User's Manual

URD1 – OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE
10.2.2 Recommended Stencil design
Stencil design advise thickness : 0.08mm ~ 0.13mm.
Solder paste advise thickness : 0.10mm ~ 0.18mm
10.3 Solder Paste
SAGEMCOM recommends Use of "No Clean" ASAHI soldering paste is strongly recommended, as it does not
require cleaning after the soldering process has taken place. The paste listed in the example below
meets these criteria.
Solder paste: ACS-SN100C-MA1-S4 (Asahi Chemical (S) Pte Ltd.)
Alloy composition: Sn-0.7Cu-0.05Ni+Ge (99.2% Tin / 0.7 % Copper / 0.05% Nickel / Germanium)
Melting temperature: solidus 227°C / Peak 250°C / liquidus 227°C
10.4 Profile for Reflow soldering
A convection type soldering oven is recommended.
Typical usable profile is shown on the next figure. The final profile has to be tuned depending on other elements
like solder
paste, customer’s board, other components…
Peak temperature: 235~250 Degree C.
Reflow zone (Above 220 Degree C): 30~70 sec.
Preheat zone (140~190 Degree C.): 60~120 sec.
Average ramp up rate : 2~4°C/second
Note d’étude / Technical document :
01/08/20111 - Page 33 / 41