Datasheet

1-1. Storage Environment
Tape packing materials are designed to withstand long-term storage, but they will degrade more rapidly in the presence of high
temperature or high humidity, Therefore, the products must be stored in an ambient 5~40 with a relative humidity of 20~70%.
Allowable storage period is within 6 months from the outgoing date of delivery.
1-2. Corrosive Gases
Since sulfur and chlorine may degrade the solderability of the end termination, it is important to store the capacitors in an
environment free of these gases
1-3. Temperature Fluctuations
Since dew condensation may occur by the differences in temperature when the products are taken out of storage, it is
important to maintain a temperature-controlled environment.
When designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the
capacitor. The amount of solder at the end terminations has a direct effect on the
probability that the chip will crack. The greater amount of solder, the larger amount of stress on the chip, and the more likely that it
will break. Use the following illustrations as guidelines for proper Solder land design.
MLCCs generally require the use of an adhesive to position the chips to the circuit board prior to soldering.
3-1. Requirements for Adhesives
They must have enough adhesion so that the chips will not fall off or move during the handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperatures.
They should not spread or run when applied to the circuit board.
They should have a long pot life.
They should harden quickly.
They should not corrode the circuit board or chip material.
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
3-2. Application Method
It is important to use the proper amount of adhesive. Too little will cause poor adhesion to the circuit board, and too much may strain the
conductor pattern, thereby causing defective soldering. The following illustrations show the proper quantity of adhesive.
Recommendation of solder Land Shape and Size
Type
a
b
c
0.2min
70~100m
>0
0.2min
70~100m
>0
21 31
Unit: mm
w
b
Solder Resist
2
/
3W
<
b
<
W
a
Solder
Land
Solder Resist
2
/
3T
<
a
<
T
T
baa
cc
Land
PCB
Solder Resist
1.Storage of products
2.Design of Solder Land Pattern
3.Adhesives
3-3. Adhesive hardening Characteristics
To prevent oxidation of the terminations, the adhesive must harden at 160 or less, within 2 minutes or less.
Application Manual for
Surface Mounting
SAMSUNG ELECTRO-MECHANICS