Direction des Recherches et des Développements Etablissement de RUEIL-MALMAISON RUEIL-MALMAISON R&D Center NOTE D'ETUDE / TECHNICAL DOCUMENT REFERENCE ETUDE / PROJECT URD1 – OTL 5696.1–022/ NOM DE L’ETUDE 72740 Code C TA1 HILONC-3GPS TITRE / TITLE : HILONC- 3GPS APPLICATION NOTE Edition N° # Approbations /Approvals Rédacteur(s) Chef de projet Chef Unité Project design manager Responsable d’entité / Product design manager Author(s) CC Hsieh CC Hsieh CW Sheu P.
NOTE D'ETUDE / TECHNICAL DOCUMENT FICHE RECAPITULATIVE / SUMMARY SHEET Ed Date Référence Rédacteur(s) Relecteur(s) Date Reference Author(s) Reviser(s) 0.1 23/09/2011 0.2 17/10/2011 0.3 09/11/2011 0.4 03/12/2011 URD1 OTL 5696.1 022 72740 ed 0.1 HiLoNC-3GPS Application Note URD1 OTL 5696.1 022 72740 ed 0.2 HiLoNC-3GPS Application Note URD1 OTL 5696.1 022 72740 ed 0.3 HiLoNC-3GPS Application Note URD1 OTL 5696.1 022 72740 ed 0.4 HiLoNC-3GPS Application Note SAGEMCOM SAGEMCOM.
SOMMAIRE / CONTENTS 1. 2. 3. 4. 5. 6. 7. OVERVIEW................................................................................................................................................................... 1.1. Document Objectives .......................................................................................................................................... 1.2. Reference Documents.........................................................................................................
8. Recommendations on customer board layout ............................................................................................................... 8.1. General recommendations on layout .............................................................................................................. 8.1.1. Ground......................................................................................................................................................... 8.1.2. Ground layout guidelines ......
Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.
1. OVERVIEW 1.1. Document Objectives The aim of this document is to provide examples of hardware solutions for development of products based around the Sagemcom HiLo NC-3GPS Module. Most of these solutions are not mandatory. Use them as suggestions of what should be done to achieve a working product and what should be avoided according to our own experiences.
Diversity Ant. Primary Ant. Antenna Port GPS Ant. R F _ Con Power Supply HILONC-3GPS V B AT( 4 ) V B A CK UP Power on Signal Power Control 2.85V V GP I O GN D( 4 ) DC Battery 3.
3. Functional Integration Advancements in silicon technology have brought about concurrent functionality improvements that allow lower power consumption. The HILONC-3GPS module with 116 pin LGA is a very compact design with dimensions of only 28.5 x 34 x 2.35 mm and weighing less than 7 grams. All digital I/Os among the 116 pin LGA are within the 1.
: HILONC-3GPS module top side 3.1. How to connect a SIM card PIN No. C1 C2 C3 C4 C5 C6 C7 C8 Name VCC RST CLK NA GND VPP I/O N/A : SIM Card signals The HILONC-3GPS module provides SIM signals to the 116 pins of the LGA. A SIM card holder with 6 pins must be adopted to access SIM functions. Decoupling capacitors must be added on to the VSIM,SIM_DATA,SIM_RST,and SIM_CLK signals as close as possible to the SIM card connector to avoid EMC issues and in order to pass SIM card approval tests.
VSIM : EMC and ESD protection components in the vicinity of the SIM If it is necessary to use long SIM bus lines of over 100 mm, it is recommended to adopt serial resistors to avoid electrical overshoot on SIM bus signals. Use 56 Ω for the clock line and 10Ω for the reset and data lines. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.
NC R601 56 4 3 SIM_CLK_CARD VSIM_CARD 1 VSIM_CARD 5 9 33pF C602 10nF C601 SIM_DATA_CARD 6 10 2 R601 10 7 R602 10 SIM_RST_CARD NC 8 2.2k R616 C60322pF SIM_GPIO GND : Serial resistors for protection of long SIM bus lines The schematic above includes a hardware SIM card presence detector. It can be connected to GPIO2. GPIO2 is the design default for SIM card detection. Use a 22pF capacitor to debounce the GPIO2 detection signal.
: Primary PCM mode timing parameter Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.
Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.
: Auxiliary PCM mode timing parameter 3.3. PWM A single PWM pin is available on the HILONC-3GPS. This is a general purpose PWM which can be used to drive a vibrating device, keypad backlight or LED. The PWM pin can be controlled by AT commands, allowing several periods and duty cycles. More details are given in the AT commands specifications document. PWM output can be set by the user: Frequency between: 0.125Hz and 8KHz Duty range from: 0 to 100% 3.3.1.
