User's Manual

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HILONC- 3GPS APPLICATION NOTE
 Keep EMC-sensitive and high-emission areas separate.
6.2. Ground Link Area
Good ground contact between the module and customer’s board is required to
achieve optimum radio
performance (spurious, sensitivity…)
 All HILONC-3GPS ground pads must be connected to the ground
of the customer’s bo
ard.
 The thermal ground pads (pads 93~113) must be soldered to the ground
of the customer’s board to
achieve
better thermal dissipation.
TBD
: Thermal pads
6.3. Layout
 Isolate RF line and antenna from other bus or signals
 Signals should avoid being in the vicinity of 50 ohms. If not possible, add ground shielding using different
layers.
 Do not add any ground layer under the antenna contact area.
 Do not add unvarnished layout traces on the first layer of the customer board, or unvarnished via holes
under the module shield area or it will result in short circuit of those signals. This is mandatory.
 Free CAD software can be used to calculate the stack-up parameters to ensure a compliant 50 ohm RF track.
6.4. Mechanical Recommendations
 Do not apply mechanical pressure on the HILONC-3GPS shield. Doing so could damage the mechanical
structure of the shield and lead to internal short-circuits or other issues.
 Avoid having metallic parts in the vicinity of the antenna area.
 Keep FPCs and battery contact (if any) away from antenna area.
 FPC's (if any) have to be shielded.
6.5. Other Recommendation - production/design test
Sagemcom guarantees RF performance in conductive mode but strongly recommends carrying out RF
measurements in an anechoic chamber in radiated mode (test conditions for FTA): radiated performance relies
heavily
on radio integration (layout, antenna, matching circuit, ground area…
.)
7. Audio Integration
The HILONC-3GPS module provides only a digital PCM interface for audio. A PCM codec must be put in
customer’s board if
analog audio is required. The audio specifications which describe the audio tests are 3GPP
TS 26.131 & 3GPP TS 26.132.
7.1. Mechanical integration and acoustics
Particular care of Handset Mode:
To achieve a more ideal audio output design (speaker part):
 The speaker must be completely sealed on the front side.
 The front aperture must in compliance with specifications of the speaker supplier.
 The back volume must be completely sealed.
Note d’étude / Technical document :
01/08/20111 - Page 27 / 41