Datasheet

http://www.samsungled.com
26 / 52
5.
Outline Drawing and Dimension
Recommended Land Pattern
Notes:
1)
This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s).
2)
Ts point
&
measurement method
① Measure the nearest point to the thermal pad as shown above. If necessary, remove PSR of
PCB to reach Ts point.
② Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be
damaged.
3)
Precautions
① The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be
taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating.
② Re-soldering should not be done after the LEDs have been soldered. If re-soldering is
unavoidable, LED`s characteristics should be carefully checked before and after such repair.
③ Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two
PCB assembled with LED might cause catastrophic failure of the LEDs.
1.
Tolerance is
±0.1
mm
2.
The maximum compressing force is
15N
on the silicone
ⓐ
3.
Do not place pressure on the encapsulation resin
ⓑ
Anode
Cathode