User's Manual
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Note d’étude / Technical document : URD1– OTL 5665.1– 002 / 70 884 Edition 03
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FIGURES LIST
Figure 1: Block diagram of HiloNC module.............................................................................................................................8
Figure 2: SIM Card signals.....................................................................................................................................................10
Figure 3: Protections: EMC and ESD components close to the SIM......................................................................................10
Figure 4: Audio connection ....................................................................................................................................................11
Figure 5 : Filter and ESD protection of microphone...............................................................................................................12
Figure 6: Filter and ESD protection of 32 ohms speaker........................................................................................................12
Figure 7: Buzzer connection ...................................................................................................................................................14
Figure 8: GSM/GPRS Burst ...................................................................................................................................................14
Figure 9: Example of power supply based on a DC/DC step down converter ........................................................................15
Figure 10: Example of power supply based on regulator........................................................................................................15
Figure 11: Example with Linear LT1913 ...............................................................................................................................16
Figure 12: Complete V24 connection between HiloNC and host ...........................................................................................17
Figure 13: connection to a data cable .....................................................................................................................................18
Figure 14: Partial V24 connection (4 wires) between HiloNC and host.................................................................................18
Figure 15: Partial V24 connection (2 wires) between HiloNC and host.................................................................................19
Figure 16: Backup battery internally charged.........................................................................................................................21
Figure 17: Charging curve of backup battery .........................................................................................................................21
Figure 18: Hardware interface between HiloNC and host ......................................................................................................22
Figure 19: Antenna connection...............................................................................................................................................25
Figure 20: Forbidden area for via ...........................................................................................................................................26
Figure 21: Layout of audio differential signals on a layer n ...................................................................................................29
Figure 22: Adjacent layers of audio differential signals .........................................................................................................29
Figure 23: layer allocation for a 6 layers circuit .....................................................................................................................29
Figure 24 : Solder mask design...............................................................................................................................................32
Figure 25 : Typical thermal profile.........................................................................................................................................33
Figure 26 : CMS fiducials positions .......................................................................................................................................34
Figure 27 : Underfill holes......................................................................................................................................................35