: Buzzer connection 3.3.2. Network LED The HILONC-3GPS module can manage a network LED which can be connected to 2G_RF_IND. The transistors can be found in a single package referred to as the UMDXX or PUMDXX Family. The value of resistor R depends on the characteristics of the LED; its purpose is to limit the current passing through the diode. Use the AT command to set the 2G_RF_IND used to control the LED. : Network LED connection 3.4. Power Requirements Input Rating : 3.4V ~ 4.
3.5. UART The HILONC-3GPS has a UART port that can be used in low-speed, full-speed, and high-speed modes. The UART communicates with serial data ports conforming to the RS-232 interface protocol. With a properly written and user-defined download program, the UART port can be used for testing and debugging. Provision of external access to the V24 interface for easy upgrade of software is recommended. Baud rate up to 4Mbps. Unused signals remain disconnected.
TBD : RTS versus PWRON signal during power on sequence This signal configuration also enables all signals: · UART_RI signal is used when programmed to indicate an incoming voice or data call or SMS incoming message, etc. · UART_DCD signal is used to indicate GPRS connections. · UART_DTR signal is used to indicate that the module’s UART interface is ON.
GND is not reprenested. HiLoNC3GPS UART1_TX pin60 DTE_RX DTE device UART1_RX DTE_TX pin17 UART1_RTS pin59 DTE_CTS UART1_CTS DTE_RTS pin16 UART1_DSR DTE_DTR pin15 UART1_DTR DTE_DSR pin14 UART1_DCD DTE_DCD pin58 UART1_RI DTE_RI pin61 470K External 1.8V 3.5.3.
· The UART_DSR signal is used to prevent HILONC-3GPS from entering sleep mode or to switch between DATA and AT commands or to hang up a call or to wake up the module etc…. 3.5.4.
: Programmable GPIO configurations By utilizing other special AT commands, GPIOs can be used to, for example: 1. Perform I/O toggling while the module is attached to the network. 2. Perform I/O toggling when a pre-set temperature is reached. 3. Serve as an input to detect the presence of an antenna (with some additional external power.) 4. GPIO2 serves as an input default to detect SIM card presence …etc. 3.7.
: Internal charging of backup battery or 10μF capacitor The value of resistor R depends on the charging current value of the backup battery manufacturer. 3.8.3. Backup Battery Technology Capacitor batteries do not have the disadvantages of lithium ion rechargeable batteries: · Maximum discharge current is generally greater, · No need to regulate charge current.
call is actively transmitting data. Sleep mode (Active idle) All systems on HILONC-3GPS are active including the USB bus. In this mode, the module is registered to the network but it is idle/paging only. No voice/data call connection is established. Fly mode The processor is still active but the radio section is powered down. This mode can be controlled by sending an AT command to the module. 4.2. Module Power up Starting the HILONC-3GPS via PWON. 4.2.1.
4.4.1. UART Interface To turn the module off, use the AT command AT+CPOF. If PWON is not pulled down the module will switch to OFF mode after the AT command, otherwise the module restarts immediately (OFF sequence is performed followed by power ON sequence). : Power off sequence for PWON, VGPIO and UART_RTS 4.4.2.
from the operating system or from the host controller. Note: The module cannot enter sleep mode if USB bus is connected. 5. ESD & EMC Recommendations Adopting the Human Body Model of the JEDEC JESD 22-A114 standard, the HILONC-3GPS can support 2KV on each LGA pad. 5.1. HILONC-3GPS Handling HILONC-3GPS modules are packaged in boxes. HILONC-3GPS modules contain electronic circuits sensitive to the electrostatic electricity of the human hand.
The HILONC-3GPS module incorporates RF transceiver technology that converts received signals directly from RF-to-baseband and transmits signals directly from baseband-to-RF (known as direct conversion or zero intermediate frequency (ZIF) processing). This technique eliminates the need for large IF surface acoustic wave (SAW) filters and supporting IF and LO circuits. 6.1. Antenna Connection The HILONC-3GPS module is equipped with an RF LGA pad for antenna connection.
: RF pads 6.1.2. Antenna Recommendations Antenna for HILONC-3GPS should resonate in the operating bands (GSM 850, 900, 1800, 1900 + UMTS band 1, 8) depending on the actual application of the specific HILONC-3GPS module. Note that the RF-impedance of the HILONC-3GPS is 50Ω. Use low loss antenna cable (max. 0.5dB). To avoid interference choose an antenna type with a radiation pattern that does not interfere with the module. . Circular polarized antennas are preferable.
