User's Manual

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Note d’étude / Technical document : URD1– OTL 5665.1– 002 / 70 884 Edition 03
Document Sagem Communications Reproduction et divulgation interdites
Sagem Communications document. Reproduction and disclosure prohibited
Figure 28 : Underfill holes
9.8 SECOND REFLOW SOLDERING
Even if Sagem Communications recommends a single reflow soldering, a second reflow soldering can be
conceivable (only if underfill has not been already performed). Positive tests have been performed with HiloNC
on the bottom side.
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Second reflow soldering is not possible if HiloNC module has been already underfilled.
9.9 HAND SOLDERING
Hand soldering is possible.
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An especial care must be considered to properly position the HiloNC on its copper footprint during hand
soldering. Begin with pads diagonally opposite to help in proper positioning.
9.10 REWORK
Rework is possible, for repair purpose for example.
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An especial care must be considered in order not to overheat the HiloNC.
10. LABEL
The HiloNC module is labelled with its own FCC ID(VW3HILONC) on its bottom side. When the module is
installed in customer’s product, the FCC ID label on the module will not be visible. To avoid this case, an exterior
label must be stuck on the surface of customer’s product signally to indicate the FCC ID of the enclosed module.
This label can use wording such as the following: “Contains Transmitter module FCC ID: VW3HILONC” or
“Contains FCC ID: VW3HILONC”.
Underfill Holes