Datasheet
84
85
6-3. Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot soldering iron tip comes into direct contact with the end
terminations, and operators carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor.
Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature
control of the tip.
6-5. Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference (
T) must be less than 100
6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning
fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new.
A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of
separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board.
6-4. Amount of Solder
Too much Solder
Not enough solder
Cracks tend to occur
due to large stress.
Weak holding force may cause
bad connections or
detaching of the capacitor
7. Notes for Separating Multiple, Shared PC Boards
Part Numbering
System
High Capacitance
Capacitors
Super Small Size
Capacitors
Medium-High
Voltage Capacitors
Array Type
Capacitors
Low ESL
Capacitors
Application Manual
for Surface Mounting
Packaging
Specification
Premium Capacitors
for Automotive
Applications
Reliability Test
Condition
General
Capacitors