User's Manual

page 32/35
Note d’étude / Technical document : URD1– OTL 5665.1– 002 / 70 884 Edition 03
Document Sagem Communications Reproduction et divulgation interdites
Sagem Communications document. Reproduction and disclosure prohibited
9.3 SOLDER MASK
Below are given soldering characteristics to report the HiloNC on the customer’s board.
Copper footprint is shown in yellow on the figure below. Solder mask footprint is shown in pink.

Please note that copper mask and solder mask do not strictly recover themselves.
Figure 25 : Solder mask design
9.4 SOLDER PASTE
Solder paste : M705-GRN360-K-V (Senju Metal Industry Co., Ltd.)
Alloy composition : Sn96.5-Ag3.0-Cu0.5
Melting temperature : solidus 216°C / Peak 217°C / liquidus 220°C

Sagem Communication recommends a stencil thickness of 135 µm.
9.5 PROFILE FOR REFLOW SOLDERING
A convection type soldering oven is recommended.
Typical usable profile is shown on the next figure. The final profile has to be tuned depending on other elements
like solder paste, customer’s board, other components,…
Peak temperature : 245°C
Average ramp up rate : 3°C/second max
Average ramp down rate : TBC