 SDRAM C. DDR2 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 M X X X T X X X X X X X - X X X X Memory Module AMB Vendor DIMM Type Data bits DRAM Component Type Speed Temp & Power PCB Revision Depth # of Banks in Comp. & Interface Package Bit Organization Component Revision 1. Memory Module : M 8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen. Q : 17th Gen. 2. DIMM Type 3 : DIMM 4 : SODIMM 3.
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General Information DDR2 SDRAM D. DDR2 SDRAM Module Product Guide 240Pin DDR2 Unbuffered DIMM Org.
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General Information DDR2 SDRAM 200Pin DDR2 SODIMM Org.
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General Information DDR2 SDRAM 240Pin DDR2 Registered DIMM Org.
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General Information DDR2 SDRAM 240Pin DDR2 VLP Registered DIMM Internal Banks Rank PKG Height Avail. G-die 4 1 60 ball FBGA 18.3mm Now 512Mb G-die 4 1 1Gb Q-die 8 1 60 ball FBGA 18.
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General Information DDR2 SDRAM 240Pin DDR2 Fully Buffered DIMM(1.8V) Org.
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General Information DDR2 SDRAM 240Pin DDR2 Fully Buffered DIMM(1.55V) Org. Density 128Mx 72 1GB 256Mx 72 2GB 512Mx 72 1Gx 72 4GB 8GB Part Number Speed AMB M395T2863QZ4 YE6 8: IDT L4 M395T2863QH4 YE6 8: IDT L4 M395T5663QZ4 YE6 8: IDT L4 M395T5663QH4 YE6 8: IDT L4 M395T5160QZ4 YE6 8: IDT L4 Composition Comp.
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General Information DDR2 SDRAM 9.00 ± 0.10 0.10MAX 60Ball FBGA for 512Mb E-die (x4/x8) A 0.80 x 8 = 6.40 3.20 0.80 9 (Datum A) 8 7 6 5 #A1 B 4 3 9.00 ± 0.10 # A1 INDEX MARK 1.60 2 1 A B 0.80 H J 4.00 F G 11.00 ± 0.10 E 11.00 ± 0.10 D 0.80 x 10 = 8.00 0.80 (Datum B) C K L (0.95) 60-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.35 ± 0.05 MOLDING AREA (1.90) 1.10 ± 0.10 0.2 M A B Bottom Top 9.00 ± 0.10 0.10MAX 84Ball FBGA for 512Mb E-die (x16) A 0.80 x 8 = 6.40 3.
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General Information DDR2 SDRAM 7.50 ± 0.10 A 0.80 x 8 = 6.40 0.80 7.50 ± 0.10 # A1 INDEX MARK 1.60 #A1 B 9 8 7 6 5 4 0.10MAX 60Ball FBGA for 512Mb G-die (x4/x8) 3 2 1 (Datum A) A (Datum B) B 0.80 H 0.50 ± 0.05 F G 9.50 ± 0.10 E 9.50 ± 0.10 D 0.80 x 10 = 8.00 C J K L (0.95) ∅0.2 M 0.35±0.05 (1.90) 60-∅0.45±0.05 1.10±0.10 MOLDING AREA A B 7.50 ± 0.10 A 0.80 x 8 = 6.40 9 (Datum A) 8 7 1.60 6 5 4 B 3 7.50 ± 0.10 # A1 INDEX MARK 3.20 0.80 0.
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General Information DDR2 SDRAM 11.00 ± 0.10 0.10MAX 60Ball FBGA for 1Gb C-die (x4/x8) 11.00 ± 0.10 # A1 INDEX MARK 6.40 9 8 7 #A1 1.60 0.80 (Datum A) 6 5 4 3 2 1 A B 0.80 (Datum B) C F G 4.00 H 1.60 J 11.50 ± 0.10 8.00 E 11.50 ± 0.10 D K L 0.35 ± 0.05 MAX.1.10 60-∅0.45±0.05 (Post reflow 0.50 ± 0.05) 0.2 M A B (0.95) (1.
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General Information DDR2 SDRAM 9.00 ± 0.10 # A1 INDEX MARK 0.10MAX 60Ball FBGA for 1Gb D-die (x8) 9.00 ± 0.10 6.40 0.80 (Datum A) 9 8 7 #A1 1.60 6 5 4 3 2 1 A B 0.80 (Datum B) C F G 4.00 H 11.00 ± 0.10 8.00 E 11.00 ± 0.10 D 1.60 J K L 0.35 ± 0.05 MAX.1.10 60-∅0.45±0.05 (Post reflow 0.50 ± 0.05) (0.95) (1.90) 0.2 M A B Top Bottom 9.00 ± 0.10 0.10MAX 84Ball FBGA for 1Gb D-die (x16) 9.00 ± 0.10 # A1 INDEX MARK 6.40 0.80 #A1 1.
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General Information DDR2 SDRAM 0.10MAX 60Ball FBGA for 1Gb Q-die (x4/x8) # A1 INDEX MARK 9.00 ± 0.10 A 0.80 x 8 = 6. 40 0.80 9 8 7 1.60 6 5 4 B 3 2 9.00 ± 0.10 #A1 1 A B C 0.50±0.05 0.80 H 11.00 ± 0.10 F G 11.00 ± 0.10 E 0.80 x 10 = 8.00 D 1.60 J K L 0.35±0.05 (0.95) (1.90) 1.10±0.10 Bottom Top 0.10MAX 84Ball FBGA for 1Gb Q-die (x16) # A1 INDEX MARK 9.00 ± 0.10 A 0.80 x 8 = 6. 40 0.80 9 8 7 9.00 ± 0.10 1.60 6 5 4 B 3 2 #A1 1 A B C D 0.50±0.05 0.80 J K 13.
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General Information DDR2 SDRAM 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 (Datum A) 0.80 9 8 7 0.10MAX 60Ball FBGA for 1Gb E-die (x4/x8) 1.60 6 5 4 B 3 2 7.50 ± 0.10 #A1 1 A B 0.80 x 10 = 8.00 D E 0.80 H J 4.00 F G 9.50 ± 0.10 C 9.50 ± 0.10 0.80 (Datum B) K L 0.35±0.05 (0.95) MOLDING AREA 1.10±0.10 (1.90) 60-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 0.80 9 (Datum A) 8 7 0.
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General Information DDR2 SDRAM 68Ball FBGA for 2Gb A-die (x4/x8) 11.00 ± 0.10 #A1 0.80 x 8 = 6.40 3.20 11.00 ± 0.10 # A1 INDEX MARK 1.60 0.80 9 8 7 6 5 4 3 2 1 0.10MAX (Datum A) A B C (Datum B) D 7.20 E F L 0.80 M N 18.00 ± 0.10 J K 18.00 ± 0.10 8.00 H 0.80 x 18 = 14.40 G P R T U V W (0.95) 68-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) (1.90) 0.35 ± 0.05 1.10 ± 0.10 MOLDING AREA 0.