User's Manual

page 52/64
Note d’étude / Technical document : URD1– OTL
5665.3 – 003 / 72238 Edition 01
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10.5 PROFILE FOR REFLOW SOLDERING
A convection type soldering oven is recommended.
Typical usable profile is shown on the next figure. The final profile has to be tuned depending on other elements
like solder paste, customer’s board, other components…
Peak temperature: 245°C
Average ramp up rate: 3°C/second max
Average ramp dacay rate: 3°C/second max
Figure 52 : Typical thermal profile
The HiLoNC V2 module is a Lead-free product which has been validated integrated in a lead-free product, using
a lead-free factory process.
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No test has been performed using a leaded process. SAGEMCOM does not recommend using a factory
leaded process and does not guarantee any reliable result on the final product.
10.6 SMT MACHINE
HiLoNC V2 is a compact postage stamp sized module optimized for use with pick-and-place machines.