User's Manual

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Note d’étude / Technical document : URDx– OTL 5635.1– 007 / 70 230 Edition 03
Document Sagem Communications Reproduction et divulgation interdites
Sagem Communications document. Reproduction and disclosure prohibited
Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
SOMMAIRE / CONTENTS
Direction des Recherches et des Développements Etablissement de VELIZY...............................................................1
NOTE D'ETUDE / TECHNICAL DOCUMENT................................................................................................................1
Direction des Recherches et des Développements Etablissement de VELIZY...............................................................2
NOTE D'ETUDE / TECHNICAL DOCUMENT................................................................................................................2
FICHE RECAPITULATIVE / SUMMARY SHEET .........................................................................................................2
SOMMAIRE / CONTENTS.................................................................................................................................................3
1. OVERVIEW...................................................................................................................................................................5
1.1 OBJECT OF THE DOCUMENT.........................................................................................................................5
1.1 REFERENCE DOCUMENTS.............................................................................................................................5
1.2 MODIFICATION OF THIS DOCUMENT ..........................................................................................................5
2. BLOCK DIAGRAM ......................................................................................................................................................6
3. FUNCTIONAL INTEGRATION ..................................................................................................................................6
3.1 HOW TO CONNECT TO A SIM CARD ............................................................................................................7
3.2 HOW TO CONNECT THE AUDIOS? ...............................................................................................................7
3.2.1 Connecting microphone and speaker .......................................................................................................7
3.2.2 Characteristics of the microphone and speaker recommended by Sagem communications ..........9
3.3 PWM ....................................................................................................................................................................10
3.3.1 PWM for LED..................................................................................................................................................10
3.3.2 PWM for Buzzer connection.........................................................................................................................10
3.4 POWER SUPPLY ..............................................................................................................................................10
3.5 EXAMPLE OF POWER SUPPLY....................................................................................................................12
3.5.1 Example 1 ...................................................................................................................................................12
3.5.2 Example 2 ...................................................................................................................................................12
3.6 V24.......................................................................................................................................................................13
3.6.1 Complete V24 – connection HiLo - host.................................................................................................13
3.6.2 Complete V24 interface with PC..............................................................................................................13
3.6.3 Partial V24 (RX-TX-RTS-CTS) – connection HiLo - host ....................................................................14
3.6.4 Partial V24 (RX-TX) – connection HiLo - host.......................................................................................14
3.7 SPI........................................................................................................................................................................15
3.8 GPIO ....................................................................................................................................................................15
3.9 BACKUP BATTERY ..........................................................................................................................................15
3.9.1 Backup battery function feature ...............................................................................................................15
3.9.2 Current consumption on the backup battery..........................................................................................16
3.9.3 Charge by internal HiLo charging function.............................................................................................16
3.9.4 Backup Battery technology recommended ............................................................................................16
3.10 HARDWARE POWER MANAGEMENT AND MULTIPLEXING INTERFACES .......................................17
3.11 STARTING THE MODULE...............................................................................................................................17
3.12 MODULE SWITCH OFF ...................................................................................................................................17
3.13 SLEEP MODE MANAGEMENT.......................................................................................................................18
4. MANDATORY POINTS FOR THE FINAL TESTS AND TUNING ........................................................................19
5. ESD & EMC RECOMMENDATIONS .......................................................................................................................19
5.1 STANDARD REQUIREMENTS.......................................................................................................................19
5.1.1 Analysis .......................................................................................................................................................19
5.1.2 Recommendations to avoid ESD issues ................................................................................................19
5.2 ESD FEATURES................................................................................................................................................20
6. RADIO INTEGRATION .............................................................................................................................................20
6.1 ANTENNA...........................................................................................................................................................20
6.2 GROUND LINK AREA ......................................................................................................................................21
6.3 LAYOUT ..............................................................................................................................................................21
6.4 MECHANICAL SURROUNDING.....................................................................................................................21
6.5 OTHER RECOMMENDATIONS – TESTS FOR PRODUCTION/DESIGN...............................................21
7. AUDIO INTEGRATION.............................................................................................................................................22
7.1 MECHANICAL INTEGRATION AND ACOUSTICS......................................................................................22
7.2 ELECTRONICS AND LAYOUT .......................................................................................................................22