Technical information

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Proc Sheet 2 08

myC-1

ELECTRONIC BOARD EXCHANGE

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Ref. SCT U38 SSC DTS 0016 - Index A – May 6, 2004 Page 5-40

6.68 Preliminary operation

1. Control of the IMEI label integrity

2. Remove the electronic board (Proc sheet 2 06)

3. Control of any oxidation marks (on the electronic board and under the metal dome)

6.69 Return procedure :

(a) The electronic boards are packaged in individual electrostatic envelopes. They must be

stocked in their original package of reception , to insure a good protection against external

attacks (see enclosed photos)

(b) During the electronic boards manipulation , gloves and electrostatic strap must be worn at all

times.

in the original package (see enclosed photos) , in the appropriate ESD box : One box per

Sagem reference (check reference written on the box).

(d) The defective board should display the defect code written on a sticker (placed on the

shielding) and written on the ESD bag label too (printed with SMT).

Note :

On the defective boards , it is necessary to check visually under the metal dome to discover

if it shows oxidation marks. The defective boards should be returned with their original

metal dome

Boards with oxidation should not to set in conformance with the warranty

The defective boards must never be mixed with the complete mobiles

6.70 Placement procedure :

1. Take a board in the stock of swap boards from the same Sagem reference.

6.71 Further operations :

1. Place the new electronic board.(Proc sheet 2 06)

2. Follow stages ( see enclosed photos)