Technical information

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Proc Sheet 1 20
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1. Control of the IMEI label integrity
2. Remove the equipped electronic board (3URFVKHHW)
3. Control of any oxidation marks (on the equipped electronic board and under the metal dome)
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(a) The equipped electronic boards are packaged in individual electrostatic envelopes. They must
be stocked in their original package of reception , to insure a good protection against external
attacks (see enclosed photos)
(b) During the equipped electronic boards manipulation , gloves and electrostatic strap must be
worn at all times.
(c)
The defective equipped electronic boards have to be returned to SAGEM factory, packaged
individually, in the original package (see enclosed photos) , in the appropriate ESD box : One box
per Sagem reference (check reference written on the box).
(d)
The defective board should display the defect code written on a sticker (placed on the
shielding) and written on the ESD bag label too (printed with SMT).
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1. Take a board in the stock of swap boards from the same Sagem reference.
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1. Place the new equipped electronic board on the assembly plate. .(3URFVKHHW)
2. Follow stages ( see enclosed photos)
Procedure
Proc 0 01
Proc 1 01
Proc 1 02
Proc 1 03
Proc 1 04
Proc 1 05
Proc 1 08
Proc 1 10
Proc 1 18
Proc 1 20
Proc 1 22
Proc 2 01
Proc 2 03
Proc 3 01
Proc 3 02
Proc 4 01
Symptom
Symp 01
Symp 02
Symp 03
Symp 04
Symp 05
Symp 06
Symp 07
Symp 08
Symp 10
Test
Test 01
Test 02
Test 03
Test 04
Test 05
Test 06
Contents REF MTB DTS 1- Indice D - November 10 2005 Page 5-19