User's Manual

HiLo3G-850 User Manual
04 March 2011 - Page 3 / 36
6.5 Other Recommendation—test for production/design ........................................................................................... 31
7. Audio Integration .......................................................................................................................................................... 31
7.1 Mechanical integration and acoustics ................................................................................................................... 31
7.2 Electronics and layout ........................................................................................................................................... 31
8. Recommendations on layout of customer‘s board ........................................................................................................ 32
8.1 General recommendations on layout .................................................................................................................... 32
8.1.1. Ground .......................................................................................................................................................... 32
8.1.1.1 Ground layout guidelines .................................................................................................................................. 32
8.1.1.2 Digital ground ................................................................................................................................................... 32
8.1.1.3 Analog/RF ground ............................................................................................................................................ 32
8.1.2 Power supplies .............................................................................................................................................. 32
8.1.3 Clocks ........................................................................................................................................................... 32
8.1.4 Data bus and other signals ............................................................................................................................ 32
8.1.5 Radio ............................................................................................................................................................. 33
8.1.6 Audio ............................................................................................................................................................ 33
8.1.7 Shielding ....................................................................................................................................................... 33
8.2 Example of layout for customer‘s board ............................................................................................................... 34
9. Label ............................................................................................................................................................................. 34
10. FCC/IC warning statement ....................................................................................................................................... 34
10.1 FCC Regulations: ................................................................................................................................................. 34
10.2 RF Exposure Information ..................................................................................................................................... 35
10.3 IC Regulations: ..................................................................................................................................................... 35