User's Manual

page 11/64

Note d’étude / Technical document : URD1– OTL

5665.3

– 003 / 72238 Edition 01

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Figure 2: Postage stamp sized HiLoNC V2 51 pads out front side

Figure 3: Postage stamp sized HiLoNC V2 51 pads out back side

4.1 HOW TO CONNECT TO A SIM CARD

Figure 4: SIM Card signals

HiLoNC V2 module provides the SIM signals on the 51 pads. A SIM card holder with 6 pads needs to be

adopted to use the SIM function.

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Decoupling capacitors have to be added on SIM_CLK, SIM_RST, VSIM and SIM_DATA signals as close

as possible to the SIM card connector to avoid EMC issues and pass the SIM card tests approvals .

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Use ESD protection components to protect SIM card and module I/Os against Electro Static Discharges.

The following schematic shows how to protect the SIM access for 6 pads connector, this should be apply

every time a SIM card holder is accessible by the final customer.