User's Manual

page 49/64
Note d’étude / Technical document : URD1– OTL
5665.3 – 003 / 72238 Edition 01
Document Sagemcom Reproduction et divulgation interdites
Sagemcom document. Reproduction and disclosure prohibited
9.2 EXAMPLE OF LAYOUT FOR CUSTOMER’S BOARD
The following figure shows an example of layer allocation for a 6 layers circuit (for reference only):
Depending on the customer’s design the layout could also be done using 4 layers.
Figure 49: layer allocation for a 6 layers circuit
10. RECOMMANDATIONS FOR CUSTOMER PRODUCTION
Note for following chapters that except where standards are indicated, the given characteristics should be
considered as validated conditions used on SAGEMCOM product.
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Other conditions depending of the customer’s factory process are not validated but can be submitted to
SAGEMCOM for proficiency.
10.1 MOISTURE LEVEL
According to IPC/JEDEC J-STD 20, the HiLoNC V2 has the following MSL level: 3
Customer’s module are shipped under a Dry package with all the MSL information labelled.
Soak requirements Level Floor Life
Standard Accelerated Equivalent
Time Conditions Time (hours) Conditions Time (hours) Conditions
3 168
hours
<= 30°C/60% RH 192 +5/-0 30°C / 60% RH 40 +1/-0 60° C / 60%RH
It means that the customer’s factory must process and solder the HiLoNC V2 on the customer’s board at least
168 hours (7 days) after the HiLoNC V2 sealed package have been opened. This duration is given for factory
floor conditions of T°<30°C, HR 60%.
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If this maximum 7 days duration can not be fulfilled, the HiLoNC V2 part must be baked again.
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Unless the factory floor conditions are perfectly controlled, SAGEMCOM does not recommend to wait
until this maximum 7 days duration before soldering the HiLoNC V2 on customer’s board.
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For any module exposed to ambient moisture it is therefore highly recommended to proceed to a baking
according to the JEDEC (125°C during 24H) to dry th e module before any soldering process
10.2 PACKAGE
The HiLoNC V2 module is delivered in Tape and Reel package which is hermetically sealed to prevent from
moisture and ESD.
The characteristics of the T&R are given in the drawing below.
Layer 1: Components (HiloNC)
Layer 2: Bus
Layer 3: Power supply
Layer 4: Complete GND layer
Layer 5: Audio, clocks, sensitive signals
Layer 6: GND,test points