User's Manual

page 51/64
Note d’étude / Technical document : URD1– OTL
5665.3 – 003 / 72238 Edition 01
Document Sagemcom Reproduction et divulgation interdites
Sagemcom document. Reproduction and disclosure prohibited
10.3 STENCIL
Below are given soldering characteristics to report the HiLoNC V2 on the customer’s board.
Copper footprint is shown in solid line on the figure below. Stencil footprint is shown in dotted line.
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Note that the opening and the pads do not strictly recover themselves.
Figure 51 : Solder mask design
10.4 SOLDER PASTE
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SAGEMCOM recommends a stencil thickness of 135 µm.
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SAGEMCOM recommends use of a “no clean” solder paste. Flux cleaning after module soldering on the
customer’s board is not recommended as it can lead to short circuit, label degradation.
Solder paste: M705-GRN360-K-V (Senju Metal Industry Co., Ltd.)
Alloy composition: Sn96.5-Ag3.0-Cu0.5
Melting temperature: solidus 216°C / Peak 217°C / liquidus 220°C