User's Manual

URD1 – OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE
8. Recommendations on customer board layout ............................................................................................................... 28
8.1. General recommendations on layout
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28
8.1.1. Ground
......................................................................................................................................................... 28
8.1.2. Ground layout guidelines
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8.1.3. Digital ground
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8.1.4. Analog/RF ground
...................................................................................................................................... 29
8.1.5. Power supply
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8.1.6. Clocks
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8.1.7. Data bus and other signals
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29
8.1.8. Radio
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8.1.9. Shielding
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8.2. Example of a customer board layout
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9. Moisture sensitivity level precautions .......................................................................................................................... 30
10 CUSTOMER PROCESS ................................................................................................................................................ 31
10.1 PACKAGE
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10.2 Stencil
.................................................................................................................................................................... 32
10.2.1 Fotprint
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10.2.2 Recommended Stencil design
.................................................................................................................... 33
10.3 Solder Paste
......................................................................................................................................................... 33
10.4 Profile for Reflow soldering
................................................................................................................................. 33
10.5 SMT Machine
........................................................................................................................................................ 34
10.5.1 Nozzles
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10.5.2 Fiducials
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10.6 Underfill
................................................................................................................................................................. 34
10.7 Second reflow soldering
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10.8 Hand soldering
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10.9 UnsolderING
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11.
Labelling
.................................................................................................................................................................. 35
12
CE/FCC/IC warning statement
............................................................................................................................. 35
Note d’étude / Technical document :
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