User's Manual

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Note d’étude / Technical document : URDx– OTL 5635.1– 007 / 70 230 Edition 03
Document Sagem Communications Reproduction et divulgation interdites
Sagem Communications document. Reproduction and disclosure prohibited
4. MANDATORY POINTS FOR THE FINAL TESTS AND TUNING
The design of the main board (which the module is connected to) must provide an access to following signals
when the final product will be completely integrated.
To upgrade the module software, Sagem communications recommends providing a direct access to the module
serial link through an external connector or any mechanism allowing the upgrade of the module without opening
the whole product.
Serial link:
TXD Output UART transmit
RXD Input UART receive
5. ESD & EMC RECOMMENDATIONS
5.1 STANDARD REQUIREMENTS
Test levels:
Contact discharge Air discharge
Level Test voltage (kV) Level Test voltage (kV)
1 2 1 2
2 tbd 2 tbd
3 tbd 3 tbd
4 tbd 4 tbd
X
*
Special X
*
Special
* “X” is a level which has to be defined. This level is specified in the particular specification of the device. If
higher voltages as specified are needed, special testers have to be used.
Standard indicates that tests have to be done when module is in call with its charger. These tests consist to put
some ESD impulses of 8 kV maximum everywhere on the module. It mustn’t lose the call or other functions and
if one of them is lost, the module has to come back in its normal configuration without external action.
Classification of test results:
N°1: normal behaviour in specification limits
N°2: temporary degradation or function loss or auto-recoverable behaviour
N°3: temporary degradation or function loss or behaviour lost needing help of operator or a system reset
N°4: irreparable degradation or function loss due to failure of material (components), software or data loss
5.1.1 Analysis
ESD current can penetrate inside the device via the typical following components:
• SIM connector
• Microphone
• Speaker
• Battery / data connector
• All pieces with conductive paint (plastron, special keys, etc...)
Therefore, in order to avoid ESD issues, efforts shall be done to decrease the level of ESD current on electronic
components located inside the device (MMI board, input of the HiLo module, etc…)
5.1.2 Recommendations to avoid ESD issues
They can be summarized as below:
• Insure good ground connections of the HiLo module to the MMI board
• Flex (if any) shall be shielded and FPC connectors shall be correctly grounded at each extremity