Technical information

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Proc Sheet 1 09

MyX-4

ELECTRONIC BOARD EXCHANGE

1/3

Ref. SCT U33 SM DTS 004– Index A - 29/03/01 Page 5-34

Preliminary operation

1. Control of the IMEI label integrity

2. Remove the electronic board (Proc sheet 1 04)

3. Control of any oxidation marks (on the electronic board and under the metal dome)

Return procedure :

(a) The electronic boards are packaged in individual electrostatic envelopes . They must be

stocked in their original package of reception , to insure a good protection against external

attacks (see enclosed photos)

(b) During the electronic boards manipulation , gloves and electrostatic strap must be worn at all

times.

in the original package (see enclosed photos) , in the appropriate ESD box : One box per

Sagem reference (check reference written on the box).

(d) The defective board should display the defect code written on a sticker (placed on the

shielding) and written on the ESD bag label too (printed with SMT).

Note :

− On the defective boards , it is necessary to check visually under the metal dome to

discover if it shows oxidation marks. The defective boards should be returned with their

original metal dome

− Boards with oxidation should not to set in conformance with the warranty

− The defective boards must never be mixed with the complete mobiles

Placement procedure :

1. Exchange the defective board with a functional board of the same Sagem reference (25M).

Further operations :

1. Place the new electronic board on the assembly plate. .(Proc sheet 1 04)

2. Replace the customer housing (Proc Sheet 0 01 & 0 03)

3. Follow stages ( see enclosed photos) and the SMT instructions (Proc sheet 01)