User's Manual

page 55/64
Note d’étude / Technical document : URD1– OTL
5665.3 – 003 / 72238 Edition 01
Document Sagemcom Reproduction et divulgation interdites
Sagemcom document. Reproduction and disclosure prohibited
Figure 56 : Underfill injection holes
10.8 SECOND REFLOW SOLDERING
Even if SAGEMCOM recommends a single reflow soldering, a second reflow soldering can be conceivable (only
if underfill has not been already performed). Positive tests have been performed with HiLoNC V2 on the bottom
side.
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Second reflow soldering is not possible if HiLoNC V2 module has been already under filled.
10.9 HAND SOLDERING
Hand soldering is possible.
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An especial care must be considered to properly position the HiLoNC V2 on its copper footprint during
hand soldering. Begin with pads diagonally opposite to help in proper positioning.
10.10 UNSOLDERING
Manual unsoldering is possible, for repair purpose for example.
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A special care must be considered in order to avoid overheating the HiLoNC V2.
For repairing: Usage of hot plate like example below can be considered with additional metallic cubic plate
whose dimensions are HiLoNC V2's ones (to heat only HiLoNC V2 surface)
Underfill Injection
Holes