User's Manual

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Note d’étude / Technical document : URD1– OTL
5665.3 – 003 / 72238 Edition 01
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5. RECOMMENDED I/OS AND COMPONENTS ON THE FINAL PRODUCT .........................................................42
6. ESD & EMC RECOMMENDATIONS .......................................................................................................................42
6.1 HILONC V2 ALONE...........................................................................................................................................42
6.2 HANDLING THE MODULE ..............................................................................................................................42
6.3 Customer’s product with HiLONC V2..............................................................................................................42
6.4 Analysis ...............................................................................................................................................................42
6.5 Recommendations to avoid ESD issues ........................................................................................................43
7. RADIO INTEGRATION..............................................................................................................................................43
7.1 ANTENNA ...........................................................................................................................................................43
7.2 GROUND LINK AREA.......................................................................................................................................44
7.3 LAYOUT ..............................................................................................................................................................45
7.4 MECHANICAL SURROUNDING.....................................................................................................................46
7.5 OTHER RECOMMENDATIONS – TESTS FOR PRODUCTION/DESIGN ...............................................46
8. AUDIO INTEGRATION .............................................................................................................................................46
8.1 MECHANICAL INTEGRATION AND ACOUSTICS......................................................................................46
8.2 ELECTRONICS AND LAYOUT .......................................................................................................................47
9. RECOMMENDATIONS ON LAYOUT OF CUSTOMER’S BOARD ......................................................................47
9.1 GENERAL RECOMMENDATIONS ON LAYOUT.........................................................................................47
9.1.1 Ground.........................................................................................................................................................47
9.1.2 Power supplies ...........................................................................................................................................47
9.1.3 Clocks ..........................................................................................................................................................48
9.1.4 Data bus and other signals.......................................................................................................................48
9.1.5 Radio............................................................................................................................................................48
9.1.6 Audio............................................................................................................................................................48
9.2 EXAMPLE OF LAYOUT FOR CUSTOMER’S BOARD................................................................................49
10. RECOMMANDATIONS FOR CUSTOMER PRODUCTION ...............................................................................49
10.1 MOISTURE LEVEL........................................................................................................................................49
10.2 PACKAGE.......................................................................................................................................................49
10.3 STENCIL .........................................................................................................................................................51
10.4 SOLDER PASTE............................................................................................................................................51
10.5 PROFILE FOR REFLOW SOLDERING.....................................................................................................52
10.6 SMT MACHINE ..............................................................................................................................................52
10.6.1 Nozzles........................................................................................................................................................53
10.6.2 Fiducials ......................................................................................................................................................54
10.7 UNDERFILL....................................................................................................................................................54
10.8 SECOND REFLOW SOLDERING...............................................................................................................55
10.9 HAND SOLDERING ......................................................................................................................................55
10.10 UNSOLDERING.............................................................................................................................................55
11. LABEL .....................................................................................................................................................................56
12. REFERENCE DESIGN: HiLoNC V2 DEVELOPMENT KIT ................................................................................57