User's Manual

URD1 – OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE

If this maximum 7 days duration can not be fulfilled, the HiLoNC 3GPS part must be baked again.

Unless the factory floor conditions are perfectly controlled, SAGEMCOM
does not
recommend to wait
until this maximum 7 days duration before soldering the HiLoNC 3GPS
on customer’s board.

For any module exposed to ambient moisture it is therefore
highly recommended
to proceed to a baking
according to the JEDEC (125°C during 24H) to dry the module before any soldering process
10 CUSTOMER PROCESS
10.1
PACKAGE
The HILONC-3GPS module is delivered in Tape and Reel package which is hermetically sealed to prevent
from moisture and ESD.
The characteristics of the T&R are given in the drawing below.
Note d’étude / Technical document :
01/08/20111 - Page 31 / 41