User's Manual

URD1 – OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE
corresponding pins.
·
Metalized plastic is not as effective as metal cans.
·
Shielded inductors might be needed on the DC/DC circuits, or they might need to be placed in their own shield
area.
8.2. Example of a customer board layout
The following figure is an example of layer allocation for a 6-layer circuit (for reference purposes only):
Depending on
the customer’s design the layout could also be done using 4 layers.
: 6 layer PCB stack
9. Moisture sensitivity level precautions
According to IPC/JEDEC J-STD 20, the HiLoNC 3GPS has the following MSL level: 3
Customer modules are shipped under a Dry package with all the MSL information labelled.
It means that the customer’s factory must process and solder the HiLoNC
3GPS
on the customer’s board
up to
168 hours (7 days) after the HiLoNC 3GPS sealed package have been opened. This duration is given for factory
floor conditions of T°<30°C, HR 60%.
Note d’étude / Technical document :
01/08/20111 - Page 30 / 41
Level
Floor Life
Soak requirements
Standard
Accelerated Equivalent
Time
Conditions
Time (hours)
Conditions
Time (hours)
Conditions
3
168
hours
<= 30°C/60% RH
192 +5/-0
30°C / 60% RH
40 +1/-0
60°C / 60%RH