Keep EMC-sensitive and high-emission areas separate. 6.2. Ground Link Area Good ground contact between the module and customer’s board is required to achieve optimum radio performance (spurious, sensitivity…) All HILONC-3GPS ground pads must be connected to the ground of the customer’s board. The thermal ground pads (pads 93~113) must be soldered to the ground of the customer’s board to achieve better thermal dissipation. TBD : Thermal pads 6.3.
The sealed back volume must be in compliance with specifications of the speaker supplier. Pay attention to the design of the speaker gasket (elastomer). Make sure to leave sufficient space for the artificial ear gasket. To achieve a more ideal audio input design (microphone part) : Pay attention to the design of the microphone (elastomer). All receivers must be completely sealed on the front side. Microphone sensitivity depends on the shape of the device but should be in the region of –40 ±3 dBV/Pa.
each capacitor directly to the main ground plane, with one via in the capacitor’s pad plus several vias within the surface layer ground fill area. 8.1.3. Digital ground Digital ground should connect directly to the main ground plane. In addition, each layer between layer 1 and the main ground should include ground fills directly below the center grid area’s digital pins, with each stack of vias connecting to each ground fill area.
corresponding pins. · Metalized plastic is not as effective as metal cans. · Shielded inductors might be needed on the DC/DC circuits, or they might need to be placed in their own shield area. 8.2. Example of a customer board layout The following figure is an example of layer allocation for a 6-layer circuit (for reference purposes only): Depending on the customer’s design the layout could also be done using 4 layers. : 6 layer PCB stack 9.
If this maximum 7 days duration can not be fulfilled, the HiLoNC 3GPS part must be baked again. Unless the factory floor conditions are perfectly controlled, SAGEMCOM does not recommend to wait until this maximum 7 days duration before soldering the HiLoNC 3GPS on customer’s board. For any module exposed to ambient moisture it is therefore highly recommended to proceed to a baking according to the JEDEC (125°C during 24H) to dry the module before any soldering process 10 CUSTOMER PROCESS 10.
10.2 Stencil Below are given soldering characteristics to report the HILONC-3GPS on the customer’s board. 10.2.1 Fotprint Notes: all dimensions are in millimeter. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.
10.2.2 Recommended Stencil design Stencil design advise thickness : 0.08mm ~ 0.13mm. Solder paste advise thickness : 0.10mm ~ 0.18mm 10.3 Solder Paste SAGEMCOM recommends Use of "No Clean" ASAHI soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Solder paste: ACS-SN100C-MA1-S4 (Asahi Chemical (S) Pte Ltd.) Alloy composition: Sn-0.7Cu-0.05Ni+Ge (99.2% Tin / 0.7 % Copper / 0.
10.5 SMT Machine 10.5.1 Nozzles SAGEMCOM recommends using SMT machine with nozzle diameters up to 10 mm in order to always have best prehension of the HILONC-3GPS module. SAGEMCOM recommends using the following references of nozzles: For the Panasonic, the nozzle 1005 10.5.2 Fiducials There is no fiducials design on the bottom side of the HILONC-3GPS. 10.6 Underfill The HILONC-3GPS’s shield did not be designed accordingly to allow this underfill process. 10.
10.8 Hand soldering Hand soldering is impossible for HILONC-3GPS. 10.9 Unsoldering Manual unsoldering is possible, for repair purpose for example. A special care must be considered in order to avoid overheating the HILONC-3GPS.
- Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) EN 301 489-1 V1.8.1: 2008 Electromagnetic compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements EN 301 489-7 V1.3.
Polski [Polish] Português [Portuguese] Slovensko [Slovenian] Slovensky [Slovak] Suomi [Finnish] Svenska [Swedish] Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC. [Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE.
Industry Canada statement: This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence.
End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: VW3HILONC-3GPS” ”Contains IC: 9140A-HILONC-3GPS” The grantee's FCC ID/IC ID can be used only when all FCC/Canada compliance requirements are met.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peutfonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pourl'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectriqueà l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que lapuissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire àl'établissement d'une communication satisfaisante.
Declaration of Conformity We, Sagemcom SAS Address: 250 Route de l'Empereur, 92848 Rueil Malmaison Cedex France Declare under our own responsibility that the product: Model: HiLoNC-3GPS Intended use: Qual-Band GSM/GPRS/EDGE and Dual-Band WCDMA/HSDPA/HSUPA/HSPA+ Voice and Data Module Complies with the essential requirements of Article 3 of the R&TTE 1999/5/EC Directive, if used for its intended use and that the following standards have been applied: 1. Health (Article 3.
