Technical information

Procedure
Proc 0 01
Proc 1 01
Proc 1 02
Proc 1 03
Proc 1 04
Proc 1 05
Proc 1 08
Proc 1 10
Proc 1 18
Proc 1 20
Proc 1 22
Proc 2 01
Proc 2 03
Proc 3 01
Proc 3 02
Proc 4 01
Symptom
Symp 01
Symp 02
Symp 03
Symp 04
Symp 05
Symp 06
Symp 07
Symp 08
Symp 10
Test
Test 01
Test 02
Test 03
Test 04
Test 05
Test 06

Proc Sheet 1 20
myC3-2
(TXLSSHGHOHFWURQLFERDUGH[FKDQJH
3/3
(OHFWURQLFERDUGH[FKDQJHSURFHVV
Detection of N3 defect : See
the Technical documentation
-Check oxidation under
the metal dome .
- Display test : Hot Line Menu
- Keypad test
- Vibrating device test
- See Technical
documentation (test sheet 05)
- Audio parameters
written on the new
swap board
- Follow return instructions
page 5-31
Mobile phone with deffect on
PCB
Shipment of defective
boards to SAGEM
Remove the defect
electronic board
Proc 1.08
Replace the electronic
swap board in the hanset
(Check the reference
25M)
Standard tests
Tests OK
wavetek tests
Tests OK
Check the assembly
Assembly
OK
YES
NO
YES
NO
NO
YES
Follow the SMT swap
instructions
YES
Back to customer
Contents REF MTB DTS 1- Indice D - November 10 2005 Page 5-21