User's Manual
page 24/35
Note d’étude / Technical document : URD1– OTL 5665.1– 002 / 70 884 Edition 03
Document Sagem Communications Reproduction et divulgation interdites
Sagem Communications document. Reproduction and disclosure prohibited
4. MANDATORY POINTS FOR THE FINAL TESTS AND TUNING
The design of the customer’s board (on which the module is soldered) must provide an access to following
signals when the final product will be completely integrated.
To upgrade the module software, Sagem Communications recommends providing a direct access to the
module serial link through an external connector or any mechanism allowing the upgrade of the module
without opening the whole product.
Serial link:
TXD Output
UART transmit
RXD Input UART receive
To debug the module software, Sagem Communications recommends providing a direct access to the
module debug port SPI (5 I/Os) through internal test points (TP) located on the customer's main board.
5. ESD & EMC RECOMMENDATIONS
5.1 HILONC ALONE
The HiloNC module alone can hold 2KV on each of the 51 pads including the RF pad.
5.2 CUSTOMER’S PRODUCT WITH HILONC
If customer’s design must stand more than 2kV on electrostatic discharge, following recommendation must be
taken into account.
5.2.1 Analysis
ESD current can penetrate inside the device via the typical following components:
• SIM connector
• Microphone
• Speaker
• Battery / data connector
• All pieces with conductive paint (plastron, special keys, etc...)
In order to avoid ESD issues, efforts shall be done to decrease the level of ESD current on electronic
components located inside the device (customer’s board, input of the HiloNC module, etc…)
5.2.2 Recommendations to avoid ESD issues
Insure good ground connections of the HiloNC module to the customer’s board.
Flex (if any) shall be shielded and FPC connectors shall be correctly grounded at each extremity.
Put capacitor 100nF on battery (not on charger), or better put varistor or ESD diode in parallel on battery
and charger wires and on all wires on bottom connector.
Uncouple microphone and speaker by putting capacitor or varistor in parallel of each wire of these devices.